AC SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| package instruction | DIP, DIP14,.3 |
| Reach Compliance Code | unknown |
| series | AC |
| JESD-30 code | R-GDIP-T14 |
| JESD-609 code | e0 |
| length | 19.43 mm |
| Load capacitance (CL) | 50 pF |
| Logic integrated circuit type | INVERTER |
| MaximumI(ol) | 0.012 A |
| Number of functions | 6 |
| Number of entries | 1 |
| Number of terminals | 14 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP14,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| power supply | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 16 ns |
| propagation delay (tpd) | 16 ns |
| Certification status | Not Qualified |
| Schmitt trigger | YES |
| Maximum seat height | 5.08 mm |
| Maximum supply voltage (Vsup) | 6 V |
| Minimum supply voltage (Vsup) | 2 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 7.62 mm |
| Base Number Matches | 1 |
| 54AC14DM | 54AC14LM | 54AC14FM | |
|---|---|---|---|
| Description | AC SERIES, HEX 1-INPUT INVERT GATE, CDIP14, CERAMIC, DIP-14 | AC SERIES, HEX 1-INPUT INVERT GATE, CQCC20, CERAMIC, LCC-20 | AC SERIES, HEX 1-INPUT INVERT GATE, CDFP14, CERAMIC, DFP-14 |
| package instruction | DIP, DIP14,.3 | QCCN, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown |
| series | AC | AC | AC |
| JESD-30 code | R-GDIP-T14 | S-CQCC-N20 | R-GDFP-F14 |
| Load capacitance (CL) | 50 pF | 50 pF | 50 pF |
| Logic integrated circuit type | INVERTER | INVERTER | INVERTER |
| Number of functions | 6 | 6 | 6 |
| Number of entries | 1 | 1 | 1 |
| Number of terminals | 14 | 20 | 14 |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP | QCCN | DFP |
| Package shape | RECTANGULAR | SQUARE | RECTANGULAR |
| Package form | IN-LINE | CHIP CARRIER | FLATPACK |
| propagation delay (tpd) | 16 ns | 16 ns | 16 ns |
| Certification status | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.08 mm | 1.905 mm | 2.032 mm |
| Maximum supply voltage (Vsup) | 6 V | 6 V | 6 V |
| Minimum supply voltage (Vsup) | 2 V | 2 V | 2 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | YES | YES |
| technology | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY |
| Terminal form | THROUGH-HOLE | NO LEAD | FLAT |
| Terminal pitch | 2.54 mm | 1.27 mm | 1.27 mm |
| Terminal location | DUAL | QUAD | DUAL |
| width | 7.62 mm | 8.89 mm | 6.2865 mm |
| Base Number Matches | 1 | 1 | 1 |
| length | 19.43 mm | 8.89 mm | - |