DS1073M-80 datasheet, PDF - EEWORLD Datasheet

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DS1073M-80: DescriptionIC osc dual FX freq 80mhz 8-dip; Categorysemiconductor Analog mixed-signal IC; File Size258KB，18 Pages; ManufacturerMaxim; Websitehttps://www.maximintegrated.com/en.html

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DS1073M-80 Overview

IC osc dual FX freq 80mhz 8-dip

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DS1073

3V EconOscillator/Divider

www.maxim-ic.com

FEATURES

Dual fixed-frequency outputs (30kHz to

100MHz)

User-programmable on-chip dividers (from 1

to 513)

User-programmable on-chip prescaler (1, 2,

No external components

±0.5%

initial tolerance (commercial)

±1%

variation over commercial temperature

and voltage

Internal clock, external clock or crystal

reference options

2.7 to 3.6V supply

Power-down mode

Synchronous output gating

Industrial temp operation with relaxed

specifications

PIN ASSIGNMENT

I/O

OUT0

GND

OSCIN

XTAL

PDN/SELX

DS1073Z-XXX 150-mil SOIC

DS1073M-XXX 300-mil DIP

XXX = Frequency option

FREQUENCY OPTIONS

Part No.

DS1073M/Z-100

DS1073M/Z-80

DS1073M/Z-66

DS1073M/Z-60

Max O/P Freq.

100.000MHz

80.000MHz

66.667MHz

60.000MHz

DESCRIPTION

The DS1073 is a fixed-frequency oscillator requiring no external components for operation. Numerous

operating frequencies are possible in the range of approximately 27.3kHz to 100MHz through the use of

an on-chip programmable prescaler and divider.

The DS1073 features a master oscillator followed by a prescaler and then a programmable divider. The

prescaler and programmable divider are user-programmable with the desired values being stored in non-

volatile memory. This allows the user to buy an off the shelf component and program it on site prior to

board production. Design changes can be accommodated on the fly by simply programming different

values into the device (or reprogramming previously programmed devices).

The DS1073 is shipped from the factory configured for half the maximum operating frequency. Contact

the factory for specially programmed devices. As alternatives to the onboard oscillator an external clock

signal or a crystal may be used as a reference. The choice of reference source (internal or external) is

user-selectable at the time of programming (or on the fly if the SEL mode is chosen).

The DS1073 features a dual-purpose I/O pin. If the device is powered up in Program mode this pin can be

used to input serial data to the on chip registers. After a Write command this data is stored in non-volatile

memory. When the chip is subsequently powered up in operating mode these values are automatically

restored to the on-chip registers and the I/O pin becomes the oscillator output.

The DS1073 may be operated over either the commercial (T

= 0C to 70C) or industrial (T

= -40C to +

85C) temperature ranges. AC and DC Electrical Characteristics Tables for operation in both these

temperature ranges are given at the end of the data sheet.

1 of 18

090503

DS1073

PIN DESCRIPTIONS

IN/OUT Pin (I/O):

This pin is the main oscillator output, with a frequency determined by clock

reference, M and N dividers. Except in programming mode this pin is always an output. In programming

mode this pin is an input and output.

External Oscillator Input (OSCIN):

This pin can be used to supply an external reference frequency to

the device.

Crystal Oscillator Connection (XTAL):

A crystal can be connected between this pin and OSCIN to

provide an alternative frequency reference. The crystal must be used in fundamental mode. If a crystal is

not used this pin should be left open.

Output Enable Function (OE pin):

The DS1073 also features a “synchronous” output enable. When

OE is at a high logic level the oscillator free runs. When this pin is taken low OUT is held low,

immediately if OUT is already low, or at its next high-to-low transition if OUT is high. This prevents any

possible truncation of the output pulse width when the enable is used. While the output is disabled the

master oscillator continues to run (producing an output at OUT0, if the

EN0

bit = 0) but the internal

counters (/N) are reset. This results in a constant phase relationship between OE’s return to a high level

and the resulting OUT signal. When the enable is released OUT will make its first transition within one

to two clock periods of the master clock.

Power-Down/Select Function (

PDN

SELX

pin):

The Power-Down/Select (

PDN

SELX

) pin has a user-

selectable function determined by one bit (PDN bit) of the user-programmable memory. According to

which function is selected, this pin will be referred to as

PDN

SELX

If the Power-Down function is selected (PDN bit = 1) a low logic level on this pin can be used to make

the device stop oscillating (active low) and go into a reduced power consumption state. The “Enabling

Sequencer” circuitry will first disable OUT in the same way as when OE is used. Next OUT0 will be

disabled in a similar fashion. Finally the oscillator circuitry will be disabled. In this mode both outputs

will go into a high-impedance state.

The power consumption in the power-down state is much less than if OE is used because the internal

oscillator (if used) is completely powered down. Even if an external reference or a crystal is used all of

the on-chip buffers are powered down to minimize current drain. Consequently the device will take

considerably longer to recover (i.e., achieve stable oscillation) from a power-down condition than if the

OE is used.

If the Select function is chosen (PDN bit = 0) this pin can be used to switch between the internal

oscillator and an external reference (or crystal) on the fly. When this mode is chosen the E/

select bit is

overridden, a high logic level on

SELX

will select the internal oscillator, a low logic level will select the

external reference (or crystal oscillator).

Reference Output (OUT0 pin):

A reference output, OUT0, is also available from the output of the

reference select mux. This output is especially useful as a buffered output of a crystal defined master

frequency. OUT0 is unaffected by the OE pin, but is disabled in a glitchless fashion if the device is

powered down. If this output is not required it can be permanently disabled by setting the

EN0

bit to 1,

and there will be a corresponding reduction in overall power consumption.

3 of 18

DS1073M-80 Related Products

	DS1073M-80	DS1073M-66	DS1073Z-80	DS1073Z-60	DS1073Z-100	DS1073Z-66	DS1073M-60	DS1073M-100
Description	IC osc dual FX freq 80mhz 8-dip	IC osc DL FX freq 66.667mhz 8dip	IC osc dual FX freq 80mhz 8-soic	IC osc dual FX freq 60mhz 8-soic	IC osc DL FX freq 100mhz 8-soic	IC osc DL FX freq 66.66mhz 8soic	IC osc dual FX freq 60mhz 8-dip	IC osc dual FX freq 100mhz 8-dip
Is it Rohs certified?	-	incompatible	incompatible	incompatible	incompatible	incompatible	-	-
Parts packaging code	-	DIP	SOIC	SOIC	SOIC	SOIC	-	-
package instruction	-	0.300 INCH, DIP-8	0.150 INCH, SOIC-8	0.150 INCH, SOIC-8	0.150 INCH, SOIC-8	0.150 INCH, SOIC-8	-	-
Contacts	-	8	8	8	8	8	-	-
Reach Compliance Code	-	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	-	-
JESD-30 code	-	R-PDIP-T8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	R-PDSO-G8	-	-
JESD-609 code	-	e0	e0	e0	e0	e0	-	-
length	-	9.375 mm	4.9 mm	4.9 mm	4.9 mm	4.9 mm	-	-
Number of terminals	-	8	8	8	8	8	-	-
Maximum operating temperature	-	70 °C	70 °C	70 °C	70 °C	70 °C	-	-
Package body material	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	-	-
encapsulated code	-	DIP	SOP	SOP	SOP	SOP	-	-
Package shape	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	-	-
Package form	-	IN-LINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	-	-
Peak Reflow Temperature (Celsius)	-	245	245	245	245	245	-	-
Certification status	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	-	-
Maximum seat height	-	4.572 mm	1.75 mm	1.75 mm	1.75 mm	1.75 mm	-	-
Maximum supply voltage	-	3.6 V	3.6 V	3.6 V	3.6 V	3.6 V	-	-
Minimum supply voltage	-	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	-	-
Nominal supply voltage	-	3 V	3 V	3 V	3 V	3 V	-	-
surface mount	-	NO	YES	YES	YES	YES	-	-
technology	-	CMOS	CMOS	CMOS	CMOS	CMOS	-	-
Temperature level	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	-	-
Terminal surface	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-
Terminal form	-	THROUGH-HOLE	GULL WING	GULL WING	GULL WING	GULL WING	-	-
Terminal pitch	-	2.54 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	-
Terminal location	-	DUAL	DUAL	DUAL	DUAL	DUAL	-	-
Maximum time at peak reflow temperature	-	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	-	-
width	-	7.62 mm	3.9 mm	3.9 mm	3.9 mm	3.9 mm	-	-
uPs/uCs/peripheral integrated circuit type	-	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	MICROPROCESSOR CIRCUIT	-	-

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