M55342M12C130ER-W datasheet, PDF

Datasheet> All Categories > Passive components> The resistor> M55342M12C130ER-W

M55342M12C130ER-W: DescriptionFixed Resistor, Metal Glaze/thick Film, 0.1W, 130000ohm, 50V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 0603, CHIP; CategoryPassive components The resistor; File Size150KB，1 Pages; ManufacturerState of the Art Inc.; Environmental Compliance

Download Datasheet Parametric View All

M55342M12C130ER-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 130000ohm, 50V, 1% +/-Tol, 300ppm/Cel, Surface Mount, 0603, CHIP

M55342M12C130ER-W Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	1916024353
package instruction	CHIP
Reach Compliance Code	compliant
Country Of Origin	USA
YTEOL	9.8
structure	Chip
JESD-609 code	e4
Installation features	SURFACE MOUNT
Number of terminals	2
Maximum operating temperature	150 °C
Minimum operating temperature	-65 °C
Package height	0.46 mm
Package length	1.58 mm
Package shape	RECTANGULAR PACKAGE
Package form	SMT
Package width	0.81 mm
method of packing	WAFFLE PACK
Rated power dissipation(P)	0.1 W
Rated temperature	70 °C
Guideline	MIL-PRF-55342
resistance	130000 Ω
Resistor type	FIXED RESISTOR
size code	0603
surface mount	YES
technology	METAL GLAZE/THICK FILM
Temperature Coefficient	300 ppm/°C
Terminal surface	Palladium/Silver (Pd/Ag)
Terminal shape	WRAPAROUND
Tolerance	1%
Operating Voltage	50 V

Preview

Download Datasheet

View All

State of the Art, Inc.

Thick Film Chip Resistor

M55342/12 RM0603

GLASS

PASSIVATION

WRAPAROUND

TERMINATIONS

RESISTOR

FILM

96% ALUMINA CHIP

PERFORMANCE

TEMPERATURE RISE (°C)

Resistance Range

Tolerances

Maximum Power

Maximum Voltage

- 22M

1%, 2%, 5%, 10%

100 mW

50 Volts

CHARACTERISTICS*

±100

±0.5%

±0.25%

±0.5%

±300

±0.5%

±0.25%

±0.5%

±2.0%

±1.0%

POWER DISSIPATION

fiber epoxy board

ceramic board

TESTS

TCR (-55 to +125

C) in ppm/

Thermal Shock

Low Temperature Operation

Short-time Overload

Resistance to Soldering Heat

Moisture Resistance

Life, 2,000 Hours

High Temperature Exposure

POWER DISSIPATION (WATTS)

LIFE TEST

POWER DERATING

*Maximum allowable change per MIL-PRF-55342,

typical change is 10% of these values.

PART NUMBERING

M55342 K 12 B 100D S - TR

PACKAGING CODE: TR = Tape & Reel W= Waffle Pack

PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER

RESISTANCE AND TOLERANCE CODE:

Three significant digits, with a letter indicating the

decimal location, the tolerance, and the value range.

D: 1%

E: 1% K

F: 1% M

G: 2%

H: 2% K

T: 2% M

J: 5%

K: 5% K

L: 5% M

M: 10%

N: 10% K

P: 10% M

TERMINATION MATERIALS:

B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound

W: Gold wire bondable

G: Gold wraparound

SIZE CODE: /12 = RM0603

TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm

PERFORMANCE SPECIFICATION MIL-PRF-55342

MECHANICAL

INCHES

MILLIMETERS

.092

MINIMUM

RECOMMENDED

MOUNTING

PADS

(INCHES)

Length

Width

Thickness

Top Term

Bottom Term

Gap

Approx. Weight

.062 (.058 - .070)

.032 (.027 - .037)

.018 (.010 - .033)

.010 (.007 - .017)

.014 (.010 - .020)

.034 (.030 - .038)

.00235 grams

1.58

0.81

0.46

0.25

0.36

0.86

(1.47 - 1.78)

(0.69 - 0.94)

(0.25 - 0.84)

(0.18 - 0.43)

(0.25 - 0.51)

(0.76 - 0.97)

.034

.030

.031

State of the Art, Inc.

2470 Fox Hill Road, State College, PA 16803-1797

Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401

“Specifications subject to change without notice.”

www.resistor.com

04/09/08

Recommended Resources

Functional block diagram of Hisense KFR-25GW-06BP inverter air conditioner outdoor unit microprocessor

Use FR-FG and FR-AL to realize synchronous operation circuit of multiple motors

Light controlled automatic trench light circuit

Sensor voltage and current conversion circuit

New digital echo reverberation circuit

Computer motherboard circuit diagram 830_48

How to estimate the time to store data in RAM to external FLASH?: Dear experts, please tell me how to estimate the time to store data in RAM to external FLASH? Thank you!...; songhaifei Microcontroller MCU

LM3S9B95 debugging error: 0x000000F0, target byte: 0xF1, byte in file: 0xD9 Sun Jul 17 19:04:27 2011: Warning:Verify error at address 0x000000ED, target byte: 0x0D, byte in file: 0x06 Sun Jul 17 19:04:27 2011: Warning:Verify e...; zw357234798 Microcontroller MCU

Which platform is better for developing GIS under Windows?: esupermap is an object component, arcpad is not. It needs to be customized with scripting language. Can anyone with experience tell me which one is easier to use? I'm just doing a graduation project....; 国强 Embedded System

Design of a new type of IGBT short-circuit protection circuit: A method for directly detecting short-circuit faults of IGBTs is proposed. Based on a detailed analysis of the IGBT short-circuit detection principle, a corresponding IGBT short-circuit protection cir...; fighting Analog electronics

Is it possible for two devices to communicate using analog I2C at the same time?: There are two devices, one is OLED and the other is clock chip. Both devices communicate with the microcontroller through analog I2C. Is there any conflict? For the design in the program, for example,...; emily_1105 MCU

Top 10 Tips for Embedded Software Testing: In the process of embedded software development, generally speaking, the time spent on testing and coding is 3:1 (maybe more in fact). This ratio will continue to decrease as your programming and test...; gtt Embedded System

Shortcut: A0 A1 A2 A3 A4 A5 A6 A7 A8 A9 AA AB AC AD AE AF AG AH AI AJ AK AL AM AN AO AP AQ AR AS AT AU AV AW AX AY AZ B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 BA BB BC BD BE BF BG BH BI BJ BK BL BM BN BO BP BQ BR BS BT BU BV BW BX BY BZ C0 C1 C2 C3 C4 C5 C6 C7 C8 C9 CA CB CC CD CE CF CG CH CI CJ CK CL CM CN CO CP CQ CR CS CT CU CV CW CX CY CZ D0 D1 D2 D3 D4 D5 D6 D7 D8 D9 DA DB DC DD DE DF DG DH DI DJ DK DL DM DN DO DP DQ DR DS DT DU DV DW DX DZ

Popular Components