Integrated Device Technology, Inc. reserves the right to make changes to its products or specifications at any time, without notice, in order to improve design or performance
and to supply the best possible product. IDT does not assume any responsibility for use of any circuitry described other than the circuitry embodied in an IDT product. The
Company makes no representations that circuitry described herein is free from patent infringement or other rights of third parties which may result from its use. No license is
granted by implication or otherwise under any patent, patent rights or other rights, of Integrated Device Technology, Inc.
CODE DISCLAIMER
Code examples provided by IDT are for illustrative purposes only and should not be relied upon for developing applications. Any use of the code examples below is completely
at your own risk. IDT MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND CONCERNING THE NONINFRINGEMENT, QUALITY, SAFETY OR SUITABILITY
OF THE CODE, EITHER EXPRESS OR IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICU-
LAR PURPOSE, OR NON-INFRINGEMENT. FURTHER, IDT MAKES NO REPRESENTATIONS OR WARRANTIES AS TO THE TRUTH, ACCURACY OR COMPLETENESS
OF ANY STATEMENTS, INFORMATION OR MATERIALS CONCERNING CODE EXAMPLES CONTAINED IN ANY IDT PUBLICATION OR PUBLIC DISCLOSURE OR
THAT IS CONTAINED ON ANY IDT INTERNET SITE. IN NO EVENT WILL IDT BE LIABLE FOR ANY DIRECT, CONSEQUENTIAL, INCIDENTAL, INDIRECT, PUNITIVE OR
SPECIAL DAMAGES, HOWEVER THEY MAY ARISE, AND EVEN IF IDT HAS BEEN PREVIOUSLY ADVISED ABOUT THE POSSIBILITY OF SUCH DAMAGES. The code
examples also may be subject to United States export control laws and may be subject to the export or import laws of other countries and it is your responsibility to comply with
any applicable laws or regulations.
LIFE SUPPORT POLICY
Integrated Device Technology's products are not authorized for use as critical components in life support devices or systems unless a specific written agreement pertaining to
such intended use is executed between the manufacturer and an officer of IDT.
1. Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform,
when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user.
2. A critical component is any components of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device
or system, or to affect its safety or effectiveness.
IDT, the IDT logo, and Integrated Device Technology are trademarks or registered trademarks of Integrated Device Technology, Inc.
About This Manual
®
Notes
Overview
This user manual includes hardware and software information on the 89HPES16NT16G2, a member of
IDT’s PRECISE™ family of PCI Express® switching solutions offering the next-generation I/O interconnect
standard.
Finding Additional Information
Information not included in this manual such as mechanicals, package pin-outs, and electrical character-
istics can be found in the data sheet for this device, which is available from the IDT website
(www.idt.com)
as well as through your local IDT sales representative.
Content Summary
Chapter 1, “PES16NT16G2 Device Overview,”
provides an introduction to the performance capabili-
ties of the 89HPES16NT16G2 and a high level architectural overview of the device.
Chapter 2, “Clocking,”
provides a description of the PES16NT16G2 clocking architecture.
Chapter 3, “Reset and Initialization,”
describes the PES16NT16G2 reset operations and initialization
procedure.
Chapter 4, “Switch Core,”
provides a description of the PES16NT16G2 switch core.
Chapter 5, “Switch Partitions,”
describes how the PES16NT16G2 supports up to 4 active switch parti-
tions.
Chapter 6, “Failover,”
provides a description of the flexible failover mechanism that allows the
construction of highly-available systems.
Chapter 7, “Link Operation,”
describes the operation of the link feature including polarity inversion,
link width negotiation, and lane reversal.
Chapter 8, “SerDes,”
describes basic functionality and controllability associated with the Serialiazer-
Deserializer (SerDes) block in PES16NT16G2 ports.
Chapter 9, “Power Management,”
describes the power management capability structure located in the
configuration space of each PCI-to-PCI bridge in the PES16NT16G2.
Chapter 10, “Transparent Operation,”
describes the device-specific architectural features for the
transparent switch associated with each PES16NT16G2 partition (i.e., the PCI-to-PCI bridge functions and
their interaction in the switch).
Chapter 11, “Hot-Plug and Hot-Swap,”
describes the behavior of the hot-plug and hot-swap features
in the PES16NT16G2.
Chapter 12, “SMBus Interfaces,”
describes the operation of the 2 SMBus interfaces on the
PES16NT16G2.
Chapter 13, “General Purpose I/O,”
describes how the 9 General Purpose I/O (GPIO) pins may be
individually configured as general purpose inputs, general purpose outputs, or alternate functions.
Chapter 14, “Non-Transparent Operation,”
describes how a non-transparent bridge in the
PES16NT16G2 allows two roots or PCI Express trees (i.e., hierarchies) to be interconnected with one or
more shared address windows between them.
Chapter 15, “DMA Controller,”
describes how the PES16NT16G2 supports two direct memory access
controller (DMA) functions.
PES16NT16G2 User Manual
1
July 10, 2013
IDT
Notes
Chapter 16, “Switch Events,”
describes mechanisms provided by the PES16NT16G2 to facilitate
communication between roots associated with different partitions as well as for communication between
these roots and a management agent.
Chapter 17, “Multicast,”
describes how the multicast capability enables a single TLP to be forwarded
to multiple destinations.
\Chapter 18, “Temperature Sensor,”
provides a description of the on-chip temperature sensor with
three programmable temperature thresholds and a temperature history capability.
Chapter 19 “Register Organization,”
describes the organization of all the software visible registers in
the PES16NT16G2 and provides the address space for those registers.
Chapter 20, “PCI to PCI Bridge and Proprietary Port Specific Registers,”
lists the Type 1 configura-
tion header registers in the PES16NT16G2 and provides a description of each bit in those registers.
Chapter 21, “Proprietary Registers,”
lists the proprietary registers in the PES16NT16G2 and provides
a description of each bit in those registers.
Chapter 22, “NT Endpoint Registers,”
lists the NT Endpoint registers in the PES16NT16G2 and
provides a description of each bit in those registers.
Chapter 23, “DMA Registers,”
lists the DMA registers in the PES16NT16G2 and provides a descrip-
tion of each bit in those registers.
Chapter 24, “Switch Control Registers,”
lists the switch control and status registers in the
PES16NT16G2 and provides a description of each bit in those registers.
Chapter 25, “JTAG Boundary Scan,”
discusses an enhanced JTAG interface, including a system logic
TAP controller, signal definitions, a test data register, an instruction register, and usage considerations.
Chapter 26, “Usage Models,”
describes possible configurations of the PES16NT16G2 switch and
presents some important system usage models.
Signal Nomenclature
To avoid confusion when dealing with a mixture of “active-low” and “active-high” signals, the terms
assertion and negation are used. The term assert or assertion is used to indicate that a signal is active or
true, independent of whether that level is represented by a high or low voltage. The term negate or negation
is used to indicate that a signal is inactive or false.
To define the active polarity of a signal, a suffix will be used. Signals ending with an ‘N’ should be inter-
preted as being active, or asserted, when at a logic zero (low) level. All other signals (including clocks,
buses and select lines) will be interpreted as being active, or asserted when at a logic one (high) level.
To define buses, the most significant bit (MSB) will be on the left and least significant bit (LSB) will be on
the right. No leading zeros will be included.
Throughout this manual, when describing signal transitions, the following terminology is used. Rising
edge indicates a low-to-high (0 to 1) transition. Falling edge indicates a high-to-low (1 to 0) transition. These
terms are illustrated in Figure 1.
PES16NT16G2 User Manual
2
July 10, 2013
IDT
Notes
single clock cycle
1
2
3
4
high-to-low
transition
low-to-high
transition
Figure 1 Signal Transitions
Numeric Representations
To represent numerical values, either decimal, binary, or hexadecimal formats will be used. The binary
format is as follows: 0bDDD, where “D” represents either 0 or 1; the hexadecimal format is as follows:
0xDD, where “D” represents the hexadecimal digit(s); otherwise, it is decimal.
The compressed notation ABC[x|y|z]D refers to ABCxD, ABCyD, and ABCzD.
The compressed notation ABC[y:x]D refers to ABCxD, ABC(x+1)D, ABC(x+2)D,... ABCyD.
Data Units
The following data unit terminology is used in this document.
Term
Byte
Word
Doubleword (DWord)
Quadword (QWord)
Words
1/2
1
2
4
Bytes
1
2
4
8
Bits
8
16
32
64
Table 1 Data Unit Terminology
In quadwords, bit 63 is always the most significant bit and bit 0 is the least significant bit. In double-
words, bit 31 is always the most significant bit and bit 0 is the least significant bit. In words, bit 15 is always
the most significant bit and bit 0 is the least significant bit. In bytes, bit 7 is always the most significant bit
and bit 0 is the least significant bit.
The ordering of bytes within words is referred to as either “big endian” or “little endian.” Big endian
systems label byte zero as the most significant (leftmost) byte of a word. Little endian systems label byte
zero as the least significant (rightmost) byte of a word. See Figure 2.
In the actual process of electronic product design and debugging, we often have such questions: Why does the MOS tube break down due to static electricity? Does static electricity breakdown mean that ...
Hello everyone! I recently encountered a problem. I used a microcontroller to generate a square wave with a frequency of 6.78MHZ, the kind with an offset. The square wave waveform is slightly flawed b...
The new house is equipped with an aluminum alloy sliding door, and I finally have the opportunity to design an automatic door for myself. The human body detection part uses the transmission and recept...
[size=4][b]Solved, see the solution summary on the 21st floor[/b][/size]:) Please help me, I connected the J-Link to the kit, and then used Keil to download the program. But it cannot be downloaded. T...
The TIA Portal software's shift instructions shift the contents of an accumulator bit by bit to the left or right. The number of bits shifted is determined by N. A left shift of N bits multiplies t...[Details]
According to foreign media reports, Ford Motor has applied to the U.S. Patent and Social Security Administration (USPTO) for a patent for a remote vehicle control system that may be used in future ...[Details]
On August 24th, Jin Yuzhi, CEO of Huawei's Intelligent Automotive Solutions BU, announced the first automotive application of Huawei Qiankun's unique Limera technology. This technology eliminates t...[Details]
Tesla and BYD, vying for dominance in the global electric vehicle market, are reportedly considering adopting Samsung's AMOLED (active-matrix organic light-emitting diode) technology for their next...[Details]
Is electromagnetic radiation from electric vehicles harmful to the human body? Recently, the issue of electromagnetic radiation from electric vehicles has garnered widespread attention. However, pu...[Details]
introduction
With the development of digital and network technologies, broadcasting technology has become increasingly diversified, with the most significant trend being the transition from an...[Details]
Electric motors and internal combustion engines of the same power have similar torque levels. High power requires high torque, and torque determines a vehicle's acceleration speed, commonly known a...[Details]
On August 25th, Apple's expansion in India encountered new troubles. According to Bloomberg, Foxconn Technology Group has recalled approximately 300 Chinese engineers from India, further hindering ...[Details]
With the rapid adoption of smart electric vehicles, automotive chips are evolving from auxiliary control units to the foundation of the entire vehicle's intelligence. Their applications extend from...[Details]
Laird Thermal Systems has introduced the HiTemp ET series Peltier cooler modules, which can operate at high temperatures and provide on-site cooling for sensitive electronic devices.
Dig...[Details]
Electric vehicles are becoming increasingly popular, with increasingly longer ranges. There are two ways to charge electric vehicles: slow charging and fast charging. Which is the most suitable? Sl...[Details]
In the electronics manufacturing industry, surface mount technology (SMT) placement machines are core equipment for production lines. However, with many different models available on the market, ch...[Details]
With the advancement of science and technology and the promotion of green, energy-saving, and circular development, the demand for precise control and accurate measurement is increasing. In the pow...[Details]
Batteries, at the core of new energy vehicles, are crucial to vehicle performance and range. Existing automotive batteries are categorized into lead-acid and lithium batteries. Currently, new energ...[Details]
With the support and encouragement of national policies, some Internet car manufacturers have also joined the new energy vehicle manufacturing industry. From the perspective of new car manufacturer...[Details]
MCU
京公网安备 11010802033920号
EEWORLD
