I transplanted a TCPMP program to WinCE, but the video playback is very stuck. I converted the resolution of the source to 320*240 and it is no longer stuck. What is the reason? Is there any way to so...
After doing a lot of embedded systems, I instinctively consider the richness of a chip's peripherals, so I want to investigate the peripheral performance of the Tuya chip in my hand. So I proposed a t...
RTDX tests DSP Target to transfer data to PC: a) Create a project, edit the source code (.c/.asm), add header files (.h), library files (.lib) and link command files (.cmd) b) Add and modify the RTDX ...
Recently, Texas Instruments (TI) announced that its TMS320F280xx digital signal controller family for motor control, digital power conversion and intelligent sensor control applications has added four...
Bourns introduces a new series of thermal jumper chips that achieve high-efficiency heat dissipation in a compact size. The Bourns®
BTJ
series of thermal jumper chips features high thermal ...[Details]
January 13, 2026, Tessendloh-Ham, Belgium –
Melexis, a global microelectronics engineering company, announced that its innovative MLX91299 silicon-based RC buffer has been selected by Leapers, ...[Details]
On January 12, it was announced that Xiaomi will release its self-developed chip, Xuanjie O1, in Beijing in May 2025, marking a major breakthrough for Xiaomi in the research and development of 3nm ...[Details]
According to foreign media reports, at the Consumer Electronics Show 2026 (CES 2026) in Las Vegas, USA, Prologium Technology, a solid-state battery developer and manufacturer, and FEV Group, a mobi...[Details]
As we approach the end of 2025, the automotive industry is undergoing a transformation unlike any other in a century. Electrification has only swept through the first half of the game, while the se...[Details]
On December 18th, aiMotive, an AI and autonomous driving software developer, will collaborate with LG to launch its next-generation High Performance Computing (HPC) Lite platform at CES 2026. This ...[Details]
Moore Threads MUSA Developer Conference: Unveiling several key technological achievements, including a new architecture and 10,000-card training system, accelerating the construction of a domesti...[Details]
With the rapid development of automotive electronics, its complexity has also increased explosively. To compare the advantages and disadvantages of different electronic and electrical archi...[Details]
The NXP Innovation Technology Summit (Shenzhen) recently concluded successfully. This summit focused on cutting-edge technologies in industrial and IoT, and automotive electronics, bringing togethe...[Details]
According to a Bloomberg report on December 25th, Beijing time, Nvidia has agreed to a licensing agreement with AI chip startup Groq, further increasing its investment in companies related to the A...[Details]
Abstract:
Wiring harnesses are crucial automotive components, representing the traditional, bulky, yet indispensable neural network of a vehicle. Facing entirely new vehicle models and archit...[Details]
Industry Trends
Power over Ethernet (PoE) technology simplifies deployment by eliminating the need for a separate power cable—reducing costs and speeding up installation. I...[Details]
On December 31, industry media Digitimes reported yesterday (December 30) that major memory suppliers such as Samsung and SK Hynix have begun to "select" customers, prioritizing long-term supply to...[Details]
The top ten international news stories in the industry in 2025: a retrospective of the year's technological advancements and setbacks, shifts in the industry landscape, and the rise of China. Learn...[Details]
On January 4, it was reported that a research team from Xi'an Jiaotong University (Xi'an Jiaotong University) successfully overcame the key challenge of short cycle life caused by the "mismatch" be...[Details]