PC815 Serise
PC815 Series
..
s
Features
High Sensitivity, High Density
Mounting Type Photocoupler
s
Applications
g
Lead forming type ( I type ) and taping reel type ( P type ) are also available. (
PC815I/PC815P
)
gg
TUV ( VDE0884 ) approved type is also available as an option.
1. High current transfer ratio
1. System appliances, measuring instruments
( CTR: MIN. 600% at I
F
= 1mA, V
CE
= 2V)
2. Industrial robots
2. High isolation voltage between input and
3. Copiers, automatic vending machines
output
4. Signal transmission between circuits of
( V
iso
: 5 000V
rms
)
different potentials and impedances
3. Compact dual-in-line package
PC815
: 1-channel type
PC825
: 2-channel type
PC835
: 3-channel type
PC845
: 4-channel type
4. Recognized by UL file No. E64380
s
Outline Dimensions
Anode mark
Anode mark
( Unit : mm )
Internal connection diagram
4
3
1
2
3
4
Anode
Cathode
Emitter
Collector
PC815
PC825
2.54
±
0.25
4
PC815
3
6.5
±
0.5
2.54
±
0.25
8
7
PC815
6
5
PC815
6.5
±
0.5
Internal connection
diagram
8 7
6 5
1
2
0.9
±
0.2
1.2
±
0.3
1
2
1
2 3 4
0.9
±
0.2
1.2
±
0.3
9.66
±
0.5
2.7
±
0.5
1
2
3
4
1
2
5
6
3
4
7
8
Anode
Cathode
Emitter
Collector
0.5
TYP.
3.5
±
0.5
2.7
±
0.5
0.5
TYP.
3.5
±
0.5
4.58
±
0.5
7.62
±
0.3
7.62
±
0.3
3.0
±
0.5
3.0
±
0.5
0.26
±
0.1
0.5
±
0.1
θ
θ
=
0 to 13
˚
θ
0.26
±
0.1
θ
θ
=
0 to 13
˚
θ
0.5
±
0.1
PC835
Anode mark
2.54
±
0.25
12 11
10
PC845
Internal connection
diagram
12 11 10
9
8 7
6.5
±
0.5
Anode mark
Internal connection diagram
16 15 14 13 12 11 10
9
1 3 5 7 Anode
2 4 6 8 Cathode
9
11 13 15
Emitter
10 12 14 16
Collector
9
PC815
8
7
PC815
PC815
1 2 3
2.54
±
0.25
16
15
14 13
4
12
5
6
11 10
7
9
8
PC815
PC815
PC815
PC815
6
7
8
1
3.0
±
0.5
3.5
±
0.5
0.5
TYP.
14.74
±
0.5
2.7
±
0.2
7.62
±
0.3
3.0
±
0.5
3.5
±
0.5
0.5
TYP.
2 3 4
0.9
±
0.2
1.2
±
0.3
5
6.5
±
0.5
1
2 3 4
0.9
±
0.2
1.2
±
0.3
5
6
1
2 3
1 3 5
2 4 6
7 9
11
8
10 12
4 5 6
Anode
Cathode
Emitter
Collector
19.82
±
0.5
2.7
±
0.5
7.62
±
0.3
0.26
±
0.1
0.5
±
0.1
θ
θ
=
0 to 13
˚
θ
0.26
±
0.1
0.5
±
0.1
θ
θ
θ
=
0 to 13
˚
“
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that occur in equipment using any of SHARP's devices, shown in catalogs,
data books, etc. Contact SHARP in order to obtain the latest version of the device specification sheets before using any SHARP's device.
”
PC815 Series
s
Absolute Maximum Ratings
Parameter
Forward current
*1
Peak forward current
Reverse voltage
Power dissipation
Collector-emitter voltage
Emitter-collector voltage
Collector current
Collector power dissipation
Total power dissipation
*2
Isolation voltage
Operating temperature
Storage temperature
*3
Soldering temperature
Symbol
I
F
I
FM
V
R
P
V
CEO
V
ECO
I
C
P
C
P
tot
V
iso
T
opr
T
stg
T
sol
Rating
50
1
6
70
35
6
80
150
200
5 000
- 30 to + 100
- 55 to + 125
260
( Ta = 25˚C )
Unit
mA
A
V
mW
V
V
mA
mW
mW
V
rms
˚C
˚C
˚C
Input
Output
*1 Pulse width<=100
µ
s, Duty ratio : 0.001
*2 40 to 60% RH, AC for 1 minute
*3 For 10 seconds
s
Electro-optical Characteristics
Parameter
Forward voltage
Peak forward voltage
Reverse current
Terminal capacitance
Collector dark current
Current transfer ratio
Collector-emitter saturation voltage
Isolation resistance
Floating capacitance
Cut-off frequency
Rise time
Response time
Fall time
Symbol
V
F
V
FM
I
R
C
t
I
CEO
CTR
V
CE ( sat )
R
ISO
C
f
f
c
t
r
t
f
Conditions
I
F
= 20mA
I
FM
= 0.5A
V
R
= 4V
V = 0, f = 1kHz
V
CE
= 10V, I
F
= 0
I
F
= 1mA, V
CE
= 2V
I
F
= 20mA, I
C
= 5mA
DC500V, 40 to 60% RH
V = 0, f = 1MHz
V
CE
= 2V, I
C
= 2mA, R
L
= 100
Ω
V
CE
MIN.
-
-
-
-
-
600
-
5 x 10
10
-
1
-
= 2V, I
C
= 10mA, R
L
= 100
Ω
-
TYP.
1.2
-
-
30
-
-
0.8
10
11
0.6
6
60
53
( Ta = 25˚C )
MAX.
1.4
3.0
10
250
10
- 6
7 500
1.0
-
1.0
-
300
250
Unit
V
V
µ
A
pF
A
%
V
Ω
pF
kHz
µ
s
µ
s
Input
Output
Transfer
charac-
teristics
Fig. 1 Forward Current vs.
Ambient Temperature
60
Fig. 2 Collector Power Dissipation vs.
Ambient Temperature
200
Collector power dissipation P
C
( mW )
50
Forward current I
F
( mA )
150
40
30
100
20
50
10
0
- 30
0
25
50
75
100
( ˚C )
Ambient temperature Ta
125
0
- 30
0
25
50
75
100
Ambient temperature Ta ( ˚C )
125
PC815 Series
Fig. 3 Peak Forward Current vs. Duty Ratio
10 000
5 000
Peak forward current I
FM
( mA )
2 000
1 000
500
200
100
50
20
10
5
5
Fig. 4 Forward Current vs. Forward Voltage
500
200
Forward current I
F
( mA )
100
50
20
10
5
2
1
T
a
= 75˚C
50˚C
25˚C
0˚C
- 25˚C
Pulse width <=100µs
T
a
= 25˚C
10
-3
2
5
10
-2
2
5
10
-1
2
5
1
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
Duty ratio
Forward voltage V
F
( V )
Fig. 5 Current Transfer Ratio vs.
Forward Current
2 000
Current transfer ratio CTR ( % )
1 800
1 600
1 400
1 200
1 000
800
600
400
200
0
0.1
V
CE
= 2V
T
a
= 25˚C
Fig. 6 Collector Current vs.
Collector-emitter Voltage
100
90
80
Collector current I
C
( mA )
I
F
= 10mA
70
60
50
40
2mA
30
20
10
1mA
5mA
P
C
( MAX. )
Ta = 25˚C
0.2
0.5
1
F
2
( mA )
5
10
0
0
Forward current I
1
2
3
Collector-emitter voltage V
CE
4
(V)
5
150
I
F
= 1mA
V
CE
= 2V
Relative current transfer ratio ( % )
Collector-emitter saturation voltage V
CE ( sat )
( V )
Fig. 7 Relative Current Transfer Ratio vs.
Ambient Temperature
Fig. 8 Collector-emitter Saturation Voltage
vs. Ambient Temperature
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
- 30
I
F
= 20mA
I
C
= 5mA
100
50
0
- 30
0
25
50
75
100
0
25
50
a
75
( ˚C )
100
Ambient temperature T
a
( ˚C )
Ambient temperature T
Application Circuits
NOTICE
qThe
circuit application examples in this publication are provided to explain representative applications of
SHARP devices and are not intended to guarantee any circuit design or license any intellectual property
rights. SHARP takes no responsibility for any problems related to any intellectual property right of a
third party resulting from the use of SHARP's devices.
qContact
SHARP in order to obtain the latest device specification sheets before using any SHARP device.
SHARP reserves the right to make changes in the specifications, characteristics, data, materials,
structure, and other contents described herein at any time without notice in order to improve design or
reliability. Manufacturing locations are also subject to change without notice.
qObserve
the following points when using any devices in this publication. SHARP takes no responsibility
for damage caused by improper use of the devices which does not meet the conditions and absolute
maximum ratings to be used specified in the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii)Measures such as fail-safe function and redundant design should be taken to ensure reliability and
safety when SHARP devices are used for or in connection with equipment that requires higher
reliability such as:
--- Transportation control and safety equipment (i.e., aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii)SHARP devices shall not be used for or in connection with equipment that requires an extremely
high level of reliability and safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g., scuba).
qContact
a SHARP representative in advance when intending to use SHARP devices for any "specific"
applications other than those recommended by SHARP or when it is unclear which category mentioned
above controls the intended use.
qIf
the SHARP devices listed in this publication fall within the scope of strategic products described in the
Foreign Exchange and Foreign Trade Control Law of Japan, it is necessary to obtain approval to export
such SHARP devices.
qThis
publication is the proprietary product of SHARP and is copyrighted, with all rights reserved. Under
the copyright laws, no part of this publication may be reproduced or transmitted in any form or by any
means, electronic or mechanical, for any purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also required before any use of this publication
may be made by a third party.
qContact
and consult with a SHARP representative if there are any questions about the contents of this
publication.
115
Embedded System
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