EEWORLDEEWORLDEEWORLD

Part Number

Search

250R07C1R8BV4T

Description
CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0000018 uF, SURFACE MOUNT, 0402, CHIP, LEAD FREE
CategoryPassive components    capacitor   
File Size91KB,4 Pages
ManufacturerJohanson Dielectrics
Environmental Compliance
Download Datasheet Parametric View All

250R07C1R8BV4T Overview

CAPACITOR, CERAMIC, MULTILAYER, 25 V, C0G, 0.0000018 uF, SURFACE MOUNT, 0402, CHIP, LEAD FREE

250R07C1R8BV4T Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid2038020459
package instruction, 0402
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.0000018 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Manufacturer's serial numberC
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance5.56%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, PAPER, 7 INCH
positive tolerance5.56%
Rated (DC) voltage (URdc)25 V
size code0402
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
C-S
ERIES
H
IGH
F
REQUENCY
C
HIP
C
APACITORS
K
EY
F
EATURES
High-Q / Low ESR
Self Resonant Frequencies to 23.0 GHz
Lead-Free Terminations
Free MLCSoft® for SPICE & S-Parameter Modeling Data
A
PPLICATIONS
• Cellular Products
• Cable Components
• RF Transceivers
• Wireless LAN
• RF Integrated Circuits
• Custom Applications
Dielectric
RF Performance
E/B
W
T
L
S Series BEST
C Series
BETTER
L Series GOOD
NPO
?
D
IELECTRIC
C
HARACTERISTICS
TEMPERATURE COEFFICIENT:
QUALITY FACTOR:
INSULATION RESISTANCE:
DIELECTRIC STRENGTH:
TEST PARAMETERS:
AVAILABLE CAPACITANCE:
0 ± 30ppm /°C, -55 to 125°C
2,500 min.,10,000 typical
R07/0402
Typical Series Resonant Frequency
10.0
Frequency (GHz)
>1,000 G @ 25°C,WVDC;
125°C IR is 10% of 25°C rating.
2.5 X WVDC Min., 25°C, 50 mA max
1MHz ±50kHz, 1.0±0.2 VRMS, 25°C
Size 0402:
Size 0603:
Size 0805:
Size 1210:
0.2 - 15 pF
0.2 - 47 pF
0.2 - 150 pF
0.5 - 1000 pF
R14/0603
R15/0805
1.0
0.8
1
10
Capacitance (pF)
100
200
H
OW TO
O
RDER
201
VOLTAGE
250 = 25 V
500 = 50 V
101 = 100 V
201 = 200 V
301 = 300 V
501 = 500 V
R15
CASE SIZE
See Chart
C
DIELECTRIC
C = High-Q NPO
101
CAPACITANCE
1st two digits are
significant; third digit
denotes number of
zeros, R = decimal.
1R0 = 1.0 pF
101 = 100 pF
J
TOLERANCE
** A = ± 0.05 pF
*
B = ± 0.10 pF
* C = ± 0.25 pF
F = ±1%
G = ± 2%
J = ± 5%
K = ± 10%
* Values < 10 pF
** Values < 2.0 pF
V
TERMINATION
V = Ni/Sn
4
E
TAPE MODIFIER
Code Type Reel
SIZES 0402 & 0603:
T
Paper 7”
Y
Paper
5”
SIZE 0805 & 1210:
E Embossed 7”
Z Embossed 5”
Tape specifications
conform to EIA RS481
MARKING
4 = Unmarked
6 = EIA “J” Code*
*For sizes 0805
Part number written: 201R15C101JV4E
10
www.johansontechnology.com
In serial communication mode 0, the RXD pin level
Heroes,In serial port working mode 0, RXD is used as the data serial transmission pin, and TXD is used as the synchronous clock shift pulse pin.Now if SBUF=0X00 is sent, theoretically a clock pulse ca...
lnmisay 51mcu
WinCE does not support cab files. What components need to be installed?
The system was not burned by us, but provided by another company. What needs to be installed?...
aihys Embedded System
The latest situation of domestic chip manufacturers: have some found blue ocean?
I saw a news article and would like to share it with you: Local chip manufacturers have found a blue ocean in the market segment https://www.eeworld.com.cn/manufacture/2010/0125/article_2403.html Anka...
精远FPGA FPGA/CPLD
Does anyone have the Chinese data sheet for mc9s12xet256?
Does anyone have the Chinese data sheet for mc9s12xet256?...
90后_码农 NXP MCU
【R7F0C809】05 CSI
[size=4]CSI is actually a key part of the project. First of all, the wireless module is SPI, and although 12864 is not mentioned, it seems that the timing is also SPI. If the two are shared, it is sti...
johnrey Renesas Electronics MCUs
12 details of PCB layout
1. Spacing between patchesThe spacing between SMD components is an issue that engineers must pay attention to during layout. If the spacing is too small, it will be very difficult to print solder past...
btty038 PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1777  851  2857  38  644  36  18  58  1  13 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号