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BZT52-B18,118

Description
Zener Diode, 18V V(Z), 2.22%, 0.35W, Silicon, Unidirectional
CategoryDiscrete semiconductor    diode   
File Size171KB,11 Pages
ManufacturerNexperia
Websitehttps://www.nexperia.com
Download Datasheet Parametric View All

BZT52-B18,118 Overview

Zener Diode, 18V V(Z), 2.22%, 0.35W, Silicon, Unidirectional

BZT52-B18,118 Parametric

Parameter NameAttribute value
Objectid7397195400
package instructionSOD-123, 2 PIN
Reach Compliance Codecompliant
YTEOL6.75
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeZENER DIODE
Maximum dynamic impedance20 Ω
JESD-30 codeR-PDSO-G2
Maximum knee impedance170 Ω
Number of components1
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package body materialPLASTIC/EPOXY
Package shapeRECTANGULAR
Package formSMALL OUTLINE
polarityUNIDIRECTIONAL
Maximum power dissipation0.35 W
GuidelineAEC-Q101; IEC-60134
Nominal reference voltage18 V
Maximum reverse current0.05 µA
Reverse test voltage12.6 V
surface mountYES
technologyZENER
Terminal formGULL WING
Terminal locationDUAL
Voltage temperatureCoeff-Max16 mV/°C
Maximum voltage tolerance2.22%
Working test current5 mA
BZT52-B series
Rev. 1 — 20 December 2017
Single Zener diodes in a SOD123 package
Product data sheet
1
1 Product profile
1.1 General description
General-purpose Zener diodes in a SOD123 small Surface-Mounted Device (SMD)
plastic package.
1.2 Features and benefits
Total power dissipation: ≤ 590 mW
Wide working voltage range: nominal 2.4 V to 75 V (E24 range)
Small plastic package suitable for surface-mounted design
Low differential resistance
B selection
AEC-Q101 qualified
1.3 Applications
General regulation functions
1.4 Quick reference data
Table 1. Quick reference data
Symbol
V
F
P
tot
Parameter
forward voltage
total power dissipation
Conditions
I
F
= 10 mA
T
amb
≤ 25 °C
[1]
[2]
[3]
Min
-
-
-
Typ
-
-
-
Max
0.9
350
590
Unit
V
mW
mW
[1] Pulse test: t
p
≤ 300 μs; δ ≤ 0.02.
[2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint.
2
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm .
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