HDB3/AMI ENCODER/DECODER
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | Zarlink Semiconductor (Microsemi) |
| package instruction | DIP, DIP16,.3 |
| Reach Compliance Code | unknow |
| JESD-30 code | R-GDIP-T16 |
| JESD-609 code | e0 |
| length | 20.32 mm |
| Number of functions | 1 |
| Number of terminals | 16 |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP16,.3 |
| Package shape | RECTANGULAR |
| Package form | IN-LINE |
| power supply | 5 V |
| Certification status | Not Qualified |
| Maximum seat height | 5.08 mm |
| Nominal supply voltage | 5 V |
| surface mount | NO |
| technology | CMOS |
| Telecom integrated circuit types | HDB3 ENCODER/DECODER |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| width | 7.62 mm |

| MV1471/CG/DGAS | MV1471 | MV1471/CG/DPAS | |
|---|---|---|---|
| Description | HDB3/AMI ENCODER/DECODER | HDB3/AMI ENCODER/DECODER | HDB3/AMI ENCODER/DECODER |
| Is it Rohs certified? | incompatible | - | incompatible |
| Maker | Zarlink Semiconductor (Microsemi) | - | Zarlink Semiconductor (Microsemi) |
| package instruction | DIP, DIP16,.3 | - | DIP, DIP16,.3 |
| Reach Compliance Code | unknow | - | unknow |
| JESD-30 code | R-GDIP-T16 | - | R-PDIP-T16 |
| JESD-609 code | e0 | - | e0 |
| Number of functions | 1 | - | 1 |
| Number of terminals | 16 | - | 16 |
| Maximum operating temperature | 70 °C | - | 70 °C |
| Package body material | CERAMIC, GLASS-SEALED | - | PLASTIC/EPOXY |
| encapsulated code | DIP | - | DIP |
| Encapsulate equivalent code | DIP16,.3 | - | DIP16,.3 |
| Package shape | RECTANGULAR | - | RECTANGULAR |
| Package form | IN-LINE | - | IN-LINE |
| power supply | 5 V | - | 5 V |
| Certification status | Not Qualified | - | Not Qualified |
| Maximum seat height | 5.08 mm | - | 5.08 mm |
| Nominal supply voltage | 5 V | - | 5 V |
| surface mount | NO | - | NO |
| technology | CMOS | - | CMOS |
| Telecom integrated circuit types | HDB3 ENCODER/DECODER | - | HDB3 ENCODER/DECODER |
| Temperature level | COMMERCIAL | - | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | - | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | - | 2.54 mm |
| Terminal location | DUAL | - | DUAL |
| width | 7.62 mm | - | 7.62 mm |