BXY42-T1H datasheet, PDF - EEWORLD Datasheet

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BXY42-T1H: DescriptionPin Diode, Silicon, HERMETIC SEALED PACKAGE-2; CategoryDiscrete semiconductor diode; File Size79KB，6 Pages; ManufacturerSIEMENS; Websitehttp://www.infineon.com/

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BXY42-T1H Overview

Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2

BXY42-T1H Parametric

Parameter Name	Attribute value
Maker	SIEMENS
package instruction	O-CXMW-G2
Contacts	2
Reach Compliance Code	unknown
ECCN code	EAR99
Other features	HIGH RELIABILITY
application	SWITCHING
Configuration	SINGLE
Maximum diode capacitance	0.24 pF
Diode component materials	SILICON
Maximum diode forward resistance	3.5 Ω
Diode type	PIN DIODE
JESD-30 code	O-CXMW-G2
Minority carrier nominal lifetime	0.05 µs
Number of components	1
Number of terminals	2
Package body material	CERAMIC, METAL-SEALED COFIRED
Package shape	ROUND
Package form	MICROWAVE
Maximum power dissipation	0.35 W
Certification status	Not Qualified
surface mount	YES
technology	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	GULL WING
Terminal location	UNSPECIFIED
Base Number Matches	1

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HiRel

Silicon PIN Diode

Features

HiRel

Discrete and Microwave Semiconductor

PIN Diode for high speed switching of RF signals

Very low capacitance

Hermetically sealed microwave package

qualified

ESA/SCC Detail Spec. No.: 5513/017

lectro

tatic

ischarge sensitive device,

observe handling precautions!

BXY 42

ESD:

Type

BXY 42-T (ql)

BXY 42-T1 (ql)

Marking

Ordering Code

see below

Pin Configuration

Package

(ql) Quality Level: P: Professional Quality, Ordering Code: Q62702X143

H: High Rel Quality,

S: Space Quality,

Ordering Code: on request

ES: ESA Space Quality, Ordering Code: Q62702X168

(see

Chapter Order Instructions

for ordering example)

Semiconductor Group

Draft A03 1998-04-01

BXY42-T1H Related Products

	BXY42-T1H	BXY42-TH	BXY42-TP	BXY42-TS	BXY42-T1S	BXY42-T1P	BXY42-TES	BXY42-T1ES
Description	Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2	Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2	Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2	Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2	Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2	Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2	Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2	Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2
Maker	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS
package instruction	O-CXMW-G2	O-CELF-R2	O-CELF-R2	O-CELF-R2	O-CXMW-G2	O-CXMW-G2	O-CELF-R2	O-CXMW-G2
Contacts	2	2	2	2	2	2	2	2
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
Other features	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY	HIGH RELIABILITY
application	SWITCHING	SWITCHING	SWITCHING	SWITCHING	SWITCHING	SWITCHING	SWITCHING	SWITCHING
Configuration	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE	SINGLE
Maximum diode capacitance	0.24 pF	0.24 pF	0.24 pF	0.24 pF	0.24 pF	0.24 pF	0.24 pF	0.24 pF
Diode component materials	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON	SILICON
Maximum diode forward resistance	3.5 Ω	3.5 Ω	3.5 Ω	3.5 Ω	3.5 Ω	3.5 Ω	3.5 Ω	3.5 Ω
Diode type	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE	PIN DIODE
JESD-30 code	O-CXMW-G2	O-CELF-R2	O-CELF-R2	O-CELF-R2	O-CXMW-G2	O-CXMW-G2	O-CELF-R2	O-CXMW-G2
Minority carrier nominal lifetime	0.05 µs	0.05 µs	0.05 µs	0.05 µs	0.05 µs	0.05 µs	0.05 µs	0.05 µs
Number of components	1	1	1	1	1	1	1	1
Number of terminals	2	2	2	2	2	2	2	2
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
Package shape	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND	ROUND
Package form	MICROWAVE	LONG FORM	LONG FORM	LONG FORM	MICROWAVE	MICROWAVE	LONG FORM	MICROWAVE
Maximum power dissipation	0.35 W	0.6 W	0.6 W	0.6 W	0.35 W	0.35 W	0.6 W	0.35 W
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE	POSITIVE-INTRINSIC-NEGATIVE
Terminal form	GULL WING	WRAP AROUND	WRAP AROUND	WRAP AROUND	GULL WING	GULL WING	WRAP AROUND	GULL WING
Terminal location	UNSPECIFIED	END	END	END	UNSPECIFIED	UNSPECIFIED	END	UNSPECIFIED
Base Number Matches	1	1	1	1	1	1	1	1

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