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BXY42-TS

Description
Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2
CategoryDiscrete semiconductor    diode   
File Size79KB,6 Pages
ManufacturerSIEMENS
Websitehttp://www.infineon.com/
Download Datasheet Parametric Compare View All

BXY42-TS Overview

Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2

BXY42-TS Parametric

Parameter NameAttribute value
MakerSIEMENS
package instructionO-CELF-R2
Contacts2
Reach Compliance Codeunknown
Other featuresHIGH RELIABILITY
applicationSWITCHING
Shell connectionISOLATED
ConfigurationSINGLE
Maximum diode capacitance0.24 pF
Diode component materialsSILICON
Maximum diode forward resistance3.5 Ω
Diode typePIN DIODE
JESD-30 codeO-CELF-R2
Minority carrier nominal lifetime0.05 µs
Number of components1
Number of terminals2
Package body materialCERAMIC, METAL-SEALED COFIRED
Package shapeROUND
Package formLONG FORM
Maximum power dissipation0.6 W
Certification statusNot Qualified
surface mountYES
technologyPOSITIVE-INTRINSIC-NEGATIVE
Terminal formWRAP AROUND
Terminal locationEND
Base Number Matches1
HiRel
Silicon PIN Diode
Features
¥
¥
¥
¥
¥
¥
HiRel
Discrete and Microwave Semiconductor
PIN Diode for high speed switching of RF signals
Very low capacitance
Hermetically sealed microwave package
qualified
ESA/SCC Detail Spec. No.: 5513/017
E
lectro
s
tatic
d
ischarge sensitive device,
observe handling precautions!
T
BXY 42
ESD:
T1
Type
BXY 42-T (ql)
BXY 42-T1 (ql)
Marking
-
-
Ordering Code
see below
see below
Pin Configuration
Package
T
T1
(ql) Quality Level: P: Professional Quality, Ordering Code: Q62702X143
H: High Rel Quality,
S: Space Quality,
Ordering Code: on request
Ordering Code: on request
ES: ESA Space Quality, Ordering Code: Q62702X168
(see
Chapter Order Instructions
for ordering example)
Semiconductor Group
1
Draft A03 1998-04-01

BXY42-TS Related Products

BXY42-TS BXY42-T1H BXY42-TH BXY42-TP BXY42-T1S BXY42-T1P BXY42-TES BXY42-T1ES
Description Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2
Maker SIEMENS SIEMENS SIEMENS SIEMENS SIEMENS SIEMENS SIEMENS SIEMENS
package instruction O-CELF-R2 O-CXMW-G2 O-CELF-R2 O-CELF-R2 O-CXMW-G2 O-CXMW-G2 O-CELF-R2 O-CXMW-G2
Contacts 2 2 2 2 2 2 2 2
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
Other features HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY HIGH RELIABILITY
application SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING SWITCHING
Configuration SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE SINGLE
Maximum diode capacitance 0.24 pF 0.24 pF 0.24 pF 0.24 pF 0.24 pF 0.24 pF 0.24 pF 0.24 pF
Diode component materials SILICON SILICON SILICON SILICON SILICON SILICON SILICON SILICON
Maximum diode forward resistance 3.5 Ω 3.5 Ω 3.5 Ω 3.5 Ω 3.5 Ω 3.5 Ω 3.5 Ω 3.5 Ω
Diode type PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE PIN DIODE
JESD-30 code O-CELF-R2 O-CXMW-G2 O-CELF-R2 O-CELF-R2 O-CXMW-G2 O-CXMW-G2 O-CELF-R2 O-CXMW-G2
Minority carrier nominal lifetime 0.05 µs 0.05 µs 0.05 µs 0.05 µs 0.05 µs 0.05 µs 0.05 µs 0.05 µs
Number of components 1 1 1 1 1 1 1 1
Number of terminals 2 2 2 2 2 2 2 2
Package body material CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
Package shape ROUND ROUND ROUND ROUND ROUND ROUND ROUND ROUND
Package form LONG FORM MICROWAVE LONG FORM LONG FORM MICROWAVE MICROWAVE LONG FORM MICROWAVE
Maximum power dissipation 0.6 W 0.35 W 0.6 W 0.6 W 0.35 W 0.35 W 0.6 W 0.35 W
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
surface mount YES YES YES YES YES YES YES YES
technology POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE POSITIVE-INTRINSIC-NEGATIVE
Terminal form WRAP AROUND GULL WING WRAP AROUND WRAP AROUND GULL WING GULL WING WRAP AROUND GULL WING
Terminal location END UNSPECIFIED END END UNSPECIFIED UNSPECIFIED END UNSPECIFIED
Base Number Matches 1 1 1 1 1 1 1 1
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