= 2.7 V to 5.5 V, unless otherwise noted. Temperature range as follows: A version = −40°C to +125°C.
Table 1.
Parameter
TEMPERATURE SENSOR AND ADC
Accuracy
1
A Version
±0.5
−0.87 to +0.82
2
±1.5
±2.0
±3.0
±2.0
±1.87
2
±2.0
±3.0
±3.0
10
800
25
Unit
°C typ
°C max
°C max
°C max
°C max
°C typ
°C max
°C typ
°C max
°C typ
Bits
ms typ
μs typ
Test Conditions/Comments
V
DD
= 3 V @ +40°C
V
DD
= 3 V @ +40°C
V
DD
= 3 V @ −40°C to +70°C
V
DD
= 3 V @ −40°C to +85°C
V
DD
= 3 V @ −40°C to +125°C
V
DD
= 3 V @ −40°C to +125°C
V
DD
= 5.5 V @ +40°C
V
DD
= 5.5 V @ −40°C to +85°C
V
DD
= 5.5 V @ −40°C to +85°C
V
DD
= 5.5 V @ −40°C to +125°C
Resolution
Update Rate, t
R
Temperature Conversion Time
POWER SUPPLIES
Supply Current
3
Peak Supply Current
4
Supply Current – Nonconverting
Inactive Serial Bus
5
Normal Mode @ 3 V
Normal Mode @ 5 V
Active Serial Bus
6
Normal Mode @ 3 V
Normal Mode @ 5 V
Shutdown Mode
DIGITAL INPUT
Input High Voltage, V
IH
Input Low Voltage, V
IL
Input Current, I
IN 7
Input Capacitance, C
IN
DIGITAL OUTPUT (OPEN-DRAIN)
Output High Voltage, V
OH
Output Low Voltage, V
OL
Output High Current, I
OH
Output Capacitance, C
OUT
ALERT Output Saturation Voltage
1.2
900
169
188
180
214
3
mA typ
μA max
μA typ
μA typ
μA typ
μA typ
μA max
Current during conversion
Peak current between conversions
Supply current with serial bus inactive. Part not
converting and D7 of configuration register = 0.
Supply current with serial bus active. Part not
converting and D7 of configuration register = 0.
D7 of configuration register = 1. Typical values
are 0.04 μA at 3 V and 0.5 μA at 5 V.
2.4
0.8
±1
10
2.4
0.4
1
10
0.8
V min
V max
μA max
pF max
V min
V max
μA max
pF max
V max
V
IN
= 0 V to V
DD
All digital inputs
I
OL
= 1.6 mA
V
OH
= 5 V
Typ = 3 pF
I
OUT
= 4 mA
Rev. F | Page 3 of 20
AD7414/AD7415
Parameter
AC ELECTRICAL CHARACTERISTICS
8, 9
Serial Clock Period, t
1
Data In Setup Time to SCL High, t
2
Data Out Stable after SCL Low, t
3
SDA Low Setup Time to SCL Low
(Start Condition), t
4
SDA High Hold Time after SCL High
(Stop Condition), t
5
SDA and SCL Fall Time, t
6
Data Hold Time, t
7
Power-Up Time
1
A Version
2.5
50
0
50
50
90
35
4
Unit
μs min
ns min
ns min
ns min
ns min
ns max
ns min
μs typ
Test Conditions/Comments
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
See Figure 2
Accuracy specifications apply only to voltages listed under Test Conditions. See Temperature Accuracy vs. Supply section for typical accuracy performance over the
full V
DD
supply range.
2
100% production tested at 40°C to these limits.
3
These current values can be used to determine average power consumption at different one-shot conversion rates. Average power consumption at the automatic
conversion rate of 1.25 kHz is 940 μW.
4
This peak supply current is required for 29 μs (the conversion time plus power-up time) out of every 800 μs (the conversion rate).
5
These current values are derived by not issuing a stop condition at the end of a write or read, thus preventing the part from going into a conversion.
6
The current is derived assuming a 400 kHz serial clock being active continuously.
7
On power-up, the initial input current, I
IN
, on the AS pin is typically 50 μA.
8
The SDA and SCL timing is measured with the input filters turned on so as to meet the fast mode I
2
C specification. Switching off the input filters improves the transfer
rate but has a negative effect on the EMC behavior of the part.
9
Guaranteed by design. Not tested in production.
SCL
t
1
t
4
SDA
DATA IN
SDA
DATA OUT
t
2
t
7
t
5
t
3
02463-002
t
6
Figure 2. Diagram for Serial Bus Timing
Rev. F | Page 4 of 20
AD7414/AD7415
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
V
DD
to GND
SDA Input Voltage to GND
SDA Output Voltage to GND
SCL Input Voltage to GND
ALERT Output Voltage to GND
Operating Temperature Range
Storage Temperature Range
Junction Temperature
5-Lead SOT-23 (RJ-5)
Power Dissipation
1, 2
Thermal Impedance
3
θ
JA
, Junction-to-Ambient (still air)
6-Lead SOT-23 (RJ-6)
Power Dissipation
1, 2
Thermal Impedance
3
θ
JA
, Junction-to-Ambient (still air)
8-Lead MSOP (RM-8)
Power Dissipation
1, 2
Thermal Impedance
3
θ
JA
, Junction-to-Ambient (still air)
θ
JC
, Junction-to-Case
IR Reflow Soldering
Peak Temperature
Time at Peak Temperature
Ramp-up Rate
Ramp-down Rate
Ramp from 25°C to Peak Temperature
IR Reflow Soldering in Pb-Free Package
Peak Temperature
Time at Peak Temperature
Ramp Rate
Ramp-Down Rate
Ramp from 25°C to Peak Temperature
1
2
Rating
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to +7 V
−0.3 V to +7 V
−40°C to +125°C
−65°C to +150°C
150°C
W
MAX
= (T
JMAX
− T
A
)/θ
JA
240°C/W
W
MAX
= (T
JMAX
− T
A
)/θ
JA
190.4°C/W
W
MAX
= (T
JMAX
− T
A
)/θ
JA
205.9°C/W
43.74°C/W
220°C (0°C/5°C)
10 sec to 20 sec
3°C/s max
−6°C/s
max
6 minutes max
260°C (0°C)
20 sec to 40 sec
3°C/s max
−6°C/s
max
8 minutes max
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
Values relate to package being used on a standard 2-layer PCB.
T
A
= ambient temperature.
3
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, such as components mounted on a heat sink.
Junction-to-ambient resistance is more useful for air-cooled, PCB-mounted
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