A range of dc rated multi-layer chip capacitors from
0.47pF to 22µF and in case sizes 0603 to 8060 in
C0G/NP0 and X7R dielectrics. Suitable for all general
purpose and high reliability applications where package
size and reliability are important. All are manufactured
using Syfer’s unique wet process and incorporate
precious metal electrodes.
Dissipation Factor
Ageing Rate
Range Dimensions – Standard MLCC Ranges
Length
(L1)
mm/inches
1.6 ± 0.2
0.063 ± 0.008
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
4.5 ± 0.35
0.18 ± 0.014
5.7 ± 0.4
0.225 ± 0.016
5.7 ± 0.4
0.225 ± 0.016
9.2 ± 0.5
0.36 ± 0.02
14.0 ± 0.5
0.55 ± 0.02
20.3 ± 0.5
0.8 ± 0.02
Width
(W)
mm/inches
0.8 ± 0.2
0.031 ± 0.008
1.25 ± 0.2
0.05 ± 0.008
1.6 ± 0.2
0.063 ± 0.008
2.5 ± 0.3
0.1 ± 0.012
2.0 ± 0.3
0.08 ± 0.012
3.2 ± 0.3
0.126 ± 0.012
6.30 ± 0.4
0.25 ± 0.016
5.0 ± 0.4
0.197 ± 0.016
6.3 ± 0.4
0.25 ± 0.016
10.16 ± 0.5
0.4 ± 0.02
12.7 ± 0.5
0.5 ± 0.02
15.24 ± 0.5
0.6 ± 0.02
Max. Thickness
(T)
mm/inches
0.8
0.013
1.3
0.051
1.6
0.063
2.0
0.08
2.0
0.08
2.5
0.1
2.5
0.1
4.2
0.16
4.2
0.16
2.5
0.1
4.2
0.16
2.5
0.1
Termination Band
(L2)
mm/inches
min
0.10
0.004
0.13
0.005
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.25
0.01
0.5
0.02
0.5
0.02
0.5
0.02
max
0.40
0.015
0.75
0.03
0.75
0.03
0.75
0.03
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.0
0.04
1.5
0.06
1.5
0.06
1.5
0.06
Size
0603
0805
1206
1210
1808
1812
1825
2220
2225
3640
5550
8060
Custom chip sizes not included in the table, but larger than 2225, can be considered with minimum tooling charges. Please refer specific requests direct to the sales office.
Max thickness relates to standard components and actual thickness may be considerably less. Thicker parts, or components with reduced maximum thickness, can be considered by request – please refer
[i=s]This post was last edited by nemo1991 on 2021-3-28 22:36[/i]Digital isolation chips are commonly used in industrial control and power supplies.For example, in power supply design, the power signa...
As shown in the figure, this situation always occurs when connecting to the FPGA development board. I have tried several development boards and many methods, but it doesn't work even with a digital si...
After installing CCS6.0, I cannot see the option of Grace file when creating a new project. Later, the Internet said that I need to install Grace separately. After I installed it, I found that it is s...
[b] I. Overview [/b] Vision technology is an emerging technology developed in recent decades. Machine vision can replace human vision in inspection, target tracking, robot guidance and other tasks, es...
I wrote a linked list program, which can be debugged successfully on keil, but there is a problem when debugging it in the MCU#define mempoolsize 512; //Define the size of the dynamic memory allocatio...
The rapid development of the Internet has realized high-speed information transmission and resource sharing, greatly facilitating people's lives. Embedded systems are widely used in various electr...[Details]
This program is written to simulate the serial port hardware mechanism. When used, a timed interrupt can be set with a time interval of 1/4 baud rate. The receiving function is called once for ea...[Details]
1. Introduction
RFID (radio frequency identification) is a non-contact automatic identification technology that emerged in the 1990s. It uses the characteristics of radio frequency signal prop...[Details]
The Mobile Industry Processor Interface (MIPI) Alliance is an organization responsible for promoting the standardization of software and hardware in mobile devices. It has released the D-PHY specif...[Details]
introduction
Solar cells and LED lighting are typical applications of new energy and energy-saving and efficient technologies. Solar LED lighting uses solar cells to convert solar energy...[Details]
DSP (digital signal processor) is used more and more frequently in today's engineering applications. There are three main reasons for this: first, it has powerful computing power and is capable of ...[Details]
Electronic systems are located at different points on the automotive power bus and therefore often need to operate under very stringent power requirements. These include load dump, cold crank, very lo...[Details]
introduction
The emergence of high-performance, low-power embedded CPUs and high-reliability network operating systems has made it possible to implement applications with large amounts of comp...[Details]
1 Introduction
Ultrasonic waves have strong directivity, slow energy consumption, and can propagate over long distances in a medium, so they are used for distance measurement. Ultrasonic detec...[Details]
1. System Structure
This system is a simulation system of indoor air-conditioning temperature/humidity control system. The data acquisition and control center collects temperature/humidity...[Details]
1 Introduction
Water resources are the basic conditions for human survival and the lifeline of economic development. The reality shows that due to the global shortage of water resources and th...[Details]
1. Introduction
Testing the temperature of steel billets before rolling is an important measure to ensure the quality of steel. Traditional manual testing is difficult to ensure product qu...[Details]
With the advocacy and implementation of the government's Safe City Plan, the security market has increasingly higher requirements for the clarity of surveillance images. Imagine that after a case o...[Details]
Domestic Chip Exchange
京公网安备 11010802033920号
EEWORLD
