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CL31C270FBNC

Description
Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1206, CHIP
CategoryPassive components    capacitor   
File Size409KB,13 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance  
Download Datasheet Parametric View All

CL31C270FBNC Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 1% +Tol, 1% -Tol, C0G, 30ppm/Cel TC, 0.000027uF, Surface Mount, 1206, CHIP

CL31C270FBNC Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1914276955
package instruction, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance0.000027 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance1%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, CARDBOARD, 7 INCH
positive tolerance1%
Rated (DC) voltage (URdc)50 V
size code1206
surface mountYES
Temperature characteristic codeC0G
Temperature Coefficient30ppm/Cel ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Multilayer Chip Capacitors – General
FEATURE
Inner Electrode
Ceramic Body
Outer Electrode
Cu or Ag
Ni
Sn/Pb
( Ni or Pd )
- Miniature Size
- Wide Capacitance, Temperature Compensation and Voltage Range
- Highly Reliable Performance
- Industry Standard Size
- Tape & Reel for Surface Mount Assembly
PART NUMBER CODE
CL 10
C
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(2)
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101
(4)
J
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B
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N
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C
(8)
(1) SAMSUNG Multilayer Ceramic Chip Capacitor
(2) Type(Size)
(3) Capacitance Temperature Characteristics
(4) Nominal Capacitance
(5) Capacitance Tolerance
(6) Rated Voltage
(7) Chip thickness
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N s anda d h ckness
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-
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A h nne han N
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B :
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(8) Packaging Type
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