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CL31B105KAPLNNE

Description
cap cer 1uf 25v 10% x7r 1206
CategoryPassive components    capacitor   
File Size78KB,2 Pages
ManufacturerSAMSUNG
Websitehttp://www.samsung.com/Products/Semiconductor/
Environmental Compliance
Download Datasheet Parametric View All

CL31B105KAPLNNE Overview

cap cer 1uf 25v 10% x7r 1206

CL31B105KAPLNNE Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerSAMSUNG
Parts packaging code1206
package instruction, 1206
Reach Compliance Codecompliant
ECCN codeEAR99
capacitance1 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance10%
Number of terminals2
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, EMBOSSED, 7 INCH
positive tolerance10%
Rated (DC) voltage (URdc)25 V
size code1206
surface mountYES
Temperature characteristic codeX7R
Temperature Coefficient15% ppm/°C
Terminal surfaceMatte Tin (Sn) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
SPECIFICATION
Supplier : Samsung electro-mechanics
Product : Multi-layer Ceramic Capacitor
A. Samsung Part Number
CL
Series
Size
Dielectric
Capacitance
Capacitance
tolerance
Rated Voltage
Thickness
31
B
105
K
A
P
L
N
N
E
Samsung P/N :
CL31B105KAPLNNE
Description :
CAP, 1㎌, 25V, ±10%, X7R, 1206
Samsung Multi-layer Ceramic Capacitor
1206 (inch code)
X7R
1
±10 %
25 V
1.15 ± 0.1
mm
L: 3.2 ± 0.2
mm
W:
1.6
± 0.2
mm
Thickness division
Inner electrode
Termination
Plating
Product
Special
Packaging
Low profile
Ni
Cu
Sn 100%
Normal
Reserved for future use
Embossed Type, 7" reel
(Pb Free)
B. Samsung Reliablility Test and Judgement condition
Performance
Capacitance
Tan
δ
(DF)
Insulation
Resistance
Appearance
Withstanding
Voltage
Temperature
Characterisitcs
Adhesive Strength
of Termination
Bending Strength
Solderability
Within specified tolerance
0.1 max.
10,000Mohm or 100Mohm⋅㎌
Whichever is Smaller
No abnormal exterior appearance
No dielectric breakdown or
mechanical breakdown
X7R
(From -55℃ to 125℃, Capacitance change shoud be within ±15%)
No peeling shall be occur on the
500g⋅F, for 10±1 sec.
terminal electrode
Capacitance change :
within ±12.5% Bending to the limit (1mm)
with 1.0mm/sec.
More than 75% of terminal surface
is to be soldered newly
SnAg3.0Cu0.5 solder
245±5℃, 3±0.3sec.
(preheating : 80~120℃ for 10~30sec.)
Resistance to
Soldering heat
Capacitance change :
Tan
δ,
IR : initial spec.
within ±7.5%
Solder pot : 270±5℃, 10±1sec.
Rated Voltage
60~120 sec.
1㎑±10%
Test condition
1.0±0.2Vrms
Microscope (×10)
250% of the rated voltage

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