CL31C101KGFNNNE datasheet, PDF

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CL31C101KGFNNNE: Descriptioncap cer 100pf 500v 10% np0 1206; CategoryPassive components capacitor; File Size78KB，2 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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CL31C101KGFNNNE Overview

cap cer 100pf 500v 10% np0 1206

CL31C101KGFNNNE Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	1206
package instruction	, 1206
Reach Compliance Code	compliant
ECCN code	EAR99
capacitance	0.0001 µF
Capacitor type	CERAMIC CAPACITOR
dielectric materials	CERAMIC
high	1.25 mm
JESD-609 code	e3
length	3.2 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	TR, EMBOSSED, 7 INCH
positive tolerance	10%
Rated (DC) voltage (URdc)	500 V
size code	1206
surface mount	YES
Temperature characteristic code	C0G
Temperature Coefficient	-/+30ppm/Cel ppm/°C
Terminal surface	Matte Tin (Sn) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	1.6 mm

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SPECIFICATION

•

Supplier : Samsung electro-mechanics

•

Product : Multi-layer Ceramic Capacitor

A. Samsung Part Number

①

Series

②

Size

③

Dielectric

④

Capacitance

⑤

Capacitance

tolerance

⑥

Rated Voltage

⑦

Thickness

②

③

101

④

⑤

⑥

⑦

⑧

⑨

⑩

⑪

•

Samsung P/N :

CL31C101KGFNNNE

CAP, 100㎊, 500V, ±10%, C0G, 1206

㎊

•

Description :

Samsung Multi-layer Ceramic Capacitor

1206

C0G

100

㎊

±10

500 V

1.25 ± 0.15

(inch code)

L: 3.2

± 0.15

1.6

Sn 100%

Normal

Reserved for future use

Embossed Type, 7" reel

(Pb Free)

± 0.15 mm

⑧

Inner electrode

Termination

Plating

⑨

Product

⑩

Special

⑪

Packaging

B. Samsung Reliablility Test and Judgement condition

Performance

Capacitance

Insulation

Resistance

Appearance

Withstanding

Voltage

Temperature

Characterisitcs

Adhesive Strength

of Termination

Bending Strength

Solderability

Within specified tolerance

1000 min

10,000Mohm or 500Mohm⋅㎌

Whichever is Smaller

No abnormal exterior appearance

No dielectric breakdown or

mechanical breakdown

C0G

(From -55℃ to 125℃, Capacitance change shoud be within ±30PPM/℃)

No peeling shall be occur on the

500g⋅F, for 10±1 sec.

terminal electrode

Capacitance change :

within ±5% or ±0.5㎊ whichever is larger

More than 75% of terminal surface

is to be soldered newly

Bending to the limit (1mm)

with 1.0mm/sec.

SnAg3.0Cu0.5 solder

245±5℃, 3±0.3sec.

(preheating : 80~120℃ for 10~30sec.)

Resistance to

Soldering heat

Capacitance change :

within ±2.5% or ±0.25㎊ whichever is larger

Tan

δ,

IR : initial spec.

Solder pot : 270±5℃, 10±1sec.

Rated Voltage

60~120 sec.

1㎒±10%

Test condition

0.5~5Vrms

Microscope (×10)

150% of the rated voltage

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