Dual-Core Intel
®
Xeon
®
Processor 7000 Series
Datasheet
Revision 2.1
September 2006
Document Number: 309626-002
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ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
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Intel may make changes to specifications and product descriptions at any time, without notice.
Designers must not rely on the absence or characteristics of any features or instructions marked “reserved” or “undefined.” Intel reserves these for
future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them.
The Dual-Core Intel
®
Xeon
®
Processor 7000 Series may contain design defects or errors known as errata which may cause the product to deviate
from published specifications. Current characterized errata are available on request.
64-bit computing on Intel architecture requires a computer system with a processor, chipset, BIOS, operating system, device drivers and applications
enabled for Inte
®
64 architecture. Processors will not operate (including 32-bit operation) without an Intel
®
64 architecture-enabled BIOS.
Performance will vary depending on your hardware and software configurations. Consult with your system vendor for more information.
Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order.
I
2
C is a two-wire communications bus/protocol developed by Philips. SMBus is a subset of the I
2
C bus/protocol and was developed by Intel.
Implementations of the I
2
C bus/protocol may require licenses from various entities, including Philips Electronics N.V. and North American Philips
Corporation.
Intel, Intel Xeon, Intel NetBurst and Intel SpeedStep are trademarks or registered trademarks of Intel Corporation or its subsidiaries in the United
States and other countries.
*Other names and brands may be claimed as the property of others.
Copyright © 2005-2006, Intel Corporation.
2
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
Contents
1
Introduction....................................................................................................................... 11
1.1
Terminology......................................................................................................... 12
1.2
Reference Documents......................................................................................... 14
1.3
State of Data ....................................................................................................... 14
Electrical Specifications.................................................................................................... 15
2.1
Front Side Bus and GTLREF .............................................................................. 15
2.1.1 Front Side Bus Clock and Processor Clocking....................................... 15
2.1.2 Front Side Bus Clock Select (BSEL[1:0]) ............................................... 16
2.1.3 Phase Lock Loop (PLL) Power and Filter............................................... 17
2.2
Voltage Identification (VID).................................................................................. 17
2.3
Reserved, Unused, and TESTHI Pins.................................................................20
2.4
Mixing Processors ............................................................................................... 20
2.5
Front Side Bus Signal Groups............................................................................. 21
2.6
GTL+ Asynchronous Signals and AGTL + Asynchronous Signals...................... 22
2.7
Test Access Port (TAP) Connection.................................................................... 23
2.8
Absolute Maximum and Minimum Ratings .......................................................... 23
2.9
Processor DC Specifications............................................................................... 24
2.9.1 Flexible Motherboard (FMB) Guidelines................................................. 24
2.9.2 Vcc Overshoot Specification .................................................................. 28
Mechanical Specifications ................................................................................................ 33
3.1
Package Mechanical Drawing ............................................................................. 33
3.2
Processor Component Keepout Zones ............................................................... 36
3.3
Package Loading Specifications ......................................................................... 36
3.4
Package Handling Guidelines ............................................................................. 37
3.5
Package Insertion Specifications ........................................................................ 37
3.6
Processor Mass Specifications ........................................................................... 37
3.7
Processor Materials............................................................................................. 37
3.8
Processor Markings............................................................................................. 38
3.9
Processor Pin-Out Coordinates........................................................................... 39
Pin Listing......................................................................................................................... 41
4.1
Dual-Core Intel Xeon Processor 7000 Series Pin Assignments.......................... 41
4.1.1 Pin Listing by Pin Name ......................................................................... 41
4.1.2 Pin Listing by Pin Number ...................................................................... 50
Signal Definitions.............................................................................................................. 59
5.1
Signal Definitions................................................................................................. 59
Thermal Specifications ..................................................................................................... 67
6.1
Package Thermal Specifications ......................................................................... 67
6.1.1 Thermal Specifications ........................................................................... 67
6.1.2 Thermal Metrology ................................................................................. 70
6.2
Processor Thermal Features............................................................................... 70
6.2.1 Thermal Monitor ..................................................................................... 70
3
2
3
4
5
6
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
6.2.2
6.2.3
6.2.4
6.2.5
6.2.6
6.2.7
7
On-Demand Mode.................................................................................. 71
PROCHOT# Signal Pin .......................................................................... 71
FORCEPR# Signal Pin .......................................................................... 72
THERMTRIP# Signal Pin ....................................................................... 72
Tcontrol and Fan Speed Reduction ....................................................... 72
Thermal Diode........................................................................................ 72
Features ........................................................................................................................... 73
7.1
Power-On Configuration Options ........................................................................ 73
7.2
Clock Control and Low Power States.................................................................. 73
7.2.1 Normal State .......................................................................................... 73
7.2.2 HALT Power Down State ....................................................................... 74
7.2.3 Stop-Grant State .................................................................................... 74
7.2.4 HALT/Grant Snoop State ....................................................................... 75
7.2.5 Enhanced HALT Powerdown State........................................................ 75
7.3
Enhanced Intel SpeedStep
®
Technology............................................................ 76
7.4
System Management Bus (SMBus) Interface ..................................................... 76
7.4.1 Processor Information ROM (PIROM).................................................... 77
7.4.2 Scratch EEPROM .................................................................................. 80
7.4.3 PIROM and Scratch EEPROM Supported SMBus Transactions ........... 80
7.4.4 SMBus Thermal Sensor ......................................................................... 81
7.4.5 Thermal Sensor Supported SMBus Transactions .................................. 81
7.4.6 SMBus Thermal Sensor Registers ......................................................... 84
7.4.7 SMBus Thermal Sensor Alert Interrupt .................................................. 87
7.4.8 SMBus Device Addressing..................................................................... 88
7.4.9 Managing Data in the PIROM ................................................................ 89
Boxed Processor Specifications....................................................................................... 97
8.1
Introduction ......................................................................................................... 97
8.2
Mechanical Specifications ................................................................................... 98
8.2.1 Boxed Processor Heatsink Dimensions ................................................. 98
8.2.2 Boxed Processor Heatsink Weight....................................................... 104
8.2.3 Boxed Processor Retention Mechanism and Heatsink Supports......... 104
8.3
Thermal Specifications...................................................................................... 105
8.3.1 Boxed Processor Cooling Requirements ............................................. 105
8.3.2 Boxed Processor Contents .................................................................. 105
Debug Tools Specifications............................................................................................ 107
9.1
Logic Analyzer Interface (LAI) ........................................................................... 107
9.1.1 Mechanical Considerations .................................................................. 107
9.1.2 Electrical Considerations...................................................................... 107
8
9
4
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
Figures
2-1
2-2
2-3
2-4
2-5
3-1
3-2
3-3
3-4
3-5
3-6
3-7
6-1
6-2
7-1
7-2
8-1
8-2
8-3
8-4
8-5
8-6
8-7
On-Die Front Side Bus Termination .................................................................... 15
Phase Lock Loop (PLL) Filter Requirements ...................................................... 17
Dual-Core Intel
®
Xeon
®
Processor 7000 SeriesLoad
Current vs. Time.................................................................................................. 26
VCC Static and Transient Tolerance................................................................... 28
V
CC
Overshoot Example Waveform.................................................................... 29
Processor Package Assembly Sketch.................................................................33
Processor Package Drawing (Sheet 1 of 2) ........................................................ 34
Processor Package Drawing (Sheet 2 of 2) ........................................................ 35
Processor Topside Markings............................................................................... 38
Processor Bottom-Side Markings........................................................................ 38
Processor Pin-Out Coordinates, Top View.......................................................... 39
Processor Pin-Out Coordinates, Bottom View ....................................................40
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Thermal Profile A .................... 69
Case Temperature (TCASE) Measurement Location ......................................... 70
Stop Clock State Machine ................................................................................... 74
Logical Schematic of SMBus Circuitry ................................................................ 77
Passive Dual-Core Intel
®
Xeon
®
Processor 7000 Series
Thermal Solution (3U and Larger)....................................................................... 97
Top Side Board Keepout Zones (Part 1) ............................................................. 99
Top Side Board Keepout Zones (Part 2) ...........................................................100
Bottom Side Board Keepout Zones...................................................................101
Board Mounting-Hole Keepout Zones ...............................................................102
Thermal Solution Volumetric .............................................................................103
Recommended Processor Layout and Pitch .....................................................104
Tables
1-1
2-1
2-2
2-3
2-4
2-5
2-6
2-7
2-8
2-9
2-10
2-11
2-12
2-13
2-14
2-15
Features of the Dual-Core Intel
®
Xeon
®
Processor 7000 Series ........................ 12
Core Frequency to Front Side Bus Multiplier Configuration ................................ 16
BSEL[1:0] Frequency Table for BCLK[1:0].......................................................... 16
Voltage Identification (VID) Definition.................................................................. 19
Front Side Bus Pin Groups.................................................................................. 21
Signal Description Table ..................................................................................... 22
Signal Reference Voltages.................................................................................. 22
Processor Absolute Maximum Ratings ............................................................... 23
Voltage and Current Specifications ..................................................................... 24
VCC Static and Transient Tolerance................................................................... 27
V
CC
Overshoot Specifications ............................................................................. 28
Front Side Bus Differential BCLK Specifications................................................. 29
BSEL[1:0], VID[5:0], and DC Specifications........................................................ 30
VIDPWRGD DC Specifications ........................................................................... 30
AGTL+ Signal Group DC Specifications ............................................................. 30
PWRGOOD Input and TAP Signal Group DC Specifications.............................. 30
Dual-Core Intel
®
Xeon
®
Processor 7000 Series Datasheet
5
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