REVISION Q
"F" REF
"G" REF
YFS-XX-X3-X-XX-XSB-XX
No OF POSITIONS
-20, -30, -40, -50
(PER ROW)
OPTION
-K: KAPTON PAD
(SEE FIG 2, SHT 2)
-TR: TAPE & REEL
(SEE NOTE 17)
SOLDER BALLS
-SB: SOLDER BALL
(USE SDB-030-6337)
37% Pb/63% Sn
-MSB: MODIFIED SOLDER BALL
(USE SDB-030-9653, Pb
FREE,SEE NOTE 14)
96.5% S/3% Ag/0.5% Cu
DO NOT
SCALE FROM
THIS PRINT
.035 0.89 REF
((No OF POS -1) x .0500[1.270]))
.0020[.051]
"B"
C
"B"
REF
.145 3.68
REF
"A"
"A"
LEAD STYLE
-03: PIN / SOLDERBALLS
(USE C-140-03-X, SEE FIG 1)
-L3: PIN / SOLDERBALLS
(LOW INSERTION FORCE)
(USE C-226-03-X)
PLATING SPECIFICATION
-G: GOLD (USE C-XXX-03-G)
(SEE NOTE 7)
-H: HEAVY GOLD (USE C-XXX-03-H)
-E: EXTRA GOLD (USE C-XXX-03-E)
(SEE NOTE 7)
*
"A"
"B"
01
YFSP-XX-01-X
02
09 (PIN # = NO. OF ROWS +1)
C-XXX-03-X
'A'
ROW SPECIFICATION
-05: FIVE (USE YFSP-XX-01-F)
-08: EIGHT (USE YFSP-XX-01-E)
-10: TEN (USE YFSP-XX-01-T)
-06: SIX (USE YFSP-XX-01-6)
(AVAILABLE IN 20 POS ONLY)
-03: THREE (USE YFSP-XX-01-3)
(AVAILABLE IN 20 POS ONLY)
(SEE NOTE 17)
* = NOT ENGINEERING APPROVED
.134±.003 3.41±0.08
.104 2.64
REF
SDB-030-XXXX
.012 0.312
(SEE NOTE 9)
SECTION "B"-"B"
NOTES:
1.
C
REPRESENTS A CRITICAL DIMENSION.
2. NOTE DELETED.
3. MAXIMUM BURR ALLOWANCE: .0005[0.013]
4. MINIMUM PUSHOUT FORCE: .5 LB.
5. NOTE DELETED.
6. CONTACT TO BE FLUSH .002[0.05].
TO BE MEASURED AT ALL FOUR CORNERS.
7. ONE REEL MINIMUM PLATING REQUIREMENT
(85,000 CONTACTS PER REEL)
8. ALL DIMS TO BE SYMMETRICAL ABOUT THE
CENTERLINE WITHIN .001[0.03].
9. .0025[0.064] MAX VARIATION BETWEEN
SOLDERBALLS.
10. REFER TO VISUAL INSPECTION BOARD FOR
SOLDERBALL APPEARANCE CHECKS.
11. THE DISTANCE FROM THE CENTER OF ANY
SOLDERBALL TO THE CENTER OF ANY
ADJACENT INNER PEG SHALL BE
.025 .005[0.64 0.13].
12. NOTE DELETED.
13. NOTE DELETED.
14. CONTACT SAMTEC CES DEPARTMENT FOR
PROCESSING INFORMATION.
15. NOTE DELETED.
16. NO FLASH ALLOWED ON THE PIN TIPS.
17. IF -TR OPTION IS NOT SPECIFIED, PARTS TO BE
PACKAGED IN TRAYS. PARTS WITH -03 ROW
SPECIFICATION NOT VALID WITHOUT -TR OPTION.
SECTION "A"-"A"
.095 2.41
REF
YFS-20-X3-X-08-XSB SHOWN
FIG 1
IN-PROCESS WITHOUT SOLDERBALLS
SEE NOTE 6
UNLESS OTHERWISE SPECIFIED,
DIMENSIONS ARE IN INCHES.
TOLERANCES ARE:
DECIMALS
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
.XX: .01[.3]
.XXX: .005[.13]
.XXXX: .0020[.051]
ANGLES
2
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
MATERIAL:
DO NOT SCALE DRAWING
SHEET SCALE: 2.5:1
DETAIL 'A'
SCALE 5 : 1
INSULATOR: LCP, COLOR: BLACK
CONTACT: PHOS BRONZE
.050[1.27] MULTI-ROW SOCKET ASSEMBLY
SEE NOTE 16
F:\DWG\MISC\MKTG\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW
YFS-XX-X3-X-XX-XSB-XX
4/22/99
SHEET
1
OF
2
BY:
KEVIN B
REVISION Q
-K: KAPTON PAD OPTION
YFS-20-X3-X-08-XSB-K SHOWN
FIG 2
"E"
.139 3.541
"D" .010[0.25]
"C"
F:\DWG\MISC\MKTG\YFS-XX-X3-X-XX-XSB-XX-MKT.SLDDRW
PROPRIETARY NOTE
THIS DOCUMENT CONTAINS INFORMATION
CONFIDENTIAL AND PROPRIETARY TO
SAMTEC, INC. AND SHALL NOT BE REPRODUCED
OR TRANSFERRED TO OTHER DOCUMENTS OR
DISCLOSED TO OTHERS OR USED FOR ANY
PURPOSE OTHER THAN THAT WHICH IT WAS
OBTAINED WITHOUT THE EXPRESSED WRITTEN
CONSENT OF SAMTEC, INC.
520 PARK EAST BLVD, NEW ALBANY, IN 47150
PHONE: 812-944-6733
FAX: 812-948-5047
e-Mail info@SAMTEC.com
code 55322
DESCRIPTION:
DWG. NO.
DO NOT SCALE DRAWING
SHEET SCALE: 2.5:1
.050[1.27] MULTI-ROW SOCKET ASSEMBLY
YFS-XX-X3-X-XX-XSB-XX
4/22/99
SHEET
2
OF
2
BY:
KEVIN B
Industrial Control Electronics
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