EEWORLDEEWORLDEEWORLD

Part Number

Search

M55342M12U1J00C-W

Description
Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1ohm, 50V, 5% +/-Tol, 300ppm/Cel, Surface Mount, 0603, CHIP
CategoryPassive components    The resistor   
File Size150KB,1 Pages
ManufacturerState of the Art Inc.
Download Datasheet Parametric View All

M55342M12U1J00C-W Overview

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 1ohm, 50V, 5% +/-Tol, 300ppm/Cel, Surface Mount, 0603, CHIP

M55342M12U1J00C-W Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1916842309
package instructionCHIP
Reach Compliance Codenot_compliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7.35
structureChip
JESD-609 codee4
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.46 mm
Package length1.58 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width0.81 mm
method of packingWAFFLE PACK
Rated power dissipation(P)0.1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance1 Ω
Resistor typeFIXED RESISTOR
size code0603
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfacePlatinum/Gold (Pt/Au)
Terminal shapeWRAPAROUND
Tolerance5%
Operating Voltage50 V
State of the Art, Inc.
Thick Film Chip Resistor
M55342/12 RM0603
GLASS
PASSIVATION
WRAPAROUND
TERMINATIONS
RESISTOR
FILM
96% ALUMINA CHIP
PERFORMANCE
TEMPERATURE RISE (°C)
Resistance Range
Tolerances
Maximum Power
Maximum Voltage
1
W
- 22M
W
1%, 2%, 5%, 10%
100 mW
50 Volts
CHARACTERISTICS*
M
K
±100
±0.5%
±0.25%
±0.25%
±0.25%
±0.5%
±0.5%
±0.5%
±300
±0.5%
±0.5%
±0.5%
±0.25%
±0.5%
±2.0%
±1.0%
POWER DISSIPATION
fiber epoxy board
ceramic board
TESTS
TCR (-55 to +125
°
C) in ppm/
°
C
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Soldering Heat
Moisture Resistance
Life, 2,000 Hours
High Temperature Exposure
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
*Maximum allowable change per MIL-PRF-55342,
typical change is 10% of these values.
PART NUMBERING
M55342 K 12 B 100D S - TR
PACKAGING CODE: TR = Tape & Reel W= Waffle Pack
PRODUCT LEVEL DESIGNATOR: M: 1% per 1000 hrs. R: 0.01% P: 0.1% S: 0.001% T: Space Level C: Non - ER
RESISTANCE AND TOLERANCE CODE:
Three significant digits, with a letter indicating the
decimal location, the tolerance, and the value range.
D: 1%
W
E: 1% K
W
F: 1% M
W
G: 2%
W
H: 2% K
W
T: 2% M
W
J: 5%
W
K: 5% K
W
L: 5% M
W
M: 10%
W
N: 10% K
W
P: 10% M
W
TERMINATION MATERIALS:
B: Solderable wraparound C: Epoxy bondable palladium/silver wraparound U: Epoxy bondable platinum/gold wraparound
W: Gold wire bondable
G: Gold wraparound
SIZE CODE: /12 = RM0603
TEMPERATURE CHARACTERISTIC: K: ± 100ppm M: ± 300ppm
PERFORMANCE SPECIFICATION MIL-PRF-55342
MECHANICAL
INCHES
MILLIMETERS
.092
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.062 (.058 - .070)
.032 (.027 - .037)
.018 (.010 - .033)
.010 (.007 - .017)
.014 (.010 - .020)
.034 (.030 - .038)
.00235 grams
1.58
0.81
0.46
0.25
0.36
0.86
(1.47 - 1.78)
(0.69 - 0.94)
(0.25 - 0.84)
(0.18 - 0.43)
(0.25 - 0.51)
(0.76 - 0.97)
.034
.030
.031
State of the Art, Inc.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004 Fax (814) 355-2714 Toll Free 1-800-458-3401
“Specifications subject to change without notice.”
www.resistor.com
04/09/08
TI 10W Wireless Power Solution
[p=25, null, left][font=微软雅黑, arial][color=#000000]无线电源系统包括充电板(发送器或主设备)和接收器(次级侧设备)。充电板和接收器接触时,两个器件中的线圈通过磁力作用耦合。电力通过耦合的电感 器(如空气磁芯变压器)从发送器传输至接收器。控制传输电量的方法是向主器件发送反馈通信(错误信号)以提高或降低电量。发送器线圈在大部分情况下都处于 断电状态,只...
灞波儿奔 Analogue and Mixed Signal
After installing ccs5.1, it cannot be opened
Hi everyone, my question is [b] after I installed it and set the default folder, why does it say an error has occurred and I can't open it? My path is in English and I'm really anxious. Please help me...
sbk100 Microcontroller MCU
Design of driving and impedance matching circuit for piezoelectric ultrasonic transducer
There is a serious impedance mismatch between the ultrasonic driving power supply and the ultrasonic transducer, resulting in low energy transmission efficiency between the two, and the transducer can...
bingzhi Analog electronics
When connecting to remote SQL Server 2005 in Windows CE, an error message "PlatformNotSupportedException" appears. Please help!
The situation is like this, I want to use window ce to connect to remote sql server 2005 but a PlatformNotSupportedException occurs. The same code works when tested under windows program! My developme...
wc8114994 Embedded System
ALTERA FPGA DDR2 controller pin definition problem
Now I am making a DDR2 controller using CYCLONE III series EP3C55. I am using an 8-bit DDR2 chip. In FPGA, I use the IO port of bank2 as the pin interface output of DDR2. The pins of DDR2 are connecte...
zxhan2002 FPGA/CPLD
Buying-LED electronic lucky wall lottery module
Hello everyone, I want to buy a batch of LED electronic lucky wall lottery modules, which require an external touch switch to control 12 5V or 12V LED lights. Each time the switch is pressed, the LED ...
沣记168 Buy&Sell

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1892  1919  2602  1908  869  39  53  18  10  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号