19-5348; Rev 2; 1/12
AVAILAB
LE
78M6613
Single-Phase
AC Power Measurement IC
DATA SHEET
DS_6613_018
DESCRIPTION
The Teridian™ 78M6613 is a highly integrated IC for
simplified implementation of single-phase AC power
measurement into power supplies, smart appliances, and
other applications with embedded AC load monitoring and
control. It is packaged in a small, 5mm x 5mm, 32-pin QFN
package for optimal space savings.
At the measurement interface, the device provides four
analog inputs for interfacing to voltage and current sensors.
Voltages from the sensors are fed to our Single Converter
Technology® that uses a 22-bit delta-sigma ADC,
independent 32-bit compute engine (CE), digital
temperature compensation, and precision voltage
references to provide better than 0.5% power measurement
accuracy over a wide 2000:1 dynamic range.
The integrated MPU core and 32 KB of flash memory
provides a flexible means of configuration, post-processing,
data formatting, and interfacing to any host processor
through the UART interface and/or DIO pins. Complete
application firmware is available and can be preloaded into
the IC during manufacturing test. Alternatively, a complete
array of ICE, development tools, and programming libraries
are available to allow customization for each application.
LIVE
NEUT
FEATURES
•
< 0.5% Wh Accuracy Over Wide 2000:1
Current Range and Over Temperature
•
Voltage Reference < 40ppm/°C
•
Four Sensor Inputs—V3P3A Referenced
•
22-Bit Delta-Sigma ADC with Independent
32-Bit Compute Engine (CE)
•
8-Bit MPU (80515), One Clock Cycle per
Instruction with 2KB MPU XRAM
•
32KB Flash with Security
•
Integrated In-Circuit Emulator (ICE) Interface
for MPU Debug
•
32kHz Time Base with Hardware Watchdog
Timer
•
UART Interface and Up to 10 General-
Purpose 5V Tolerant I/O Pins
•
Packaged in a RoHS-Compliant (6/6)
Lead(Pb)-Free, 32-Pin QFN (5mm x 5mm)
•
Complete Application Firmware Provides:
o
True RMS Calculations for Current,
Voltage, Line Frequency, Real Power,
Reactive Power, Apparent Power, and
Power Factor
o
Accumulated Watt-Hours, Kilowatt-Hours
o
Intelligent Switch Control at Zero
Crossings
o
Digital Temperature Compensation
o
Phase Compensation (±15°)
o
Quick Calibration Routines
o
46–64Hz Line Frequency Range with
Same Calibration
Functional Diagrams
Earth Ground
Isolated Supply
CONVERTER
A0
A1
A2
A3
V3P3
GND
TERIDIAN
78M6613
2KB RAM
32KB
FLASH
32-bit
COMPUTE
ENGINE
80515
MPU
REGULATOR
DIO, PULSE
DIO 4-8
DIO 14-17, 19
VOLTAGE REF
VREF
TEMP
SENSOR
OSC/PLL
XIN
SERIAL PORT
TX
RX
ICE
V3P3
GND
ICE_E
XOUT
Pin Configurations appear at end of data
TIMERS
sheet.
Functional Diagrams continued at end of data sheet.
Teridian is a trademark and Single Converter Technology
UCSP is a trademark of Maxim Integrated Products, Inc.
is a
32 kHz
registered trademark of Maxim Integrated Products, Inc.
For pricing, delivery, and ordering information, please contact Maxim Direct
at 1-888-629-4642, or visit Maxim’s website at www.maximintegrated.com.
78M6613 Data Sheet
DS_6613_018
Table
of Contents
1
Hardware Description.................................................................................................................... 5
1.1 Hardware Overview ................................................................................................................ 5
1.2 Analog Front End (AFE) .......................................................................................................... 6
1.2.1 Input Multiplexer.......................................................................................................... 6
1.2.2 A/D Converter (ADC) .................................................................................................. 6
1.2.3 FIR Filter ..................................................................................................................... 6
1.2.4 Voltage References ..................................................................................................... 6
1.2.5 Temperature Sensor ................................................................................................... 7
1.2.6 Functional Description ................................................................................................. 7
1.3 Digital Computation Engine (CE) ............................................................................................ 8
1.4 80515 MPU Core .................................................................................................................... 8
1.4.1 UART .......................................................................................................................... 8
1.4.2 Timers and Counters ................................................................................................... 9
1.5 On-Chip Resources................................................................................................................. 9
1.5.1 Oscillator ..................................................................................................................... 9
1.5.2 PLL and Internal Clocks .............................................................................................. 9
1.5.3 Temperature Sensor ................................................................................................... 9
1.5.4 Flash Memory ............................................................................................................. 9
1.5.5 Digital I/O .................................................................................................................. 10
1.5.6 Hardware Watchdog Timer........................................................................................ 10
1.5.7 Program Security ...................................................................................................... 10
1.5.8 Test Ports.................................................................................................................. 10
Functional Description ................................................................................................................ 11
2.1 Theory of Operation .............................................................................................................. 11
2.2 Reset Behavior ..................................................................................................................... 12
2.3 Data Flow ............................................................................................................................. 12
2.4 CE/MPU Communication ...................................................................................................... 13
Application Information .............................................................................................................. 14
3.1 Connection of Sensors (CT, Resistive Shunt)........................................................................ 14
3.2 Temperature Measurement ................................................................................................... 15
3.3 Temperature Compensation.................................................................................................. 15
3.4 Connecting 5V Devices......................................................................................................... 16
3.5 UART (TX/RX) ...................................................................................................................... 16
3.6 Reset Function and Reset Pin Connections........................................................................... 16
3.7 Connecting the Emulator Port Pins ....................................................................................... 18
3.8 Crystal Oscillator................................................................................................................... 19
3.9 Flash Programming .............................................................................................................. 19
3.10 MPU Firmware Library .......................................................................................................... 19
3.11 Measurement Calibration ...................................................................................................... 19
Electrical Specifications ............................................................................................................. 20
4.1 Absolute Maximum Ratings .................................................................................................. 20
4.2 Recommended External Components ................................................................................... 21
4.3 Recommended Operating Conditions.................................................................................... 21
4.4 Performance Specifications .................................................................................................. 21
4.4.1 Input Logic Levels ..................................................................................................... 21
4.4.2 Output Logic Levels .................................................................................................. 21
4.4.3 Supply Current .......................................................................................................... 22
4.4.4 Crystal Oscillator ....................................................................................................... 22
4.4.5 VREF ........................................................................................................................ 22
4.4.6 ADC Converter, V3P3 Referenced ............................................................................ 23
4.4.7 Temperature Sensor ................................................................................................. 23
2
3
4
DS_6613_018
78M6613 Data Sheet
4.5
Timing Specifications............................................................................................................ 24
4.5.1 RAM and Flash Memory ............................................................................................ 24
4.5.2 RESET ...................................................................................................................... 24
4.5.3 Typical Performance Data ......................................................................................... 25
5
Packaging .................................................................................................................................... 26
5.1 Pinout ................................................................................................................................... 26
5.2 Package Outline (QFN 32) .................................................................................................... 27
5.3 Recommended PCB Land Pattern for the QFN-32 Package ................................................. 28
Pin Descriptions .......................................................................................................................... 29
6.1 Power/Ground Pins ............................................................................................................... 29
6.2 Analog Pins .......................................................................................................................... 29
6.3 Digital Pins ........................................................................................................................... 30
I/O Equivalent Circuits ................................................................................................................ 31
Ordering Information................................................................................................................... 32
Contact Information .................................................................................................................... 32
6
7
8
9
Revision History .................................................................................................................................. 33
Figures
Figure 1: IC Functional Block Diagram .................................................................................................... 4
Figure 2: AFE Block Diagram .................................................................................................................. 7
Figure 3: Connecting an External Load to DIO Pins ............................................................................... 10
Figure 4: Voltage. Current, Momentary and Accumulated Energy .......................................................... 11
Figure 5: MPU/CE Data Flow ................................................................................................................ 12
Figure 6: MPU/CE Communication ........................................................................................................ 13
Figure 7: Resistive Voltage Divider........................................................................................................ 14
Figure 8: Resistive Current Shunt .......................................................................................................... 14
Figure 9: Current Transformer ............................................................................................................... 14
Figure 10: Connections for the RX Pin ................................................................................................... 16
Figure 11: 78M6613 External Reset Behavior........................................................................................ 17
Figure 12: MAX810S Connections to the 78M6613 ................................................................................ 17
Figure 13: Reset Generator Based On TL431 Shunt Regulator .............................................................. 18
Figure 14: External Components for the Emulator Interface .................................................................. 18
Figure 15: Wh Accuracy, 10 mA to 20 A at 120 V/60 Hz and Room Temperature Using a 4 mΩ
Current Shunt ....................................................................................................................... 25
Figure 16: Typical Measurement Accuracy over Temperature Relative to 25°C..................................... 25
Figure 17: 32-Pin QFN Pinout ............................................................................................................... 26
Figure 18: Package Outline (QFN 32).................................................................................................... 27
Figure 19: Recommended PCB Land Pattern Dimensions ..................................................................... 28
Figure 20: I/O Equivalent Circuits .......................................................................................................... 31
Table
Table 1: Inputs Selected in Regular and Alternate Multiplexer Cycles...................................................... 6
78M6613 Data Sheet
VREF
∆Σ
ADC
CONVERTER
VBIAS
MUX
VBIAS
V3P3
-
+
TEMP
VREF
FIR
DS_6613_018
V3P3A
GNDA
V3P3D
GNDD
A0
A1
A2
A3
MUX
CROSS
MUX
CTRL
CK32
VREF
XIN
XOUT
CKTEST
OSC
(32KHz)
RTCLK (32KHz)
MCK
PLL
CK32
32KHz
DIV
ADC
VOLT
REG
CKADC
4.9152MHz
4.9152MHz
CK_2X
CK_GEN
CKFIR
4.9152MHz
MUX_SYNC
CKCE
<4.9152MHz
CE RAM
(0.5KB)
STRT
CE
32 bit Compute
Engine
DATA
00-7F
MUX
DIO4
MEMORY SHARE
TEST
TEST
MODE
DIO5
DIO6
DIO7
DIO8
PROG
000-7FF
CE
CONTROL
1000-11FF
XFER BUSY
CE_BUSY
DIGITAL I/O
DIO14
DIO15
I/O RAM
DIO16
DIO17
DIO19
CKMPU
<4.9152MHz
RX
TX
UART
MPU
(80515)
SDCK
SDOUT
SDIN
DATA
0000-FFFF
2000-20FF
0000-07FF
MPU XRAM
(2KB)
PROG
0000-7FFF
MEMORY
SHARE
0000-
7FFF
FLASH
(32KB)
MPU_RSTZ
EMULATOR
PORT
E_RXTX
E_TCLK
E_RST (Open Drain)
TEST
MUX
TMUXOUT
RESET
E_RXTX
E_TCLK
E_RST
ICE_E
Figure 1: IC Functional Block Diagram
DS_6613_018
78M6613 Data Sheet
1
1.1
Hardware Description
Hardware Overview
The Teridian 78M6613 single-chip measurement unit integrates all primary functional blocks required to
embed solid-state AC power and energy measurement. Included on chip are:
•
•
•
•
•
•
•
An analog front end (AFE)
An independent digital computation engine (CE)
An 8051-compatible microprocessor (MPU) which executes one instruction per clock cycle (80515)
A voltage reference
A temperature sensor
RAM and Flash memory
A variety of I/O pins
Current sensor technologies supported include Current Transformers (CT) and Resistive Shunts.
In a typical application, the 32-bit compute engine (CE) of the 78M6613 sequentially processes the
samples from the voltage inputs on pins A0, A1, A2, A3 and performs calculations to measure active
2
2
energy (Wh), reactive energy (VARh), A h, and V h for four-quadrant measurement. These
measurements are then accessed by the MPU, processed further and output using the peripheral
interfaces available to the MPU.
In addition to the temperature-trimmed ultra-precision voltage reference, the on-chip digital temperature
compensation mechanism includes a temperature sensor and associated controls for correction of
unwanted temperature effects on measurement. Temperature dependent external components such as
crystal oscillator, current transformers (CTs), and their corresponding signal conditioning circuits can be
characterized and their correction factors can be programmed to produce measurements with
exceptional accuracy over the industrial temperature range, if desired.
A block diagram of the IC is shown in
Figure 1.
A detailed description of various functional blocks
follows.
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