EEWORLDEEWORLDEEWORLD

Part Number

Search

B0202GG-02-2521-C

Description
Fixed Resistor, Thin Film, 0.25W, 2520ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP
File Size381KB,3 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

B0202GG-02-2521-C Overview

Fixed Resistor, Thin Film, 0.25W, 2520ohm, 100V, 0.25% +/-Tol, 50ppm/Cel, Surface Mount, 0202, CHIP

B0202GG-02-2521-C Parametric

Parameter NameAttribute value
Objectid1579399355
package instruction, 0202
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTRAY
Rated power dissipation(P)0.25 W
Rated temperature70 °C
resistance2520 Ω
Resistor typeFIXED RESISTOR
size code0202
surface mountYES
technologyTHIN FILM
Temperature Coefficient50 ppm/°C
Terminal shapeONE SURFACE
Tolerance0.25%
Operating Voltage100 V
Wire Bondable
Chip Resistors
WBC Series
Discrete or tapped schematics
MIL inspection available
High resistor density
IRC’s WBC series wire bondable chip resistors are ideally suited for
the most demanding hybrid application. The WBC combines IRC’s
TaNSil
®
tantalum nitride thin film technology with silicon substrate processing to produce an extremely small
footprint device with the proven stability, reliability and moisture performance of IRC’s TaNSil
®
resistor film.
Available in a wide range of tolerances and temperature coefficients to fit a variety of hybrid circuit applica-
tions. Custom resistance values, sizes and schematics are available on request from the factory.
Physical Data
R0202 - Discrete
(0.508mm ±0.025)
0.020˝ ±0.001
Electrical Data
Absolute Tolerance
Absolute TCR
Package Power Rating
(@ 70°C)
Rated Operating Voltage
(not to exceed P x R )
Operating Temperature
Back contact
Noise
R
Top contact
pad chamfered
0.004˝ min bond pad size
to ±0.1%
to ±25ppm/°C
250mW
100V
-55°C to +150°C
<-30dB
Oxidized Silicon
(10KÅ SiO
2
min)
0.010˝ ±0.001
(0.254mm ±0.025)
10KÅ minimum
15KÅ minimum
Silicon
(Al / Au optional)
3KÅ Au minimum
10KÅ Al minimum
Silicon Dioxide or
Silicon Nitride
R
0.004˝ min bond pad size
0.020˝ ±0.001
(0.508mm ±0.025)
B0202 - Discrete back contact
(0.508mm ±0.025)
0.020˝ ±0.001
Substrate Material
Top contact
Substrate Thickness
Aluminum
Gold
R0202 and
T0303
B0202
0.020˝ ±0.001
(0.508mm ±0.025)
T0303 - Tapped network ½R + ½R
Bond Pad
Metallization
(0.762mm ±0.025)
0.030˝ ±0.001
½R
½R
Backside
0.030˝ ±0.001
(0.762mm ±0.025)
0.004˝ min bond pad size
Passivation
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
© IRC Advanced Film Division
• Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
WBC Series Issue January 2009 Sheet 1 of 3
max1241
[i=s] This post was last edited by paulhyde on 2014-9-15 09:47 [/i] Attached is the assembly program and PDF of max1241 (12-bit A/D)...
shuzaizhang Electronics Design Contest
How can I make CCS support C5506?
The chip I have now is TMS320VC5506, but in CCS Setup, the only C55xx series emulators (i.e. Available Factory Boards) that can be selected are C5502 XDS510 Emulator C5509 XDS510 Emulator C5509A XDS51...
sypiii DSP and ARM Processors
Urgently looking for experts to solve the 714MHz RF problem, 1500 yuan cash reward
[size=16px][/size][color=#0000FF]We have a CMMB receiver that uses Siano's SM1180 chip. The sensitivity of the whole machine is quite high, with an index of -97dbm. However, it is currently found that...
kim0713 Embedded System
After CC2530 is loaded with ZStack protocol stack, how much CODE space is left to store a large array?
Hello everyone, I want to know how much CODE space is left after CC2530 is loaded with ZStack protocol stack, and what is the maximum length of an array that can be stored?...
XUMENGJIE Wireless Connectivity
Please help me if uln2803 pin 9 (ground) is connected to 1 2 3 4 5 6 7 8 when it is not powered on
Please help me if uln2803 pin 9 (ground) is connected to 1 2 3 4 5 6 7 8 when it is not powered on...
529309659 51mcu
ARM
Internal register R0=6, R1=5, R2=0X1234, the value at external memory address 0x1234 is 12, the value at 0X1238 is 7, the value at 0X123C is 10, solve the following questions: (30 points) 1. MOV R0, R...
smilel3l4 Embedded System

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1056  850  2610  982  1041  22  18  53  20  21 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号