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PPS1100-R430J

Description
RESISTOR, METAL GLAZE/THICK FILM, 1 W, 5 %, 100 ppm, 0.43 ohm, SURFACE MOUNT, 2010
File Size202KB,2 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

PPS1100-R430J Overview

RESISTOR, METAL GLAZE/THICK FILM, 1 W, 5 %, 100 ppm, 0.43 ohm, SURFACE MOUNT, 2010

PPS1100-R430J Parametric

Parameter NameAttribute value
Objectid1053812103
package instruction, 2010
Reach Compliance Codeunknown
Other featuresFLAME PROOF
Manufacturer's serial numberPPS-1
Installation featuresSURFACE MOUNT
Maximum operating temperature150 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR
Rated power dissipation(P)1 W
Rated temperature70 °C
resistance0.43 Ω
Resistor typeFIXED RESISTOR
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Terminal shapeFLAT
Tolerance5%
Operating Voltage350 V
Metal Glaze
Power Pack
Surface Mount High Power
Density Ceramic Package
PPS-1 Series
Low inductance
0.1Ω to 348KΩ range
Superior surge handling capability
150°C maximum operating temperature
1 Watt performance - standard 2010 footprint
Flameproof ceramic package provides superior temperature rise profile
Electrical Data
Size
IRC
Type
PPS-1
Maximum
Power Rating
1W
Working
Voltage¹
350
Maximum
Voltage
700
Resistance Range
(ohms)
0.1 to 0.99
1.0 to 348K
Tolerance
(±%)²
1, 2, 5
1, 2, 5
TCR
(ppm/°C)²
100
50, 100
2010
¹Not to exceed (
P x R )
½
.
²Consult factory for tighter tolerances and TCRs.
Applications
The PPS-1 will dissipate 1 watt at 70°C on a 2010 footprint. The PPS-1 is recommended for applications where
board real estate or component/board TCE mismatch is a major concern. It is also recommended in circuits
where a standard 2010 resistor exhibits marginal or unacceptable performance due to high power density/surge
handling demands.
Environmental Data
Characteristic
Thermal Shock
Low Temperature Operation
Short Time Overload
High Temperature Exposure
Resistance to Bonding Exposure
Solderability
Moisture Resistance
Life Test
Terminal Adhesion Strength
Resistance to Board Bending
Maximum Change
±(0.5% + 0.01 ohm)
±(0.25% + 0.01 ohm)
±(1.0% + 0.01 ohm)
±(0.5% + 0.01 ohm)
±(0.25% + 0.01 ohm)
95% minimum coverage
±(0.5% + 0.01 ohm)
±(1.0% + 0.01 ohm)
±(1% + 0.01 ohm)
±(1% + 0.01 ohm)
Test Method
MIL-R-55342E Par 4.7.3 (-65°C + 150°C, 5 cycles)
MIL-R-55342E Par 4.7.4 (-65°C @ working voltage)
MIL-R-55342E Par 4.7.5 (2.5 x (PxR)
½
MIL-R-55342E Par 4.7.6 (+150°C for 100 hours)
MIL-R-55342E Par 4.7.7 (Reflow soldered to board @ 260°C
for 10 seconds)
MIL-STD-202, Method 208 (245°C for 5 seconds)
MIL-R-55342E Par 4.7.8 (10 cycles, total 240 hours)
MIL-R-55342E Par 4.7.10 (2000 hours @ 70°C intermittent)
1200 gram push from underside of mounted chip for 60
seconds
Chip mounted in center of 90mm long board, deflected 5mm
so as to exert pull on chip contacts for 10 seconds
General Note
IRC reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own data and is considered accurate at time of going to print.
Wire and Film Technologies Division
• 4222 South Staples Street • Corpus Christi Texas 78411 USA
Telephone: 361 992 7900 • Facsimile: 361 992 3377 • Website: www.irctt.com
A subsidiary of
TT electronics plc
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