EEWORLDEEWORLDEEWORLD

Part Number

Search

S2010CPZ100G30-TR

Description
Fixed Resistor, Metal Glaze/thick Film, 1W, 10ohm, 150V, 2% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT
CategoryPassive components    The resistor   
File Size128KB,1 Pages
ManufacturerState of the Art Inc.
Environmental Compliance  
Download Datasheet Parametric View All

S2010CPZ100G30-TR Overview

Fixed Resistor, Metal Glaze/thick Film, 1W, 10ohm, 150V, 2% +/-Tol, 300ppm/Cel, Surface Mount, 2010, CHIP, ROHS COMPLIANT

S2010CPZ100G30-TR Parametric

Parameter NameAttribute value
Is it lead-free?Lead free
Is it Rohs certified?conform to
Objectid1617979985
package instructionSMT, 2010
Reach Compliance Codecompliant
Country Of OriginUSA
ECCN codeEAR99
YTEOL7
structureChip
JESD-609 codee4
Manufacturer's serial number2010
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature150 °C
Minimum operating temperature-65 °C
Package height0.71 mm
Package length5.13 mm
Package shapeRECTANGULAR PACKAGE
Package formSMT
Package width2.38 mm
method of packingTR
Rated power dissipation(P)1 W
Rated temperature70 °C
GuidelineMIL-PRF-55342
resistance10 Ω
Resistor typeFIXED RESISTOR
series2010(STD)-THICKFILM
size code2010
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient300 ppm/°C
Terminal surfaceGold (Au) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance2%
Operating Voltage150 V

S2010CPZ100G30-TR Preview

2010 Thick Film Chip Resistor
Standard Grade, Wraparound
PERFORMANCE CHARACTERISTICS
Resistance Range
Tolerances (1)
TCR
Thermal Resistance
Maximum Power
Maximum Voltage
(1)+/- 0.5% limited availability
1
W-40
M
W
0.5%,1%, 2%, 5%,10%
±100, ±200, ±300 ppm
48.4°C/W
1000 mW
150 Volts
GLASS
PASSIVATION
RESISTOR
FILM
96% ALUMINA CHIP
WRAPAROUND
TERMINATIONS
CURRENT NOISE
TEMPERATURE RISE (°C)
POWER DISSIPATION
fiber epoxy board
ceramic board
ENVIRONMENTAL PERFORMANCE (2)
Thermal Shock
Low Temperature Operation
Short-time Overload
Resistance to Bonding Exposure
Moisture Resistance
High Temperature Exposure
Life Test
±0.03%
±0.03%
±0.03%
±0.03%
±0.05%
±0.05%
See Chart
POWER DISSIPATION (WATTS)
LIFE TEST
POWER DERATING
(2)Typical resistance change, test methods and criteria
per MIL-PRF-55342.
PART NUMBERING
S 2010 C P X 150 J 20 - TR
PACKAGING CODE: - TR = Tape/Reel - W = Waffle Carrier (Default packaging is Bulk)
TEMPERATURE CHARACTERISTIC: 10: ±100 ppm 20: ±200 ppm 30: ±300 ppm
TOLERANCE: F: 1% G: 2% J: 5% K: 10% M: 20%
RESISTANCE VALUE:
Four digits are used for tolerances of 1% or lower, three digits are used above 1%. Leading digits are significant while the last digit
specifies the number of zeros to add. The letter "R" is used to represent the decimal for fractional ohmic values. Example: 5R6 is 5.6
ohms.
TERMINATION FINISH: X: Sn60 over Nickel (Solderable) C: Silver bearing (Epoxy bondable-RoHS) G: Gold (Epoxy bondable-RoHS)
Y: Silver over Nickel (Solderable -RoHS) Z: Gold over Nickel (Solderable-RoHS)
PRODUCT DESIGNATION: P: Thick film on alumina U: Untrimmed alumina (10% & 20% tolerance only)
TERMINATION TYPE: C: Wraparound termination
SIZE CODE
GRADE: S: Standard Production H: High Reliability (For Screening options, contact the factory)
MECHANICAL
INCHES
MILLIMETERS
.252
MINIMUM
RECOMMENDED
MOUNTING
PADS
(INCHES)
Length
Width
Thickness
Top Term
Bottom Term
Gap
Approx. Weight
.202 (.200 - .210)
.094 (.093 - .100)
.028 (.023 - .033)
.020 (.015 - .025)
.019 (.015 - .025)
.164 (.160 - .168)
.0323 grams
5.13
2.38
0.71
0.51
0.48
4.17
(5.08 - 5.33)
(2.36 - 2.54)
(0.58 - 0.84)
(0.38 - 0.64)
(0.38 - 0.64)
(4.06 - 4.27)
.100
.154
.049
“Specifications subject to change without notice.”
STATE OF THE ART, INC.
2470 Fox Hill Road, State College, PA 16803-1797
Phone (814) 355-8004
www.resistor.com
Fax (814) 355-2714
Toll Free 1-800-458-3401
02/08/08
Is it possible for two devices to communicate using analog I2C at the same time?
There are two devices, one is OLED and the other is clock chip. Both devices communicate with the microcontroller through analog I2C. Is there any conflict? For the design in the program, for example,...
emily_1105 MCU
Top 10 Tips for Embedded Software Testing
In the process of embedded software development, generally speaking, the time spent on testing and coding is 3:1 (maybe more in fact). This ratio will continue to decrease as your programming and test...
gtt Embedded System
"Celebrate the Dragon Boat Festival, Chip Coins can be exchanged for Zongzi!" The event gift exchange was successful.
Yesterday, I saw the forum [url=https://www.eeworld.com.cn/huodong/xinbi/duihuan.php] Welcome the Dragon Boat Festival, Xinbi can be exchanged for Zongzi! [/url] activity. I saw that the exchangeable ...
huaiqiao Talking
【Automotive Electronics Technical Data Summary】
《Friends who don’t need it or already have it can skip it. File format: PDF》 "I will post them in this order" 1 Schematic diagram of vehicle power inverter circuit 4 pages 2 Vehicle power 6 pages 3 Ov...
szwbrf1 Automotive Electronics
What is the difference between UWB, Bluetooth, Wi-Fi and RFID?
At first, UWB and Bluetooth may sound very similar. Bluetooth Low Energy (BLE) is a low-power radio system that has been used in beacons for ranging and measuring location, or at least that’s the prom...
石榴姐 RF/Wirelessly
Some security monitoring terms
Technical Terms ExplanationAC Alternating Current AMPS Amperemeter, an instrument that measures theflow of current Analog A continuous signal that passes from one frequency to another. Standard audio ...
jameswangsynnex Industrial Control Electronics

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 1402  706  493  2792  727  29  15  10  57  55 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号