FS32K146MST0MMHT datasheet, PDF

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FS32K146MST0MMHT: DescriptionMicrocontroller; CategoryThe embedded processor and controller Microcontrollers and processors; File Size1MB，70 Pages; ManufacturerNXP; Websitehttps://www.nxp.com

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Parameter Name	Attribute value
Objectid	145059640688
Reach Compliance Code	compliant

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NXP Semiconductors

Data Sheet: Product Preview

Document Number S32K1XX

Rev. 4, 06/2017

S32K1xx Data Sheet

Caution

• S32K148, S32K142, S32K146, and S32K116 specific

information is preliminary until these devices are

qualified.

Key Features

• Operating characteristics

– Voltage range: 2.7 V to 5.5 V

– Ambient temperature range: -40 °C to 105 °C for

HSRUN, -40 °C to 125 °C for RUN

• ARM™ Cortex-M4F/M0+ core, 32-bit CPU

– Supports up to 112 MHz frequency (HSRUN) with

1.25 Dhrystone MIPS per MHz

– ARM Core based on the ARMv7 Architecture and

Thumb®-2 ISA

– Integrated Digital Signal Processor (DSP)

– Configurable Nested Vectored Interrupt Controller

(NVIC)

– Single Precision Floating Point Unit (FPU)

• Clock interfaces

– 4 - 40 MHz fast external oscillator (SOSC)

– 48 MHz Fast Internal RC oscillator (FIRC)

– 8 MHz Slow Internal RC oscillator (SIRC)

– 128 kHz Low Power Oscillator (LPO)

– Up to 112 MHz (HSRUN) System Phased Lock

Loop (SPLL)

– Up to 50 MHz DC external square wave input clock

– Real Time Counter (RTC)

• Power management

– Low-power ARM Cortex-M4F/M0+ core with

excellent energy efficiency

– Power Management Controller (PMC) with multiple

power modes: HSRUN, Run, Stop, VLPR, and

VLPS

– Supports peripheral specific clock gating. Only

specific peripherals remain working in low power

modes.

S32K1XX

• Memory and memory interfaces

– Up to 2 MB program flash memory with ECC

– 64 KB FlexNVM for data flash memory with ECC

and EEPROM emulation

– Up to 256 KB SRAM with ECC

– Up to 4 KB of FlexRAM for use as SRAM or

EEPROM emulation

– Up to 4 KB Code cache to minimize performance

impact of memory access latencies

– QuadSPI with HyperBus™ support

• Mixed-signal analog

– Up to two 12-bit Analog-to-Digital Converter

(ADC) with up to 32 channel analog inputs per

module

– One Analog Comparator (CMP) with internal 8-bit

Digital to Analog Converter (DAC)

• Debug functionality

– Serial Wire JTAG Debug Port (SWJ-DP) combines

– Debug Watchpoint and Trace (DWT)

– Instrumentation Trace Macrocell (ITM)

– Test Port Interface Unit (TPIU)

– Flash Patch and Breakpoint (FPB) Unit

• Human-machine interface (HMI)

– Up to 156 GPIO pins with interrupt functionality

– Non-Maskable Interrupt (NMI)

• Communications interfaces

– Up to three Low Power Universal Asynchronous

Receiver/Transmitter (LPUART) modules with

DMA support and low power availability

– Up to three Low Power Serial Peripheral Interface

(LPSPI) modules with DMA support and low power

availability

– Up to two Low Power Inter-Integrated Circuit

(LPI2C) modules with DMA support and low power

availability

– Up to three FlexCAN modules (with optional CAN-

FD support)

– FlexIO module for flexible and high performance

serial interfaces

This document contains information on a product under development. NXP

reserves the right to change or discontinue this product without notice.

Preliminary

Table of Contents

Block diagram.................................................................................... 4

Feature comparison............................................................................ 5

Ordering parts.....................................................................................7

3.1 Determining valid orderable parts ............................................ 7

3.2 Ordering information ................................................................ 8

General............................................................................................... 9

4.1 Absolute maximum ratings........................................................9

4.2 Voltage and current operating requirements..............................10

4.3 Thermal operating characteristics..............................................11

4.4 Power and ground pins.............................................................. 12

4.5 LVR, LVD and POR operating requirements............................13

4.6 Power mode transition operating behaviors.............................. 14

4.7 Power consumption................................................................... 15

4.7.1

Modes configuration.................................................... 18

6.4.2

6.3.2

6.3.1.2

6.2.5

SPLL electrical specifications .....................................27

6.3 Memory and memory interfaces................................................27

6.3.1

Flash memory module (FTFC) electrical

specifications................................................................27

6.3.1.1

Flash timing specifications —

commands................................................ 27

Reliability specifications..........................29

QuadSPI AC specifications..........................................30

6.4 Analog modules......................................................................... 34

6.4.1

ADC electrical specifications...................................... 34

6.4.1.1

6.4.1.2

12-bit ADC operating conditions............. 34

12-bit ADC electrical characteristics....... 36

CMP with 8-bit DAC electrical specifications............ 37

6.5 Communication modules........................................................... 41

6.5.1

6.5.2

6.5.3

6.5.4

6.5.5

6.5.6

6.5.7

LPUART electrical specifications............................... 41

LPSPI electrical specifications.................................... 41

LPI2C electrical specifications.................................... 48

FlexCAN electical specifications.................................49

SAI electrical specifications........................................ 49

Ethernet AC specifications.......................................... 51

Clockout frequency......................................................54

4.8 ESD handling ratings.................................................................18

4.9 EMC radiated emissions operating behaviors........................... 18

I/O parameters....................................................................................18

5.1 AC electrical characteristics...................................................... 18

5.2 General AC specifications......................................................... 19

5.3 DC electrical specifications at 3.3 V Range.............................. 19

5.4 DC electrical specifications at 5.0 V Range.............................. 20

5.5 AC electrical specifications at 3.3 V range .............................. 21

5.6 AC electrical specifications at 5 V range ................................. 22

5.7 Standard input pin capacitance.................................................. 22

5.8 Device clock specifications....................................................... 22

Peripheral operating requirements and behaviors.............................. 23

6.1 System modules......................................................................... 23

6.2 Clock interface modules............................................................ 23

6.2.1

6.2.2

6.2.3

External System Oscillator electrical specifications....23

External System Oscillator frequency specifications . 25

System Clock Generation (SCG) specifications.......... 26

6.2.3.1

Fast internal RC Oscillator (FIRC)

electrical specifications............................ 26

6.2.3.2

Slow internal RC oscillator (SIRC)

electrical specifications ........................... 26

6.2.4

Low Power Oscillator (LPO) electrical specifications

......................................................................................27

6.6 Debug modules.......................................................................... 54

6.6.1

6.6.2

6.6.3

SWD electrical specofications .................................... 54

Trace electrical specifications......................................56

JTAG electrical specifications..................................... 57

Thermal attributes.............................................................................. 60

7.1 Description.................................................................................60

7.2 Thermal characteristics..............................................................60

7.3 General notes for specifications at maximum junction

temperature................................................................................ 64

Dimensions.........................................................................................65

8.1 Obtaining package dimensions ................................................. 65

Pinouts................................................................................................66

9.1 Package pinouts and signal descriptions....................................66

10 Revision History.................................................................................66

S32K1xx Data Sheet, Rev. 4, 06/2017

NXP Semiconductors

Preliminary

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