PH3n
High Performance Heat Spreader
Features
Gives a typical junction temperature reduction of 20ºC
Gives design flexibility
Die cut for custom shapes
Applications
Electronic components: IC / CPU / MOS
LED / M/B / P/S / Heat Sink / LCD-TV / Notebook PC / PC / Telecom Device /
Wireless Hub etc....
DDR II Module / DVD Applications / Hand-Set applications etc...
Properties
REACH Compliant
RoHS Compliant
Property
Colour
Thickness
Metal layer
PET layer thickness
Coating layer thickness
Metal layer thickness
Filler
Application temperature
Short time temp. @ 30sec
Low molecular weight Siloxane content
Heat emissivity coefficient
Dielectric strength (AV)
Metal layer thermal conductivity
Coated layer thermal conductivity
Black
0.062
CU foil
0.025
0.025
0.012
Nano tube
-30 to 120
200
0
0.96
›2
400
1.2
PH3n
Black
0.07
CU foil
0.025
0.025
0.02
Nano tube
-30 to 120
200
0
0.96
›2
400
1.2
Black
0.1
CU foil
0.025
0.025
0.02
Nano tube
-30 to 120
200
0
0.96
›2
400
1.2
Test Method
Visual
-
-
ADTM D374
-
-
-
-
-
-
ADTM D149
ADTM D149
ADTM D5470
ADTM D5470
Unit
-
mm
-
mm
mm
mm
-
ºC
ºC
ppm
1
kV
W/mk
W/mk
Available with an adhesive backing
PH3n 15 20 0.062/0.07
1. Part Number
2. Size X-Y-Z
Tel:
+44 20 8133 2062
Email:
sales@tglobaltechnology.com
Web:
www.tglobaltechnology.com
Skype:
tglobal.technology
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