Board Level
Heat Sinks
P/N: 833702T00000
TO-220
PRODUCT SPECIFICATIONS
• Devices: TO-220
• Size: 9.5 x 22.0 x 28.0mmm
• Material: Copper, 0.6mm thick
• Type: Stamped
• Finish: Tin Plate
• PCB Mounting: Solderable Tabs
• IC Mounting: Integrated Spring
• Package: Bulk
Air Velocity - LFM
0
100
Temp Rise Above Ambient -
o
C
(Mounting Surface)
80
60
40
20
0
0
1
2
3
4
5
Heat Dissipated - Watts
200
400
600
800
1000
Thermal Resistance -
o
C/ Watt
(Mounting Surface to Ambient)
10
8
6
4
2
0
FEATURES & BENEFITS
•
No Hardware Device Attachment
• Constant Spring Force Tension
• RoHS Compliant
CUSTOMIZED HEATSINKS
•
Specialized Tabs, Plating
•
Specialized Body Configurations
• Contact Applications Engineering
COMAIR ROTRON, INC
8929 Terman Court, San Diego, CA 92121
Ph (858) 348-6200 Fax (858) 566-4577
E-mail: sales@comairrotron.com,
Web: www.comairrotron.com
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