BD095-12G-F1-0350-0250-0570-LG datasheet, PDF

Datasheet> All Categories > The connector> The connector> BD095-12G-F1-0350-0250-0570-LG

BD095-12G-F1-0350-0250-0570-LG: DescriptionBoard Connector, 12 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Black Insulator,; CategoryThe connector The connector; File Size133KB，1 Pages; ManufacturerGlobal Connector Technology; Environmental Compliance

Download Datasheet Parametric View All

BD095-12G-F1-0350-0250-0570-LG Overview

Board Connector, 12 Contact(s), 2 Row(s), Male, Straight, 0.05 inch Pitch, Surface Mount Terminal, Black Insulator,

BD095-12G-F1-0350-0250-0570-LG Parametric

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Objectid	313665439
Reach Compliance Code	compliant
Country Of Origin	Mainland China
ECCN code	EAR99
YTEOL	9.4
Board mount options	PEG
body width	0.134 inch
subject depth	0.217 inch
body length	0.3 inch
Connector type	BOARD CONNECTOR
Contact to complete cooperation	AU ON NI
Contact completed and terminated	Tin (Sn) - with Nickel (Ni) barrier
Contact point gender	MALE
Contact material	COPPER ALLOY
contact mode	RECTANGULAR
Contact resistance	20 mΩ
Contact style	SQ PIN-SKT
Dielectric withstand voltage	300VAC V
Durability	100 Cycles
Insulation resistance	1000000000 Ω
Insulator color	BLACK
insulator material	LIQUID CRYSTAL POLYMER
JESD-609 code	e3
Plug contact pitch	0.05 inch
Match contact row spacing	0.05 inch
Installation method	STRAIGHT
Installation type	BOARD
Number of connectors	ONE
PCB row number	2
Number of rows loaded	2
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
PCB contact pattern	RECTANGULAR
PCB contact row spacing	4.8514 mm
Plating thickness	10u inch
Rated current (signal)	1 A
Guideline	UL
Terminal pitch	1.27 mm
Termination type	SURFACE MOUNT
Total number of contacts	12

Preview

Download Datasheet

View All

Global Connector Technology Ltd. - BD095: 1.27mm PITCH PIN HEADER, DUAL ROW, SURFACE MOUNT, VERTICAL

Ordering Grid

BD095

No. of Contacts

06 to 66

XX X

XXXX

SPECIFICATIONS

规格:

CURRENT RATING

电流额定值：

1 AMP

INSULATOR RESISTANCE

绝缘电阻值：

1000 MEGOHMS MIN.

DIELECTRIC WITHSTANDING

耐电压：

AC 300 V

CONTACT RESISTANCE

接触电阻值：

20m

Ω

Max.

OPERATING TEMPERATURE

工½温度：

-40°C TO +105°C

CONTACT MATERIAL

端子物料：

COPPER ALLOY

INSULATOR MATERIAL

绝缘½物料

: POLYESTER

聚酯

, LCP, UL94V-0

SOLDERING PROCESS

可焊性

LCP -

IR REFLOW

回流焊

: 260°C for 10 sec.

WAVE

波峰焊

: 250°C for 5-10 sec

MANUAL SOLDER

人工焊接

: 350°C for 3-5 sec

MATES WITH

配套之母座

(SUBJECT TO PIN LENGTH

在端子长度适合的条件下

BD050

BD055

BD060

BD064

BD065

BD067

BD091

Contact Plating

A = Gold Flash All Over (Standard)

B = Selective Gold Flash Contact Area/

Tin On Tail

C = Tin All Over

G = 10µ" Gold Contact Area/Tin On Tail

H = 15µ Gold Contact Area/Tin On Tail

I = 30µ" Gold Contact Area/Tin On Tail

Locating Peg

0 = No Peg

1 = With Peg

Insulator Height "H"

A = 1.50mm (Standard)

K = 1.00mm

B = 2.00mm

Dimension D (1/100mm)

L = 2.50mm

(Post Height)

F = 3.00mm

Standard - 2.00mm = 0200

Standard - 3.50mm = 0350

or specify Dimension D

e.g. 2.50mm = 0250

Tolerances

(Except as noted)

Packing Options

B = Tape and Reel with Cap (Standard)

D = Tube (not available in 6, 8 & 10 Contacts)

E = Tube with Cap (not available in 6, 8 & 10 Contacts)

G = Plastic Box (only available in 6, 8 & 10 Contacts)

Insulator Material

L = LCP (Insulator H = A, B, L, F)

N = Nylon 6T (Insulator H = K)

Dimension F (1/100mm)

(Width of Footprint)

Standard - 5.70mm = 0570

or specify Dimension F

e.g. 2.50mm = 0250

Dimension E (1/100mm)

(PCB to Insulator)

Standard - 0.70mm = 0070

Minimum - 0.70mm = 0070

or specify Dimension E

e.g. 2.50mm = 0250

Part Number:-

Date:-

Dimensions in mm

ASE

INSULATOR

MATERIAL OPTION

REMOVED

BD095

Description:-

28 DEC 07

LYH

NO. CONTACTS &

PACKING OPTIONS

CHANGED

ASE

SOLDER TEMP &

MATES INFO.

UPDATED

ASE

INSULATOR MATERIAL

UPDATED FOR SPECIFIC

HEIGHT OPTIONS

CHANGES TO

STANDARD

DIMENSIONS

AJO

B2B PCN002

1.27mm HEADER

N6T REMOVAL

X. ± 0.30

X.X ± 0.20

X.XX ± 0.15

X.XXX ± 0.10

DRAWING

DETAIL

RELEASE

REV

DATE

28/12/07

CHANGE TO

PACKAGING

27/04/12

X.°±5°

.X°±2°

.XX°±1°

.XXX°±0.5°

1.27mm PITCH PIN HEADER, DUAL ROW,

SURFACE MOUNT, VERTICAL

Scale

NTS

www.gct.co

Drawn by

LYH

E & OE

20/05/09

27/07/09

07/08/09

08/12/09

31/05/12

18/03/13

Third Angle Projection

THIS DRAWING IS CONFIDENTIAL AND MUST NOT BE

COPIED OR DISCLOSED WITHOUT WRITTEN CONSENT

Revision

Material

See Note

Sheet No.

1/1

Recommended Resources

Do you understand the management and control of EMI and EMC?

Remote control transmitter circuit

M668 dimming control ASIC

Sensor amplification circuit diagram

noise canceling circuit

Computer motherboard circuit diagram 820 2_31

Make Magazine's Recommended Maker Holiday Gifts: [size=14px]Christmas is coming soon in the West, and Make magazine recommends a series of development boards for many enthusiasts, so that everyone can try various interesting things during the holida...; dcexpert DIY/Open Source Hardware

Looking for companies that develop small base stations (LTE), including BBU and RRH: Experts! I am now looking for domestic companies that develop small base stations (LTE), including BBU and RRH. But I don’t know which good companies are doing this. If you have any information in thi...; Libertyville RF/Wirelessly

Vacuum Problems of MEMS Devices: I have a MEMS device now, which has been packaged, but I don’t know how tight the device is. I would like to ask if there is any way to test it! ! Urgent, urgent! !...; xmulyf Test/Measurement

Does the digital IO of msp430 have anything to do with the CPU running speed?: I'm learning 430 recently and I have a question. When a certain IO port is used as input, should the input rate not be too fast? Should we wait until the CPU reads it before continuing to input, other...; archimedesh Microcontroller MCU

Learn LPC M0　: Study hard [[i] This post was last edited by haphard on 2012-10-13 15:56 [/i]]...; haphard NXP MCU

Explore RF challenges and solutions for the connected car: Modern cars have more computing power and technological complexity than smartphones. Therefore, interference between different technologies and RF signals in modern cars is a constant challenge for de...; alan000345 RF/Wirelessly

Shortcut: 00 01 02 03 04 05 06 07 08 09 0A 0C 0F 0J 0L 0M 0R 0S 0T 0Z 10 11 12 13 14 15 16 17 18 19 1A 1B 1C 1D 1E 1F 1H 1K 1M 1N 1P 1S 1T 1V 1X 1Z 20 21 22 23 24 25 26 27 28 29 2A 2B 2C 2D 2E 2F 2G 2K 2M 2N 2P 2Q 2R 2S 2T 2W 2Z 30 31 32 33 34 35 36 37 38 39 3A 3B 3C 3D 3E 3F 3G 3H 3J 3K 3L 3M 3N 3P 3R 3S 3T 3V 40 41 42 43 44 45 46 47 48 49 4A 4B 4C 4D 4M 4N 4P 4S 4T 50 51 52 53 54 55 56 57 58 59 5A 5B 5C 5E 5G 5H 5K 5M 5N 5P 5S 5T 5V 60 61 62 63 64 65 66 67 68 69 6A 6C 6E 6F 6M 6N 6P 6R 6S 6T 70 71 72 73 74 75 76 77 78 79 7A 7B 7C 7M 7N 7P 7Q 7V 7W 7X 80 81 82 83 84 85 86 87 88 89 8A 8D 8E 8L 8N 8P 8S 8T 8W 8Y 8Z 90 91 92 93 94 95 96 97 98 99 9A 9B 9C 9D 9F 9G 9H 9L 9S 9T 9W

Popular Components