DFN (Divider)
www.vishay.com
Vishay Dale Thin Film
Dual Flat No Lead Molded Precision Thin Film Divider,
Surface Mount Resistor Network
FEATURES
• 0.8 mm lead pitch
• MSL level 1 per J-STD-020
• Low profile 1 mm seated height
• Small size 4 mm x 4 mm size 50 % board
savings over SOIC packages
• Low TCR ± 25 ppm, TCR tracking to ± 5 ppm
The DFN series of thin film precision dividers surface mount
resistor networks offer a wide ratio range that is listed in the
standard resistance offering table. The 4 mm x 4 mm
0.8 mm pitch dual flat no lead package feature 50 % savings
in board space over traditional SOIC packages. The DFN
dividers are ideal for applications that require tight TC
tracking and ratio tolerances over temperature.
• Material categorization: for definitions of compliance
please see
www.vishay.com/doc?99912
TYPICAL PERFORMANCE
ABSOLUTE
TCR
25
ABSOLUTE
TRACKING
5
RATIO
0.05
SCHEMATIC
8
7
6
5
TOL.
0.1
STANDARD RESISTANCE OFFERING
(R
1
/R
2
)
RATIO
R
1
100K
50K
25K
20K
10K
10K
10K
R
2
1K
1K
1K
1K
1K
2K
5K
100:1
50:1
25:1
20:1
10:1
5:1
2:1
R
1
R
2
R
2
R
1
1
2
3
4
STANDARD ELECTRICAL SPECIFICATIONS
TEST
Material
Pin/Lead Number
Resistance Range
TCR: Absolute
TCR: Tracking
Tolerance: Absolute
Tolerance: Ratio
Power Rating: Resistor
Power Rating: Package
Stability: Absolute
Stability: Ratio
Voltage Coefficient
Working Voltage
Operating Temperature Range
Storage Temperature Range
Noise
Thermal EMF
Shelf Life Stability: Absolute
Shelf Life Stability: Ratio
Revision: 28-May-15
SPECIFICATIONS
Passivated nichrome
8
1000
to 100 k per element
± 25 ppm/°C
± 5 ppm/°C
± 0.1 %
± 0.05 %
100 mW
100 mW x number of resistors
R
± 0.05 %
R
± 0.015 %
< 0.1 ppm/V
100 V max. not to exceed
-55 °C to +125 °C
-55 °C to +150 °C
< - 30 dB
< 0.08 μV/°C
R
± 0.01 %
R
± 0.002 %
P
x
R
CONDITIONS
-
-
-
-55 °C to +125 °C
-55 °C to +125 °C
+25 °C
+25 °C
Maximum at +70 °C
Maximum at +70 °C
2000 h at +70 °C
2000 h at +70 °C
-
-
-
-
-
-
1 year at + 25 °C
1 year at + 25 °C
Document Number: 60110
1
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
DFN (Divider)
www.vishay.com
Vishay Dale Thin Film
DIMENSIONS AND IMPRINTING
in millimeters
4.000 ± 0.050
8
5
Part Number
to be 4 Characters
(1)
3.500 ± 0.050
Exposed Pad
0.300 ± 0.050
5
6
7
8
0.800 BSC
4.000 ± 0.050
DFNA
xxxx
MMYY
Date
Code
(MMYY)
4
3
2
1
2.700 ± 0.050
Exposed Pad
Pin 1 Dot
by Marking
1
4
0.400 ± 0.050
2.400
Ref.
BOTTOM VIEW
Pin 1 Indentification
Chamfer 0.300 x 45°
(4 mm x 4 mm)
TOP VIEW
A
A
Max.
Nom.
Min.
0.900
0.850
0.800
0.000 - 0.050
SIDE VIEW
0.203 Ref.
Notes
(1)
100-1 resistance ratio part marking to be 100-
(2)
Contact factory for package outlines for higher pin count or custom configurations
MECHANICAL SPECIFICATIONS
Resistive Element
Substrate Material
Body
Terminals
Plating
Marking Resistance to Solvents
Passivated nichrome
Ceramic
Molded epoxy
Copper alloy
100 % matte tin
Per MIL-PRF-914
GLOBAL PART NUMBER INFORMATION
D
GLOBAL MODEL
(4 digits)
DFNA
(Lead (Pb)-free)
(e3)
F
N
A
5
-
1
U
F
RESISTANCE
(3, 4 or 5 digits)
2-1
5-1
10-1
20-1
25-1
50-1
100-1
PACKAGING
TAPE AND REEL
T0
= 100 min., 100 mult
T1
= 1000 min., 1000 mult
(3)
T3
= 300 min., 300 mult
T5
= 500 min., 500 mult
TF
= Full reel 3000
TS
= 100 min., 1 mult
UF
= TUBED
(3)
Note
Preferred packaging code
Revision: 28-May-15
Document Number: 60110
2
For technical questions, contact:
thinfilm@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
Vishay
Disclaimer
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Revision: 08-Feb-17
1
Document Number: 91000