Philips Semiconductors
Product specification
High-speed diode
FEATURES
•
Very small plastic SMD package
•
High switching speed: max. 4 ns
•
Continuous reverse voltage:
max. 75 V
•
Repetitive peak reverse voltage:
max. 85 V
•
Repetitive peak forward current:
max. 500 mA.
APPLICATIONS
•
High-speed switching in e.g.
surface mounted circuits.
3
Top view
Marking code:
JC.
2
BAL74W
DESCRIPTION
The BAL74W is a high-speed
switching diode fabricated in planar
technology, and encapsulated in the
very small plastic SMD SOT323
package.
PINNING
PIN
1
2
3
DESCRIPTION
not connected
anode
cathode
2
1
1
n.c.
3
MAM081
Fig.1 Simplified outline (SOT323; SC-70) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
V
RRM
V
R
I
F
I
FRM
I
FSM
PARAMETER
repetitive peak reverse voltage
continuous reverse voltage
continuous forward current
repetitive peak forward current
non-repetitive peak forward current
square wave; T
j
= 25
°C
prior to
surge; see Fig.4
t = 1
µs
t = 1 ms
t=1s
P
tot
T
stg
T
j
Note
1. Device mounted on an FR4 printed-circuit board.
total power dissipation
storage temperature
junction temperature
T
amb
= 25
°C;
note 1
−
−
−
−
−65
−
4
1
0.5
200
+150
150
A
A
A
mW
°C
°C
see Fig.2; note 1
CONDITIONS
−
−
−
−
MIN.
MAX.
85
75
175
500
V
V
mA
mA
UNIT
1999 May 05
2
Philips Semiconductors
Product specification
High-speed diode
ELECTRICAL CHARACTERISTICS
T
j
= 25
°C
unless otherwise specified.
SYMBOL
V
F
PARAMETER
forward voltage
see Fig.3
I
F
= 1 mA
I
F
= 10 mA
I
F
= 50 mA
I
F
= 150 mA
I
R
reverse current
see Fig.5
V
R
= 25 V
V
R
= 75 V
V
R
= 25 V; T
j
= 150
°C
V
R
= 75 V; T
j
= 150
°C
C
d
t
rr
diode capacitance
reverse recovery time
f = 1 MHz; V
R
= 0; see Fig.6
when switched from I
F
= 10 mA
to I
R
= 10 mA; R
L
= 100
Ω;
measured at I
R
= 1 mA; see Fig.7
when switched from I
F
= 10 mA;
t
r
= 20 ns; see Fig.8
30
1
30
50
1.5
4
715
855
1
1.25
CONDITIONS
MAX.
BAL74W
UNIT
mV
mV
V
V
nA
µA
µA
µA
pF
ns
V
fr
forward recovery voltage
1.75
V
THERMAL CHARACTERISTICS
SYMBOL
R
th j-tp
R
th j-a
Note
1. Device mounted on an FR4 printed-circuit board.
PARAMETER
thermal resistance from junction to tie-point
thermal resistance from junction to ambient
note 1
CONDITIONS
VALUE
300
625
UNIT
K/W
K/W
1999 May 05
3
Philips Semiconductors
Product specification
High-speed diode
GRAPHICAL DATA
BAL74W
200
MGA887
handbook, halfpage
300
IF
MBG382
IF
(mA)
(mA)
(1)
(2)
(3)
200
100
100
0
0
100
T amb ( C)
o
0
200
0
1
VF (V)
2
Device mounted on an FR4 printed-circuit board.
(1) T
j
= 150
°C;
typical values.
(2) T
j
= 25
°C;
typical values.
(3) T
j
= 25
°C;
maximum values.
Fig.2
Maximum permissible continuous forward
current as a function of ambient
temperature.
Fig.3
Forward current as a function of forward
voltage.
10
2
handbook, full pagewidth
IFSM
(A)
MBG704
10
1
10
−1
1
Based on square wave currents.
T
j
= 25
°C
prior to surge.
10
10
2
10
3
tp (µs)
10
4
Fig.4 Maximum permissible non-repetitive peak forward current as a function of pulse duration.
1999 May 05
4
Embedded System
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