HB56G132B-6 datasheet, PDF - EEWORLD Datasheet

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HB56G132B-6: DescriptionFast Page DRAM Module, 1MX32, 60ns, CMOS, SIP-72; Categorystorage storage; File Size306KB，25 Pages; ManufacturerHitachi （Renesas ）; Websitehttp://www.renesas.com/eng/

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HB56G132B-6 Overview

Fast Page DRAM Module, 1MX32, 60ns, CMOS, SIP-72

HB56G132B-6 Parametric

Parameter Name	Attribute value
Maker	Hitachi （Renesas ）
Parts packaging code	MODULE
package instruction	SIMM, SSIM72
Contacts	72
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	FAST PAGE
Maximum access time	60 ns
I/O type	COMMON
JESD-30 code	R-XSMA-N72
memory density	33554432 bit
Memory IC Type	FAST PAGE DRAM MODULE
memory width	32
Number of functions	1
Number of ports	1
Number of terminals	72
word count	1048576 words
character code	1000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX32
Output characteristics	3-STATE
Package body material	UNSPECIFIED
encapsulated code	SIMM
Encapsulate equivalent code	SSIM72
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
power supply	5 V
Certification status	Not Qualified
refresh cycle	1024
Maximum seat height	25.4 mm
self refresh	NO
Maximum standby current	0.002 A
Maximum slew rate	0.34 mA
Maximum supply voltage (Vsup)	5.25 V
Minimum supply voltage (Vsup)	4.75 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	SINGLE
Base Number Matches	1

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HB56G232 Series, HB56G132 Series

2,097,152-word

32-bit High Density Dynamic RAM Module

1,048,576-word

32-bit High Density Dynamic RAM Module

ADE-203-701A (Z)

Rev.1.0

Dec. 27, 1996

Description

The HB56G232 is a 2M

32 dynamic RAM module, mounted 4 pieces of 16-Mbit DRAM (HM5118160)

sealed in SOJ package. The HB56G132 is a 1M

32 dynamic RAM module, mounted 2 pieces of 16-Mbit

DRAM (HM5118160) sealed in SOJ package. An outline of the HB56G232, HB56G132 is 72-pin single

in-line package. Therefore, the HB56G232, HB56G132 make high density mounting possible without

surface mount technology. The HB56G232, HB56G132 provide common data inputs and outputs.

Decoupling capacitors are mounted on the module board.

Features

•

72-pin single in-line package



Outline: 107.95 mm (Length)

25.40 mm (Height)

9.14/5.28 mm (Thickness)



Lead pitch: 1.27 mm

•

Single 5 V (±5%) supply

•

High speed



Access time: t

RAC

= 60 /70ns (max)

•

Low power dissipation



Active mode: 1.84/1.63 W (max) (HB56G232 Series)

1.79/1.58 W (max) (HB56G132 Series)



Standby mode (TTL): 42 mW (max) (HB56G232 Series)

(TTL): 21 mW (max) (HB56G132 Series)

(CMOS): 3.15 mW (max) (L-version) (HB56G232 Series)

(CMOS): 1.58 mW (max) (L-version) (HB56G132 Series)

•

Fast page mode capability

•

Refresh period



1024 refresh cycles: 16 ms

128 ms (L-version)

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