Temperature Measurement
SMD NTC Thermistors with Silver Palladium Termination, Size 0603
SMD NTC thermistors with silver palladium termination
Applications
I
Temperature measurement and compensation in
B57619
C 619
0,8±0,15
0,9 max.
1,6±0,15
Features
I
Silver palladium termination (AgPd)
I
Cost-effective
I
Suitable for wave and reflow soldering
Termination
0,35±0,15
–
–
–
–
hybrid circuits
data systems
telecom systems
automotive electronics
TNT0396-Y
Options
Alternative resistance ratings and resistance tolerance
<
5% available on request
Delivery mode
Cardboard tape, 180-mm reel, PU: 4000 pcs
Climatic category (IEC 60068-1)
Max. power at 25
°
C (on PCB)
Resistance tolerance
Rated temperature
B
value tolerance
Dissipation factor (on PCB)
Thermal cooling time constant (on PCB)
Heat capacity
P
25
∆
R
N
/R
N
T
N
∆
B/B
δ
th
1)
τ
c
1)
C
th
1)
Dimensions in mm
Approx. weight 6 mg
55/125/21
180
±
5 %,
±
10 %,
±
20 %
25
±
3%
approx. 3
approx. 4
approx. 12
mW
°
C
mW/K
s
mJ/K
R
25
No. of
R/T
characteristic
1010
1008
2001
B
25/50
K
3470
3480
3860
B
25/85
K
3510
3550
3890
B
25/100
K
3530
3560
3920
Ordering code
Ω
10 k
22 k
47 k
B57619C0103+060
B57619C0223+060
B57619C0473+060
+: J for
∆
R
N
/R
N
=
±
5 %
K for
∆
R
N
/R
N
=
±
10 %
M for
∆
R
N
/R
N
=
±
20 %
1) Depends on mounting situation
56
05/02
Temperature Measurement
SMD NTC Thermistors with Silver Palladium Termination, Size 0603
Reliability data
B57619
C 619
SMD NTC thermistors are tested in accordance with IEC 60068. The parts are mounted on a
standardized PCB in accordance with IEC 60539-1.
Test
Storage in
dry heat
Standard
IEC
60068-2-2
JIS C 0021
IEC
60068-2-3
JIS C 0022
IEC
60068-2-14
JIS C 0025
Test conditions
Storage at upper
category temperature
T:
(125
±
2)
°
C
t:
1000 h
Temperature of air: (40
±
2)
°
C
Relative humidity of air:
(93 +2/–3) %
Duration: 21 days
∆
R
25
/R
25
(typical)
<3%
Remarks
Storage in damp
heat, steady state
<3%
No visible
damage
Rapid temperature
cycling
Endurance
Lower test temperature: – 55
°
C < 3 %
Upper test temperature: 125
°
C
Number of cycles: 10
P
max
: 180 mW
T:
(65
±
2)
°
C
t:
1000 h
<5%
Solderability
IEC
60068-2-58
JIS C 0054
Solderability:
(215
±
3)
°
C / (3
±
0,3) s
(235
±
5)
°
C / (2
±
0,2) s
Resistance to soldering heat:
(260
±
5)
°
C / (10
±
1) s
95 % of
terminations
wetted
Resistance drift
after soldering
Reflow soldering profile
Wave soldering profile
<5%
57
05/02
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++49 89 636 09, FAX (0 89) 636-2 26 89
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