BT740 Series
Enhanced Class 1 Bluetooth v2.1 Module
Every BT740 series Bluetooth
®
module from Laird Technologies is designed to add
robust, long-range Bluetooth data connectivity to any device. Based on the
market-leading Cambridge Silicon Radio (CSR) BC04 chipset, BT740 modules
provide exceptionally low power consumption with outstanding Class 1 range via
18 dBm of transmit power. The modules support the latest Bluetooth Version 2.1
specification, including Secure Simple Pairing, which improves security and
enhances the ease of use for end customers. A broad range of Bluetooth profiles
such as Serial Port Profile (SPP) and other vital features make BT740 modules
superior to other Bluetooth modules.
With a compact footprint of 15.29 x 28.71 mm, the modules deliver maximum
range with a minimum size. Another integration advantage is the inclusion of a
complete Bluetooth protocol stack with support for multi-point connections and
numerous Bluetooth profiles, including Serial Port Profile (SPP), Human Interface
Device profile (HID), and Health Device Profile (HDP). BT740 modules are fully
qualified as a Bluetooth End Products, enabling designers to integrate the
modules in devices without the need for further Bluetooth Qualification.
An integrated AT command processor interfaces to the host system over a serial
port using an extensive range of AT commands. The AT command set abstracts
the Bluetooth protocol from the host application, saving many months of
programming and integration time. It provides extremely short integration times
for data oriented Bluetooth applications.
Included firmware provides programming support for multi-point applications
that use up to seven simultaneous data connections to and from the robust
BT740 module. A low-cost developer’s kit makes it easy for an OEM to integrate
the module and guarantees the fastest route to prototype and then mass
production.
Features & Benefits
Application Areas
Bluetooth v2.1
External or Internal Antennas
Comprehensive AT command set
Bluetooth EPL
Compact Footprint
Class 1 output - 18dBm
UART interfaces with GPIO & ADC
Industrial Temperature range
Multipoint Capabilities with up to 7
simultaneous connections
Medical devices
ePOS terminals
Automotive Diagnostic
Equipment
Barcode Scanners
Industrial Cable
Replacement
USA: +1.800.492.2320
Europe: +44.1628.858.940
Asia: +852.2923.0610
wirelessinfo@lairdtech.com
www.lairdtech.com/wireless
Full detailed product documentation is available at:-
http://www.lairdtech.com/Products/Embedded-Wireless-Solutions/Bluetooth-
Radio-Modules/BT700-Series/BT740/
The details contained within the document are subject to change.
BT740 Series
Enhanced Class 1 Bluetooth v2.1 Module
CATEGORIES
Wireless Specification
FEATURE
Bluetooth®
Frequency
Max Transmit Power
Receive Sensitivity
Range
Data Rates
UART Data Transfer Rate
Host Interface
UART
IMPLEMENTATION
V2.1
2.402 - 2.480 GHz
Class 1
18dBm from antenna
Better than -87dBm
Up to1000m
Up to 2.1Mbps (over the air)
Circa 350kbps
TX, RX, DCD, RI, DTR, DSR, CTS, RTS
Default 9600, n,8, 1
From 1,200 to 921,600bps
8 configurable lines
2 lines, 8 bit resolution
Serial Port Profile
Human Interface Device
Health Device Profile
AT Command Set - 1 connection
Multi-Point API - 7 simultaneous connections
Supply
I/O
Power Consumption
Antenna Options
Physical
Environmental
Miscellaneous
Development Tools
Approvals
Current
Internal
External
Dimensions
Operating
Lead Free
Warranty
Development Kit
Bluetooth®
FCC / IC / CE
3.3 – 5.0V
3.3V
Idle Mode – 1.25mA
Transmit (Max Data) – 35mA
Multilayer ceramic - BT740-SA
Connection via u.FL - BT740-SC
15.29 mm x 28.71 mm x 3 mm
-40C to +85C
Lead-free and RoHS compliant
1 Year
Development board and Software Tools
End Product Listing (EPL)
All BT740 Series
GPIO
ADC
Profiles
SPP
HID
HDP
Control Protocols
Supply Voltage
Ordering Information
BT740-SA
BT740-SC
DVK- BT740-SA
DVK- BT740-SC
Enhanced Class 1 Bluetooth v2.1 Module (internal antenna)
Enhanced Class 1 Bluetooth v2.1 Module ( u.FL connector)
Development Kit (internal antenna)
Development Kit (u.FL connector)
LWS-DS-BT740-0713
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and
application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies
materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the
Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2013 Laird Technologies, Inc. All Rights Reserv ed. Laird, Laird
Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be
the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
Electronics Design Contest
京公网安备 11010802033920号
EEWORLD
