IA
NT
Features
■
1008 size
■
Available in E12 series
■
High Q up to 80 typ.
■
High operating temperature of 125 °C
■
Lead free
Applications
Mobil phones
■
Cellular phones
■
CTV, VCR, HIC, FDD
■
*R
oH
S
CO
M
PL
CW252016 Series - High Q Chip Inductors
Electrical Specifications
Bourns Part No.
nH
Inductance
Tol.%
Q
min.
Test Freq. MHz
L
Q
SRF min.
MHz
RDC
ohms
I rms
mA max.
CW252016-10NK
CW252016-12NK
CW252016-15NK
CW252016-18NK
CW252016-22NK
CW252016-27NK
CW252016-33NK
CW252016-39NK
CW252016-47NK
CW252016-56NJ
CW252016-68NJ
CW252016-82NJ
CW252016-R10J
CW252016-R12J
CW252016-R15J
CW252016-R18J
CW252016-R22J
CW252016-R27J
CW252016-R33J
CW252016-R39J
CW252016-R47J
CW252016-R56J
CW252016-R68J
CW252016-R82J
CW252016-1R0J
CW252016-1R2J
CW252016-1R5J
CW252016-1R8J
CW252016-2R2J
CW252016-2R7J
CW252016-3R3J
CW252016-3R9J
CW252016-4R7J
10
12
15
18
22
27
33
39
47
56
68
82
100
120
150
180
220
270
330
390
470
560
680
820
1000
1200
1500
1800
2200
2700
3300
3900
4700
±10
±10
±10
±10
±10
±10
±10
±10
±10
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
±5
50
50
40
50
55
55
60
60
60
60
60
60
60
50
45
45
45
45
45
45
45
45
45
45
25
25
25
25
25
22
22
20
18
100
100
100
100
100
100
100
100
100
100
100
100
100
25
25
25
25
25
25
25
25
25
25
25
25
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
500
500
350
350
350
350
350
350
350
350
350
350
350
100
100
100
100
100
100
100
100
100
100
100
50
7.9
7.9
7.9
7.9
7.9
7.9
7.9
7.9
4100
3300
2500
2500
2400
1600
1600
1500
1500
1300
1300
1000
1000
950
850
750
700
600
570
500
450
415
375
350
290
250
200
160
160
70
55
48
43
0.08
0.08
0.08
0.10
0.10
0.10
0.10
0.10
0.10
0.12
0.15
0.18
0.18
0.20
0.22
0.33
0.45
0.75
0.90
1.20
1.19
1.33
1.47
1.61
1.75
2.00
2.30
2.60
2.80
1.70
1.90
2.10
2.30
600
600
500
600
600
600
600
600
600
600
600
600
500
500
500
500
500
500
500
400
470
400
400
360
330
280
280
270
250
195
185
180
175
General Specifications
Temperature Rise
...................40 ˚C max. at rated current
Operating Temperature
..................................-40 °C to +125 °C
Storage Temperature..-40 °C to +125 °C
Reflow Soldering ...230 °C, 50 sec. max.
Resistance to Soldering Heat
.................................260 ˚C, 5 seconds
Materials
Core Material ..................Ceramic/Ferrite
Wire ........Enamelled Copper (1W1E180)
Terminal............................Mo/Mn+Ni+Au
Packaging...................2,000 pcs per reel
Product Dimensions
0.5
(.020)
1.6
±
0.2
(.062
±
.008)
2.50
±
0.2
(.098
±
.008)
2.0
±
0.2
(.079
±
.008)
0.5
(.020)
0.5
(.020)
Recommended Layout
REF.
0.65
(.026)
0.65
REF.
(.026)
Packaging Specifications
178.0
(7.00)
DIA.
2.0
±
0.5
(.079
±
.020)
12.5
(.492)
21.0
±
0.8
(.827
±
.031)
13.0
±
0.5
(.512
±
.020)
DIA.
50.0
(1.969)
THICKNESS
0.10
(.004)
MAX.
EMBOSSED
CAVITY
REF.
1.20
(.047)
2.3
REF.
(.091)
DIMENSIONS:
MM
(INCHES)
13.0
±
0.5
DIA.
(.512
±
.020)
10.0
(.393)
EMBOSSED
CARRIER
8.0
(.315)
NOTE: 2 % TOLERANCE AVAILABLE FOR INDUCTANCE
RANGES OF 33 NH AND UP. REPLACE “J” OR
“K” WITH “G”.
REV. 06/05
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex
Specifications are subject to change without notice. • Customers should verify actual device performance in their specific applications.
Embedded System
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