EEWORLDEEWORLDEEWORLD

Part Number

Search

386844

Description
63/37 400 2% .015dia/28swg
CategoryTools and equipment   
File Size79KB,2 Pages
ManufacturerHenkel
Download Datasheet View All

386844 Overview

63/37 400 2% .015dia/28swg

Technical Data Sheet
C400
April-2011
PRODUCT DESCRIPTION
C400 provides the following product characteristics:
Technology
Product Benefits
Cored solder wire
• Halide free
• No clean
• Clear residue
• Good wetting
• Fast soldering
• Heat stable
• Mild odor
• Pb-free and SnPb alloys available
ROL0
Soldering - Cored wire
Copper, Brass and Nickel
IPC/J-STD-004
Classification
Application
Surface Finishes
Soldering Iron:
● Good results can be obtained using a range of tip
temperatures. However, the optimum tip temperature and
heat capacity required for a hand-soldering process is a
function of both soldering iron design and the nature of
the task.
● Care should be exercised to avoid unnecessarily high tip
temperatures for extensive periods of time.
● A high tip temperature may increase any tendency to flux
spitting and it may produce some residue darkening.
● The tip of the soldering iron should be properly tinned.
Severely contaminated soldering iron tips should be
cleaned with Multicore® Tip Tinner/Cleaner.
● Wipe the tip on a clean, damp sponge before re-tinning
with C400 wire.
Soldering Process:
1. Apply the soldering iron tip to the work surface. The iron
tip should contact both the base material and the lead at
the same time to heat both surfaces properly. It should
take no more than a fraction of a second to heat both
surfaces adequately.
2. Apply C400 flux cored wire to a part of the joint surface
away from the soldering iron and allow to form a joint
fillet. This will be virtually instantaneous. Do not apply
excessive solder to the joint as this will not improve joint
integrity and it will leave excess flux residues on the
surface.
3. Remove solder from the work piece and then remove the
iron tip.
4. The total process will be very rapid, depending upon
thermal mass, tip temperature, tip configuration and the
solderability of the surfaces to be joined.
5. The resin and flux systems are designed to leave
relatively low residues and to minimize residual activity.
This is achieved by ensuring some decomposition and
volatilization takes place during the soldering process
Cleaning:
C400 flux cored solder wire has been formulated to leave
amber flux residues and resist spitting and fuming. In most
industrial and consumer electronics applications, cleaning will
not be required. The product may, therefore, be used to
complement a no-clean wave soldering or reflow process or to
allow repairs to cleaned boards without the need for a second
cleaning process. In high-reliability applications, the residues
should be removed.
Should cleaning be required, this is best achieved using
SC-01™ cleaner.
C400 cored solder wire has been specially formulated to
complement no clean wave and reflow soldering processes.
C400 wires provide fast soldering on copper, brass, and solder
coated materials.
TYPICAL PROPERTIES
Solder Cored Wire
Alloys - Tin/lead
• SN63
• SN60
• SN62
• 97SC (SAC305)
• 96SC (SAC387)
• 99C (SnCu)
• 95A (SnSb)
• 96S (SnAg)
205 to 220 mg KOH/g
Zero
2.2
Alloys - Lead Free
Acid Value
Halide content
Flux Content (%)
ALLOYS:
The alloys used in C400 cored solder wires conform to the
purity requirements of the common national and international
standards.
FLUX:
C400 solid flux is based on modified rosin and carefully
selected activators. In practice they exhibit a mild rosin odor
and leave a small quantity of clear residue.
DIRECTIONS FOR USE
Soldering with C400 does not require any special methods or
deviation from standard hand soldering practices.
Brothers, please help Xiaodi.
Can the active crystal oscillator be divided? The crystal oscillator of the clock chip DS1302 needs to be connected to 32768HZ! There are none for sale!! I have to divide the frequency!...
hezhiwen MCU
Hardware Development Process and Specifications---Chapter 1 Overview
Chapter 1 Overview Section 1 Introduction to the Hardware Development Process § 1.1.1 Basic process of hardware development The basic process of hardware development: 1. Clarify the overall hardware r...
chenky Embedded System
Choose VHDL or Verilog HDL?
Choose VHDL or Verilog HDL? Before you choose, it is necessary to briefly introduce their general names: Hardware Description Language HDL (Hardware Describe Language) HDL Overview With the developmen...
eeleader FPGA/CPLD
MSP43-F149 ADC12 high frequency sampling problem
The manual says that the sampling frequency of 430F149 can be up to 200K. Is it configured by setting SHTO and SHT1? In addition, the pulse sampling mode is triggered by TIMEA-OUT1? I want to achieve ...
天空一 stm32/stm8
PRU controller for c2000
The PRU includes two independent real-time RISC cores (only about 40 instructions, for logic, arithmetic and flow control, etc.), which can be software-programmed to implement peripherals, access GPIO...
Jacktang Microcontroller MCU
Come and hear what NXP MCU experts have to say about LPCXpresso!
Inspired by zhaojun_xf's article, LPCXpresso -- Don't you feel anything about it? (A comprehensive and in-depth experience) https://bbs.eeworld.com.cn/thread-108322-1-1.html I just attended NXP's Beij...
soso NXP MCU

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 506  2895  2627  1063  1090  11  59  53  22  3 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号