Technical Data Sheet
WS200™
June-2009
PRODUCT DESCRIPTION
WS200™ provides the following product characteristics:
Application
Soldering
Cure
Reflow
Technology
Water Washable Solder Paste
WS200™ is a water washable solder paste for printing and
reflow in air or nitrogen atmospheres where process yield is
critical. WS200™ solder paste offers excellent open time and
good soldering activity over a wide range of reflow profiles and
surface finishes. WS200™ is available with Sn62 and Sn63
alloys.
FEATURES AND BENEFITS
● Effective over a wide range of printer cycle times and print
speeds
● Excellent printer open time and between print abandon
time
● Long component tack time
● Excellent slump resistance
● Effective over a wide range of reflow profiles in air or
nitrogen
● Residues removed with deionised water rinse
TYPICAL PROPERTIES
Solder Paste Typical Properties
Alloys
Sn62, Sn63
Alloy melting range (°C)
179, 183
Multicore Powder Size Coding
AGS
ANSI/J-STD-005
Type 3
Powder Particle Size, µm
20-45µ
Metal Loading (Weight %)
88.5
Brookfield Viscosity TF spindle, 25°C, 5rpm after 780,000
2 minutes, mPa∙s
Malcom Viscosity, P at 6 s
-1
@ 25°C
1,550
Thixotropic Index (Ti), 25°C
0.68
(Ti = log(viscosity @ 1.8s
-1
/ viscosity @ 18s
-1
)
Slump, J-STD-005, mm
IPC A21 Pattern
RT, 15 minutes
0.33 x 2.03 mm pads
0.15
0.63 x 2.03 mm pads
0.33
150°C, 15 minutes
0.33 x 2.03 mm pads
0.15
0.63 x 2.03 mm pads
0.33
Initial tack force, gF
Useful open time, hours
38.5
>24
DIRECTIONS FOR USE
Reflow:
WS200™ has been formulated for reflow in air over a wide
range of temperature profiles. The diagrams below show
example reflow profile that have been used successfully. Other
profiles may also give good results, depending on board design
factors.
Linear Profiles:
250
Temperature, °C
200
150
100
50
0
0
60
120
Time, seconds
180
240
300
360
420
Soak Profiles:
250
Temperature, °C
200
150
100
50
0
0
60
120
Time, seconds
180
240
300
360
High air flow rates give as even a temperature distribution as
possible. However, across the board, this may contribute to
exhaustion of paste activity. WS200™ combines excellent
printing characteristics with tolerance of hot profiles and high
air flow rates, although extreme (long & hot) profiles may still
give sub-optimal reflow and cleaning in some oven types.
As with all solder pastes, reflow may be carried out in nitrogen
if this is installed and this is likely to lessen the effects of long
hot profiles and high gas circulation rates.
Solder Powder:
Careful control of the atomisation process for production of
solder powders for WS200™ solder pastes ensures that the
solder powder is produced to a quality level that exceeds
IPC/J-STD-006 & EN29453 requirements for sphericity, size
distribution, impurities and oxide levels. Minimum order
requirements may apply to certain alloys and powder sizes, for
availability contact your local technical service helpdesk.
TDS WS200™, June-2009
Application:
WS200™ solder paste is designed for high volume stencil
printing applications with component lead pitches down to 0.4
mm with the AGS (Type 3) powder size. Conventional metal
blade squeegees may be used with a contact angle of 60° and
sweep speeds of 20 mm sec
-1
up to 100 mm sec
-1
. The best
printing performance will be obtained under these conditions.
The product can in some cases tolerate slow print cycle times
because the material resists drying on the stencil and therefore
blocking the stencil apertures. There are various methods for
testing the ability of a paste to perform after an extended idle
time on the stencil and each can produce different times before
printing deteriorates. In a real process environment, the paste
has been left idle for more than 1 hour and still produced a
perfect first print.
Component Placement:
The paste shows good tack behavior and is capable of holding
components in place before reflow. Components may be
placed several hours after printing, although this is naturally
dependent on the ambient conditions.
Cleaning:WS200™
residues are designed to be removed from
assemblies in an aqueous cleaner without the use of any
additional chemistries and/or saponifiers. Incomplete removal
of the residues can lead to reduced reliability of the device.
Hot deionised water is the preferred cleaning agent. Residues
are easily removed in batch and in-line aqueous cleaners even
up to 3 days after reflow. Cleaning of some assemblies is best
conducted in an ultrasonic bath. Tap water is not
recommended for rinsing since ionic impurities present in tap
water can lead to reduced reliability of the assembly.
RELIABILITY PROPERTIES
Solder Paste Medium:
WS200™ medium contains a stable resin system and includes
solvents with high boiling ranges. The formulation has been
tested to the requirements of the J-STD-004 and Telcordia
(formerly known as Bellcore) specifications.
Test
Surface Insulation
Resistance (with cleaning)
Electromigration (cleaned)
Specification
ANSI/J-STD-004
Telcordia GR-78-Core
Telcordia GR-78-Core
Results
Pass
Pass
Pass
DATA RANGES
The data contained herein may be reported as a typical value
and/or a range. Values are based on actual test data and are
verified on a periodic basis.
GENERAL INFORMATION
Note
The data contained herein are furnished for information only
and are believed to be reliable. We cannot assume
responsibility for the results obtained by others over whose
methods we have no control. It is the user's responsibility to
determine suitability for the user's purpose of any production
methods mentioned herein and to adopt such precautions as
may be advisable for the protection of property and of persons
against any hazards that may be involved in the handling and
use thereof. In light of the foregoing,
Henkel Corporation
specifically disclaims all warranties expressed or implied,
including warranties of merchantability or fitness for a
particular purpose, arising from sale or use of Henkel
Corporation’s products. Henkel Corporation specifically
disclaims any liability for consequential or incidental
damages of any kind, including lost profits.
The discussion
herein of various processes or compositions is not to be
interpreted as representation that they are free from
domination of patents owned by others or as a license under
any Henkel Corporation patents that may cover such
processes or compositions. We recommend that each
prospective user test his proposed application before repetitive
use, using this data as a guide. This product may be covered
by one or more United States or foreign patents or patent
applications.
Not for Product Specifications
The technical information contained herein is intended for
reference only. Please contact Henkel Technologies Technical
Service for assistance and recommendations on specifications
for this product.
Reference 0.1
PACKAGING
Containers:
WS200™ is supplied in:
● 500g plastic jars with an air seal insert
● 650g and 1300g Semco cartridges
Other packaging types may be available on request; please
contact your local technical service helpdesk for assistance.
Shelf Life:
Provided WS200™ is stored tighly sealed in the original
container at 0 to 10°C, a minimum shelf life of 6 months can be
expected. Air shipment is recommended to minimize the time
the containers are exposed to higher temperatures.
WS200™ solder paste has been formulated to reduce
separation on storage to a minimum but should it occur, gentle
stirring for 15 seconds will return the product to its correct
rheological performance
Henkel Americas
15350 Barranca Parkway
Irvine, Ca. 92618
+1 949 789 2500
Henkel Europe
Hemel Hempstead
Hertfordshire
HP2 4RQ United Kingdom
+44.1442.278.000
Henkel Asia
928 Zhangheng Rd. Zhangjiang Hi-Tech Park
Pudong New District Shanghai, 201203, P.R.China
+86.21.2891.8000
stm32/stm8
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