SLCF4GM1U datasheet, PDF - EEWORLD Datasheet

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SLCF4GM1U: DescriptionMemory module 4G 3.3-5V; Categorysemiconductor Other integrated circuit (IC); File Size1MB，39 Pages; ManufacturerSTEC; Environmental Compliance

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SLCF4GM1U Overview

Memory module 4G 3.3-5V

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128MB to 16GB

CompactFlash Card

www.stec-inc.com

SLCFxxx(M/G)M1(T2)U(I)

Solid-State Memory Card

(No Moving Parts)

Capacity: 128MB - 16GB

CFA 3.0 and ATA-5 Compatible

ATA Transfer modes:



PIO 0-6, MWDMA 0-4

PIO 0-6 only (for applications

that require MWDMA access to

be disabled)

General Description and Key Features

STEC’s flash storage adheres to the latest industry compliance and regulatory

standards including UL, FCC, RoHS, and various compliance associations. Each

device incorporates a proprietary state-of-the-art flash memory controller that provides

the greatest flexibility to customer-specific applications while supporting key flash

management features resulting in the industry’s highest reliability and endurance. Key

features include:



Built-in ECC engine detects up to 5-byte and corrects up to 4-byte errors



Sophisticated block management and wear leveling algorithms guarantees

2,000,000 write/erase cycles



Power-down data protection ensures data integrity and errors in case of power loss



Lifecycle management feature allows users to monitor the device’s block

management

STEC’s CF Card is the product of choice in applications requiring high reliability and

high tolerance to shock, vibration, humidity, altitude, ESD, and temperature. The

rugged industrial design combined with industrial temperature (-40°C to 85°C) testing

and adherence to rigid JEDEC JESD22 standards ensures flawless execution in the

harshest environments.

In addition to custom hardware and firmware designs, STEC also offers value-added

services including:



Custom labeling and packaging



Custom software imaging and ID strings



Full BOM control and product change notification



Total supply-chain management to ensure continuity of supply



In-field application engineering to help customers through product design-ins

Supports TrueIDE and PC Card

Memory and I/O Modes

Form Factors:



CompactFlash Type I

CompactFlash Type II

CompactFlash Adapter

Ordering Information: CompactFlash Card

Part Number

SLCF128MM1U(I)

SLCF256MM1U(I)

SLCF512MM1U(I)

SLCF1GM1U(I)

SLCF2GM1U(I)

SLCF4GM1U(I)

SLCF8GM1U(I)

SLCF16GM1T2U(I)

Endurance Guarantee of 2,000,000

Write/Erase Cycles

Card Information Structure (CIS)

Programmed into 256 Bytes of

Internal Memory

PC Card and Socket Services

Release 2.1 or later compatible

5V or 3.3V Power Supply

Commercial and Industrial

Operating Temperature Range

5-Byte Detection, 4-Byte Correction

ECC Engine

10 Year Data Retention

RoHS-6 Compliant

CF Form Factor

Type I

Type II

Capacity

128 Mbytes

256 Mbytes

512 Mbytes

1 GByte

2 GBytes

4 GBytes

8 GBytes

16 GBytes

Legend:



SLCF =

STEC standard CF Card part number prefix.



(M/G) =

proceeding capacity (xxx) is in Megabytes (M) or Gigabytes (G).



M1 =

STEC Mach 1 controller.



U =

RoHS-6 compliant lead-free.



Part numbers without (I) =

Commercial temperature range (0ºC to 70ºC).



(I) =

Industrial temperature range (-40ºC to +85 ºC).



F = media set to fixed storage for non-removable IDE applications. Use with

operating systems, such as Windows XP, that require storage media to be

identified as a fixed drive before it can be used as a bootable drive. Example:

SLCFxxx(M/G)M1(T2)U(I)-F.



P =

firmware programmed for PIO Modes 0-6 only for applications requiring

MWDMA access to be disabled. Example: SLCFxxx(M/G)M1(T2)U(I)-P.



S =

optimized for applications that store small (1-4 sector) data packets, e.g.

transactional data acquisition. Example: SLCFxxx(M/G)M1(T2)U(I)-S.

SLCFxxx(M/G)M1(T2)U(I)

Datasheet

Table of Contents

CompactFlash Card

General Description and Key Features................................................................................... 1

Ordering Information: CompactFlash Card............................................................................ 1

1.0 Product Specifications ..................................................................................................... 3

1.1 Labeling ........................................................................................................................................ 3

1.2 Package Dimensions and Pin Locations ...................................................................................... 4

1.2.1 CompactFlash Type I ................................................................................................................ 4

1.2.2 CompactFlash Type II ............................................................................................................... 5

1.3 Pin Assignment............................................................................................................................. 6

1.4 Signal Descriptions ....................................................................................................................... 7

1.5 Performance ............................................................................................................................... 10

1.6 CHS Parameters ........................................................................................................................ 10

1.7 Standards Compliance ............................................................................................................... 11

1.7.1 CE and FCC Class B & D ....................................................................................................... 11

1.7.2 RoHS ....................................................................................................................................... 11

2.0 Environmental Specifications .........................................................................................12

2.1 Recommended Operating Conditions ........................................................................................ 12

2.2 Reliability .................................................................................................................................... 12

2.3 Shock, Vibration, and Humidity .................................................................................................. 12

3.0 Electrical Specifications .................................................................................................13

3.1 Absolute Maximum Ratings ........................................................................................................ 13

3.2 DC Characteristics...................................................................................................................... 13

3.3 AC Characteristics ...................................................................................................................... 14

3.3.1 PC Card Memory Mode Attribute Memory Read .................................................................... 14

3.3.2 PC Card Memory Mode Attribute Memory Write .................................................................... 15

3.3.3 PC Card Memory Mode Common Memory Read ................................................................... 16

3.3.4 PC Card Memory Mode Common Memory Write ................................................................... 17

3.3.5 PC Card I/O Mode Read AC Characteristics .......................................................................... 18

3.3.6 PC Card I/O Mode Write AC Characteristics .......................................................................... 19

3.3.7 True IDE Mode Register Access ............................................................................................. 20

3.3.8 True IDE Mode PIO Access .................................................................................................... 21

3.3.9 True IDE Mode Multiword DMA (not used for part numbers with P) ....................................... 23

3.4 PC Card Memory and I/O Modes Power Up to READY and RESET to READY ........................ 24

4.0 Host Access Specification ..............................................................................................25

4.1

4.2

4.3

4.4

Task File Register and Byte/Word/Odd-Byte Mode Mappings ................................................... 25

Host Access Interface Modes ..................................................................................................... 25

Card Information Structure (CIS) ................................................................................................ 26

Identify Drive Parameter Information .......................................................................................... 30

5.0 Registers ..........................................................................................................................31

5.1 Configuration Registers .............................................................................................................. 31

5.2 Task File Registers ..................................................................................................................... 32

6.0 Supported ATA Commands ............................................................................................33

7.0 Appendix: CompactFlash Adapter .................................................................................35

7.1

7.2

7.3

7.4

CF Adapter Ordering Information ............................................................................................... 35

CF Adapter Specifications .......................................................................................................... 35

CF Adapter Package Dimensions and Pin Locations ................................................................. 36

CF Adapter Pin Assignment ....................................................................................................... 37

8.0 Revision History ..............................................................................................................38

61000-04496-118, April 2008

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