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M58BW032BB60ZA3

Description
IC,EEPROM,NOR FLASH,1MX32,CMOS,BGA,80PIN,PLASTIC
Categorystorage    storage   
File Size826KB,60 Pages
ManufacturerSTMicroelectronics
Websitehttp://www.st.com/
Download Datasheet Parametric Compare View All

M58BW032BB60ZA3 Overview

IC,EEPROM,NOR FLASH,1MX32,CMOS,BGA,80PIN,PLASTIC

M58BW032BB60ZA3 Parametric

Parameter NameAttribute value
MakerSTMicroelectronics
package instructionBGA, BGA80,8X10,40
Reach Compliance Codeunknown
Maximum access time60 ns
startup blockBOTTOM
command user interfaceYES
Universal Flash InterfaceYES
Data pollingNO
JESD-30 codeR-PBGA-B80
memory density33554432 bit
Memory IC TypeFLASH
memory width32
Number of departments/size4,8,62
Number of terminals80
word count1048576 words
character code1000000
Maximum operating temperature125 °C
Minimum operating temperature-40 °C
organize1MX32
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Encapsulate equivalent codeBGA80,8X10,40
Package shapeRECTANGULAR
Package formGRID ARRAY
page size4 words
Parallel/SerialPARALLEL
power supply3.3 V
Certification statusNot Qualified
Department size4K,2K,16K
Maximum standby current0.0001 A
Nominal supply voltage (Vsup)3.3 V
surface mountYES
technologyCMOS
Temperature levelAUTOMOTIVE
Terminal formBALL
Terminal pitch1 mm
Terminal locationBOTTOM
switch bitNO
typeNOR TYPE
Base Number Matches1
M58BW032BT, M58BW032BB
M58BW032DT, M58BW032DB
32 Mbit (1Mb x32, Boot Block, Burst)
3.3V Supply Flash Memory
PRELIMINARY DATA
FEATURES SUMMARY
SUPPLY VOLTAGE
– V
DD
= 3.0V to 3.6V for Program, Erase
and Read
– V
DDQ
= V
DDQIN
= 1.6V to 3.6V for I/O
Buffers
HIGH PERFORMANCE
– Access Time: 45, 55 and 60ns
– 75MHz Effective Zero Wait-State Burst
Read
– Synchronous Burst Reads
– Asynchronous Page Reads
MEMORY ORGANIZATION
– Eight 64 Kbit small parameter Blocks
– Four 128Kbit large parameter Blocks (of
which one is OTP)
– Sixty-two 512Kbit main Blocks
Figure 1. Packages
PQFP80 (T)
BGA
HARDWARE BLOCK PROTECTION
– WP pin Lock Program and Erase
– V
PEN
signal for Program/Erase Enable
SOFTWARE BLOCK PROTECTION
– Tuning Protection to Lock Program and
Erase with 64-bit User Programmable
Password (M58BW032B version only)
SECURITY
– 64-bit Unique Device Identifier (UID)
FAST PROGRAMMING
– Write to Buffer and Program capability
OPTIMIZED FOR FDI DRIVERS
– Common Flash Interface (CFI)
– Fast Program/Erase Suspend feature in
each block
LOW POWER CONSUMPTION
– 100µA Typical Standby
LBGA80 (ZA)
10 x 8 ball array
ELECTRONIC SIGNATURE
– Manufacturer Code: 20h
– Top Device Code M58BW032xT: 8838h
– Bottom Device Code M58BW032xB:
8837h
OPERATING TEMPERATURE RANGE
– Automotive (Grade 3):
40 to 125°C
– Industrial (Grade 6):
40 to 90°C
November 2004
1/60
This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice.

M58BW032BB60ZA3 Related Products

M58BW032BB60ZA3 M58BW032BB60T3 M58BW032BB60T6 M58BW032BB60ZA6
Description IC,EEPROM,NOR FLASH,1MX32,CMOS,BGA,80PIN,PLASTIC IC,EEPROM,NOR FLASH,1MX32,CMOS,QFP,80PIN,PLASTIC IC,EEPROM,NOR FLASH,1MX32,CMOS,QFP,80PIN,PLASTIC IC,EEPROM,NOR FLASH,1MX32,CMOS,BGA,80PIN,PLASTIC
Maker STMicroelectronics STMicroelectronics STMicroelectronics STMicroelectronics
package instruction BGA, BGA80,8X10,40 QFP, QFP80,.7X.9,32 QFP, QFP80,.7X.9,32 BGA, BGA80,8X10,40
Reach Compliance Code unknown unknown unknown unknown
Maximum access time 60 ns 60 ns 60 ns 60 ns
startup block BOTTOM BOTTOM BOTTOM BOTTOM
command user interface YES YES YES YES
Universal Flash Interface YES YES YES YES
Data polling NO NO NO NO
JESD-30 code R-PBGA-B80 R-PQFP-G80 R-PQFP-G80 R-PBGA-B80
memory density 33554432 bit 33554432 bit 33554432 bit 33554432 bit
Memory IC Type FLASH FLASH FLASH FLASH
memory width 32 32 32 32
Number of departments/size 4,8,62 4,8,62 4,8,62 4,8,62
Number of terminals 80 80 80 80
word count 1048576 words 1048576 words 1048576 words 1048576 words
character code 1000000 1000000 1000000 1000000
Maximum operating temperature 125 °C 125 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C
organize 1MX32 1MX32 1MX32 1MX32
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA QFP QFP BGA
Encapsulate equivalent code BGA80,8X10,40 QFP80,.7X.9,32 QFP80,.7X.9,32 BGA80,8X10,40
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form GRID ARRAY FLATPACK FLATPACK GRID ARRAY
page size 4 words 4 words 4 words 4 words
Parallel/Serial PARALLEL PARALLEL PARALLEL PARALLEL
power supply 3.3 V 3.3 V 3.3 V 3.3 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified
Department size 4K,2K,16K 4K,2K,16K 4K,2K,16K 4K,2K,16K
Maximum standby current 0.0001 A 0.0001 A 0.0001 A 0.0001 A
Nominal supply voltage (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V
surface mount YES YES YES YES
technology CMOS CMOS CMOS CMOS
Temperature level AUTOMOTIVE AUTOMOTIVE INDUSTRIAL INDUSTRIAL
Terminal form BALL GULL WING GULL WING BALL
Terminal pitch 1 mm 0.8 mm 0.8 mm 1 mm
Terminal location BOTTOM QUAD QUAD BOTTOM
switch bit NO NO NO NO
type NOR TYPE NOR TYPE NOR TYPE NOR TYPE
Base Number Matches 1 1 1 -
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