EEWORLDEEWORLDEEWORLD

Part Number

Search

B37933-K5030-C960

Description
CAPACITOR, CERAMIC, MULTILAYER, 50 V, CH, 0.0000039 uF, SURFACE MOUNT, 0603, CHIP
CategoryPassive components    capacitor   
File Size317KB,11 Pages
ManufacturerTDK Corporation
Websitehttp://www.tdk.com
Environmental Compliance
Download Datasheet Parametric View All

B37933-K5030-C960 Overview

CAPACITOR, CERAMIC, MULTILAYER, 50 V, CH, 0.0000039 uF, SURFACE MOUNT, 0603, CHIP

B37933-K5030-C960 Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
Objectid1951500554
package instruction, 0603
Reach Compliance Codeunknown
ECCN codeEAR99
YTEOL0
capacitance0.0000039 µF
Capacitor typeCERAMIC CAPACITOR
dielectric materialsCERAMIC
JESD-609 codee3
Manufacturer's serial numberB37933
Installation featuresSURFACE MOUNT
multi-layerYes
negative tolerance6.41%
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR, CARDBOARD, 7 INCH
positive tolerance6.41%
Rated (DC) voltage (URdc)50 V
size code0603
surface mountYES
Temperature characteristic codeCH
Temperature Coefficient60ppm/Cel ppm/°C
Terminal surfaceTIN
Terminal shapeWRAPAROUND
Multilayer Ceramic Capacitor
HQM - Chip / Size 0603
Data Sheet
HQM / 0603 / 50V
B37933-K5***-***
Hi-Q Capacitors 0603
Description
The “High-Q-series” was designed for wireless communications and high frequency applications.
The “High-Q-Capacitors” have a class 1 dielectric ceramic and copper inner electrode. The class 1
dielectric ceramic used, HQM, is a very stable dielectric offering a temperature coefficient of
capacitance (TCC) of 0± 60ppm/°C. The higher conductivity of copper give a lower ESR. These
advantages mean a improved performance of matching circuits, lower power dissipation and less
energy absorption.
Features
Ultra low ESR and high Q-factor
Tight capacitance tolerances
Class 1 capacitor with Cu-inner-electrodes
High stability with respect of time, temperature, frequency and voltage
Excellent attenuation
High self resonance frequency
Lead free component
AgNiSn (Nickel
Barrier)
Termination
Applications
Cellular Communication
Bluetooth
DECT
Cable TV
Satellite TV (LNB)
GPS
Vehicle Location Systems
Paging
Test and Measurement
Filters
RF Amplifiers
VCO´s
HIPERLAN
EPCOS KB VS PE
Revision:
d/2001
Page 1 of 11
15.10.01
[TI official] Notice on purchasing TI devices at a special price in small quantities
[i=s]This post was last edited by paulhyde on 2014-9-15 03:42[/i] To all relevant colleges and universities: In order to better support the 2011 National Undergraduate Electronic Design Competition, T...
61电子 Electronics Design Contest
What methods do you use to convert AC to DC? Let's discuss and learn from each other.
What methods do you use to convert AC to DC? Let's discuss and learn from each other....
thinking2737 Power technology
Let’s take a look at my SD card initialization problem, using SPI mode
The life and death was not successful. I used micro SDHC according to the SD2.0 standard, but if I accept ACMDD41 in a loop, I will continue to receive 0x01. I don’t know what’s going on. I hope an ex...
sxxajian Embedded System
Top 10 Tips for Embedded Software Testing
In the process of embedded software development, generally speaking, the time spent on testing and coding is 3:1 (maybe more in fact). This ratio will continue to decrease as your programming and test...
liuyong1989 Power technology
After creating a new thread, during debugging and tracing, an error is reported when the new thread operates on the passed parameter (a control)
After clicking a button, a thread is created and a parameter (a control, such as CComboBox) is passed in. When operating the control in the new thread, the system prompts that MFCCE300.DLL is wrong, t...
uuiikid Embedded System
Multilayer PCB press temperature and pressure uniformity test method
The use of a laminating machine is indispensable in the processing of multi-layer PCBs, and the uniformity of the pressure and temperature of the laminating machine has a considerable impact on the qu...
呱呱 PCB Design

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2882  2761  2511  2136  2011  59  56  51  44  41 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号