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PWC1206-10F

Description
Fixed Resistor, Metal Glaze/thick Film, 0.33W, 10ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP
CategoryPassive components    The resistor   
File Size110KB,4 Pages
ManufacturerTT Electronics plc
Websitehttp://www.ttelectronics.com/
Download Datasheet Parametric View All

PWC1206-10F Overview

Fixed Resistor, Metal Glaze/thick Film, 0.33W, 10ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

PWC1206-10F Parametric

Parameter NameAttribute value
Is it lead-free?Contains lead
Is it Rohs certified?incompatible
Objectid2074187139
package instructionCHIP
Reach Compliance Codecompliant
ECCN codeEAR99
YTEOL0
JESD-609 codee0
Installation featuresSURFACE MOUNT
Number of terminals2
Maximum operating temperature155 °C
Minimum operating temperature-55 °C
Package shapeRECTANGULAR PACKAGE
method of packingTR
Rated power dissipation(P)0.33 W
Rated temperature70 °C
resistance10 Ω
Resistor typeFIXED RESISTOR
size code1206
surface mountYES
technologyMETAL GLAZE/THICK FILM
Temperature Coefficient100 ppm/°C
Terminal surfaceTin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal shapeWRAPAROUND
Tolerance1%
Operating Voltage200 V
Pulse Withstanding Chip Resistors
PWC SERIES
Excellent Pulse Withstand Performance
Improved working voltage
Improved power rating
Standard chip sizes (0805 to 2512)
Electrical Data
Size
Power @70°C
Resistance range
Tolerance
LEV
TCR
Operating temperature
Values
Pulse Capability
0805
0.125W
1206
0.33W
1R0 to 10M
0.5*, 1, 5%
150V
200V
400V
500V
<10R:200ppm/°C >10R:100ppm/°C
-55 to +155°C
E96 preferred other values to special order
See graphs – full application note available on request
*0.5% Tolerance only available on values 10R to 1M0
2010
0.75W
2512
1.5W
Physical Data
Dimensions of PWC resistors are given below in mm and weight in g
0805
1206
2010
2512
L
2.0±0.3
3.2±0.4
5.1±0.3
6.5±0.3
W
1.25±0.2
1.6±0.2
2.5±0.2
3.2±0.2
T max
0.6
0.7
0.8
0.8
A
0.3±0.15
0.4±0.2
0.6±0.3
0.6±0.3
B*
0.9 min
1.7 min
3.0 min
4.4 min
C
0.3±0.1
0.4±0.15
N/A
N/A
Wt.
0.009
0.020
0.036
0.055
B
Construction
Thick film resistor material, overglaze and
organic protections are screen printed on a 96%
alumina substrate. Wrap-around terminations
have an electroplated nickel barrier and tin-lead
solder coating; this ensures excellent ‘leach’
resistance properties and solderability. Chips
can withstand immersion in solder at 260°C for
30 seconds.
Marking
No marking provided.
Solvent Resistance
The body protection and marking are resistant to
all normal industrial cleaning solvents suitable
for printed circuits.
General Note
IRC, reserves the right to make changes in product specification without notice or liability.
All information is subject to IRC’s own test data and is considered accurate at time of print.
Issue A 15-8-2001 SM
©
IRC – Advanced Film Division
4222 South Staples Street, Corpus Christi, Texas, 78411,USA. Tel: 361-992-7900 Fax: 361-992-3377 Web: www.irctt.com
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