30170-53 datasheet, PDF - EEWORLD Datasheet

30170-53: Description32-BIT, 266MHz, MICROPROCESSOR, PBGA352, BGA-352; CategoryThe embedded processor and controller Microcontrollers and processors; File Size4MB，247 Pages; ManufacturerTexas Instruments; Websitehttp://www.ti.com.cn/

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30170-53 Overview

32-BIT, 266MHz, MICROPROCESSOR, PBGA352, BGA-352

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Parts packaging code	BGA
package instruction	BGA, BGA352,26X26,50
Contacts	352
Reach Compliance Code	unknown
ECCN code	3A991.A.2
Other features	ALSO REQUIRES 3.3V SUPPLY
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	33.61 MHz
External data bus width	32
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B352
JESD-609 code	e0
length	35 mm
low power mode	YES
Number of terminals	352
Maximum operating temperature	70 °C
Minimum operating temperature
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Encapsulate equivalent code	BGA352,26X26,50
Package shape	SQUARE
Package form	GRID ARRAY
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	2.9,3.3 V
Certification status	Not Qualified
Maximum seat height	2.23 mm
speed	266 MHz
Maximum slew rate	3100 mA
Maximum supply voltage	3.05 V
Minimum supply voltage	2.76 V
Nominal supply voltage	2.9 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	35 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR
Base Number Matches	1

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