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XCR22LV10-15PC28I

Description
totalcmos, universal pld device
CategoryProgrammable logic devices    Programmable logic   
File Size143KB,14 Pages
ManufacturerXILINX
Websitehttps://www.xilinx.com/
Download Datasheet Parametric Compare View All

XCR22LV10-15PC28I Overview

totalcmos, universal pld device

XCR22LV10-15PC28I Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerXILINX
Parts packaging codeQLCC
package instructionQCCJ, LDCC28,.5SQ
Contacts28
Reach Compliance Codeunknown
ArchitecturePAL-TYPE
maximum clock frequency65 MHz
JESD-30 codeS-PQCC-J28
JESD-609 codee0
length11.5062 mm
Humidity sensitivity level1
Dedicated input times11
Number of I/O lines10
Number of entries22
Output times10
Number of product terms132
Number of terminals28
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
organize11 DEDICATED INPUTS, 10 I/O
Output functionMACROCELL
Package body materialPLASTIC/EPOXY
encapsulated codeQCCJ
Encapsulate equivalent codeLDCC28,.5SQ
Package shapeSQUARE
Package formCHIP CARRIER
Peak Reflow Temperature (Celsius)225
power supply3.3 V
Programmable logic typeEE PLD
propagation delay15 ns
Certification statusNot Qualified
Maximum seat height4.572 mm
Maximum supply voltage3.6 V
Minimum supply voltage3 V
Nominal supply voltage3.3 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceTIN LEAD
Terminal formJ BEND
Terminal pitch1.27 mm
Terminal locationQUAD
Maximum time at peak reflow temperatureNOT SPECIFIED
width11.5062 mm
0
R
XCR22LV10: 3V Zero Power,
TotalCMOS, Universal PLD Device
0
0*
DS047 (v1.1) February 10, 2000
Product Specification
Features
Industry's first TotalCMOS™ SPLD - both CMOS
design and process technologies
Fast Zero Power (FZP™) design technique provides
ultra-low power and high speed
- Static current of less than 45
µ
A
- Dynamic current substantially below that of
competing devices
- Pin-to-pin delay of only 10 ns
True Zero Power device with no turbo bits or power
down schemes
Function/JEDEC map compatible with Bipolar,
UVCMOS, EECMOS 22V10s
Multiple packaging options featuring PCB-friendly
flow-through pinouts (SOL and TSSOP)
- 24-pin TSOIC–uses 93% less in-system space than
a 28-pin PLCC
- 24-pin SOIC
- 28-pin PLCC with standard JEDEC pinout
Available in commercial and industrial operating ranges
Supports mixed voltage systems—5V tolerant I/Os
Advanced 0.5
µ
E
2
CMOS process
1000 erase/program cycles guaranteed
20 years data retention guaranteed
Varied product term distribution with up to 16 product
terms per output for complex functions
Programmable output polarity
Synchronous preset/asynchronous reset capability
Security bit prevents unauthorized access
Electronic signature for identification
Design entry and verification using industry standard
CAE tools
Reprogrammable using industry standard device
programmers
Description
The XCR22LV10 is the first SPLD to combine high perfor-
mance with low power, without the need for "turbo bits" or
other power down schemes. To achieve this, Xilinx has
used their FZP design technique, which replaces conven-
tional sense amplifier methods for implementing product
terms (a technique that has been used in PLDs since the
bipolar era) with a cascaded chain of pure CMOS gates.
This results in the combination of low power and high
speed that has previously been unattainable in the PLD
arena. For 5V operation, Xilinx offers the XCR22V10 that
offers high speed and low power in a 5V implementation.
The XCR22LV10 uses the familiar AND/OR logic array
structure, which allows direct implementation of
sum-of-products equations. This device has a programma-
ble AND array which drives a fixed OR array. The OR sum
of products feeds an "Output Macro Cell" (OMC), which can
be individually configured as a dedicated input, a combina-
torial output, or a registered output with internal feedback.
Functional Description
The XCR22LV10 implements logic functions as
sum-of-products expressions in a programmable-
AND/fixed-OR logic array. User-defined functions are cre-
ated by programming the connections of input signals into
the array. User-configurable output structures in the form of
I/O macrocells further increase logic flexibility (Figure
1).
DS047 (v1.1) February 10, 2000
www.xilinx.com
1-800-255-7778
1

XCR22LV10-15PC28I Related Products

XCR22LV10-15PC28I XCR22LV10-10PC28I XCR22LV10 XCR22LV10-15VO24C XCR22LV10-10PC28C XCR22LV10-15PC28C XCR22LV10-10VO24I XCR22LV10-10VO24C XCR22LV10-15VO24I
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Is it Rohs certified? incompatible - - incompatible incompatible incompatible - incompatible incompatible
Maker XILINX - - XILINX XILINX XILINX - XILINX XILINX
Parts packaging code QLCC - - SOIC QLCC QLCC - SOIC SOIC
package instruction QCCJ, LDCC28,.5SQ - - TSSOP, TSSOP24,.25 QCCJ, LDCC28,.5SQ QCCJ, LDCC28,.5SQ - TSSOP, TSSOP24,.25 THIN, PLASTIC, SOIC-24
Contacts 28 - - 24 28 28 - 24 24
Reach Compliance Code unknown - - unknown unknown unknown - unknown unknown
Architecture PAL-TYPE - - PAL-TYPE PAL-TYPE PAL-TYPE - PAL-TYPE PAL-TYPE
maximum clock frequency 65 MHz - - 95 MHz 125 MHz 95 MHz - 125 MHz 65 MHz
JESD-30 code S-PQCC-J28 - - R-PDSO-G24 S-PQCC-J28 S-PQCC-J28 - R-PDSO-G24 R-PDSO-G24
length 11.5062 mm - - 7.8 mm 11.5062 mm 11.5062 mm - 7.8 mm 7.8 mm
Humidity sensitivity level 1 - - 1 1 1 - 1 1
Dedicated input times 11 - - 11 11 11 - 11 11
Number of I/O lines 10 - - 10 10 10 - 10 10
Number of entries 22 - - 22 22 22 - 22 22
Output times 10 - - 10 10 10 - 10 10
Number of product terms 132 - - 132 132 132 - 132 132
Number of terminals 28 - - 24 28 28 - 24 24
Maximum operating temperature 85 °C - - 70 °C 70 °C 70 °C - 70 °C 85 °C
organize 11 DEDICATED INPUTS, 10 I/O - - 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O - 11 DEDICATED INPUTS, 10 I/O 11 DEDICATED INPUTS, 10 I/O
Output function MACROCELL - - MACROCELL MACROCELL MACROCELL - MACROCELL MACROCELL
Package body material PLASTIC/EPOXY - - PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY - PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code QCCJ - - TSSOP QCCJ QCCJ - TSSOP TSSOP
Encapsulate equivalent code LDCC28,.5SQ - - TSSOP24,.25 LDCC28,.5SQ LDCC28,.5SQ - TSSOP24,.25 TSSOP24,.25
Package shape SQUARE - - RECTANGULAR SQUARE SQUARE - RECTANGULAR RECTANGULAR
Package form CHIP CARRIER - - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH CHIP CARRIER CHIP CARRIER - SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Peak Reflow Temperature (Celsius) 225 - - 225 225 225 - 225 225
power supply 3.3 V - - 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V
Programmable logic type EE PLD - - EE PLD EE PLD EE PLD - EE PLD EE PLD
propagation delay 15 ns - - 15 ns 10 ns 15 ns - 10 ns 15 ns
Certification status Not Qualified - - Not Qualified Not Qualified Not Qualified - Not Qualified Not Qualified
Maximum seat height 4.572 mm - - 1.2 mm 4.572 mm 4.572 mm - 1.2 mm 1.2 mm
Maximum supply voltage 3.6 V - - 3.6 V 3.6 V 3.6 V - 3.6 V 3.6 V
Minimum supply voltage 3 V - - 3 V 3 V 3 V - 3 V 3 V
Nominal supply voltage 3.3 V - - 3.3 V 3.3 V 3.3 V - 3.3 V 3.3 V
surface mount YES - - YES YES YES - YES YES
technology CMOS - - CMOS CMOS CMOS - CMOS CMOS
Temperature level INDUSTRIAL - - COMMERCIAL COMMERCIAL COMMERCIAL - COMMERCIAL INDUSTRIAL
Terminal form J BEND - - GULL WING J BEND J BEND - GULL WING GULL WING
Terminal pitch 1.27 mm - - 0.65 mm 1.27 mm 1.27 mm - 0.65 mm 0.65 mm
Terminal location QUAD - - DUAL QUAD QUAD - DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED - - NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED - NOT SPECIFIED NOT SPECIFIED
width 11.5062 mm - - 4.4 mm 11.5062 mm 11.5062 mm - 4.4 mm 4.4 mm
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