EEWORLDEEWORLDEEWORLD

Part Number

Search
 PDF

CY29FCT520ATSOC

Description
8-Bit Multi-Level Pipeline Register 24-SOIC -40 to 85
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size213KB,12 Pages
ManufacturerTexas Instruments
Websitehttp://www.ti.com.cn/
Environmental Compliance
Stay tuned Parametric Compare

CY29FCT520ATSOC Online Shopping

Suppliers Part Number Price MOQ In stock  
CY29FCT520ATSOC - - View Buy Now

CY29FCT520ATSOC Overview

8-Bit Multi-Level Pipeline Register 24-SOIC -40 to 85

CY29FCT520ATSOC Parametric

Parameter NameAttribute value
Brand NameTexas Instruments
Is it lead-free?Lead free
Is it Rohs certified?conform to
MakerTexas Instruments
Parts packaging codeSOIC
package instructionSOP, SOP24,.4
Contacts24
Reach Compliance Codecompli
Factory Lead Time1 week
boundary scanNO
maximum clock frequency7.14 MHz
External data bus width8
JESD-30 codeR-PDSO-G24
JESD-609 codee4
length15.4 mm
low power modeYES
Humidity sensitivity level1
Number of terminals24
Maximum operating temperature85 °C
Minimum operating temperature-40 °C
Output data bus width8
Package body materialPLASTIC/EPOXY
encapsulated codeSOP
Encapsulate equivalent codeSOP24,.4
Package shapeRECTANGULAR
Package formSMALL OUTLINE
Peak Reflow Temperature (Celsius)260
power supply5 V
Certification statusNot Qualified
Maximum seat height2.65 mm
Maximum slew rate0.2 mA
Maximum supply voltage5.25 V
Minimum supply voltage4.75 V
Nominal supply voltage5 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal surfaceNickel/Palladium/Gold (Ni/Pd/Au)
Terminal formGULL WING
Terminal pitch1.27 mm
Terminal locationDUAL
Maximum time at peak reflow temperatureNOT SPECIFIED
width7.5 mm
uPs/uCs/peripheral integrated circuit typeDSP PERIPHERAL, PIPELINE REGISTER

CY29FCT520ATSOC Related Products

CY29FCT520ATSOC CY29FCT520ATSOCT CY29FCT520ATSOCTE4 CY29FCT520BTSOC CY29FCT520CTSOCE4 CY29FCT520ATSOCTG4 CY29FCT520CTSOCG4
Description 8-Bit Multi-Level Pipeline Register 24-SOIC -40 to 85 Registers Pipelined Registers Pipelined 8-Bit Multi-Level Pipeline Register 24-SOIC -40 to 85 Registers 8B Multi-Level Pipeline Register Registers 8B Multi-Level Pipeline Register Registers 8B Multi-Level Pipeline Register
Brand Name Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Is it lead-free? Lead free Contains lead Contains lead Lead free Contains lead Contains lead Contains lead
Is it Rohs certified? conform to conform to conform to conform to conform to conform to conform to
Maker Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments Texas Instruments
Parts packaging code SOIC SOIC SOIC SOIC SOIC SOIC SOIC
package instruction SOP, SOP24,.4 SOP, SOP24,.4 SOP, SOP24,.4 SOIC-24 SOP, SOP24,.4 SOP, SOP24,.4 SOIC-24
Contacts 24 24 24 24 24 24 24
Reach Compliance Code compli unknow unknow compliant compli unknow compliant
boundary scan NO NO NO NO NO NO NO
maximum clock frequency 7.14 MHz 7.14 MHz 7.14 MHz 13.33 MHz 16.67 MHz 7.14 MHz 16.67 MHz
External data bus width 8 8 8 8 8 8 8
JESD-30 code R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24 R-PDSO-G24
length 15.4 mm 15.4 mm 15.4 mm 15.4 mm 15.4 mm 15.4 mm 15.4 mm
low power mode YES YES YES YES YES YES YES
Number of terminals 24 24 24 24 24 24 24
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C -40 °C
Output data bus width 8 8 8 8 8 8 8
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code SOP SOP SOP SOP SOP SOP SOP
Encapsulate equivalent code SOP24,.4 SOP24,.4 SOP24,.4 SOP24,.4 SOP24,.4 SOP24,.4 SOP24,.4
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Celsius) 260 NOT SPECIFIED NOT SPECIFIED 260 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
power supply 5 V 5 V 5 V 5 V 5 V 5 V 5 V
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Maximum seat height 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm 2.65 mm
Maximum supply voltage 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V 5.25 V
Minimum supply voltage 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V 4.75 V
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Temperature level INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
Terminal form GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING GULL WING
Terminal pitch 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm 1.27 mm
Terminal location DUAL DUAL DUAL DUAL DUAL DUAL DUAL
Maximum time at peak reflow temperature NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
width 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm 7.5 mm
uPs/uCs/peripheral integrated circuit type DSP PERIPHERAL, PIPELINE REGISTER DSP PERIPHERAL, PIPELINE REGISTER DSP PERIPHERAL, PIPELINE REGISTER DSP PERIPHERAL, PIPELINE REGISTER DSP PERIPHERAL, PIPELINE REGISTER DSP PERIPHERAL, PIPELINE REGISTER DSP PERIPHERAL, PIPELINE REGISTER
Electronic Engineers Prize Survey: Fill out the survey and get 100% of the 50-yuan electronic coupons (first 300)
[align=left][color=rgb(68, 68, 68)][backcolor=rgb(255, 255, 255)][font=Tahoma, "][size=14px][size=4][font=微软雅黑]中外先智 sincerely invites netizens to participate in a prize-winning survey~ [/font][/size][...
EEWORLD社区 Integrated technical exchanges
[300 gifts ready] NXP High Energy Wireless MCU Creative Competition High Energy Launch
[align=left][b][font="][size=14.0pt]Creative Collection Time: [/size][/font][/b][font="][size=10.5pt]From now on to February 28 [/size][/font][/align][align=left][b][font="][size=14.0pt]Activity Page:...
EEWORLD社区 NXP MCU
[Synopsys IP Resources] EDA on the cloud makes chip innovation "fast, accurate and stable"
Chip design has always faced two very demanding goals: strict quality requirements and tight time to market.Computation-intensive applications such as artificial intelligence (AI) and high-performance...
arui1999 Integrated technical exchanges
Ask about ce6 file system
Dear brothers: I have encountered a problem with the file system in my project. The capacity of the storage system cannot be correctly transmitted to the system, so that copying large files to Flash w...
zxq180 Embedded System
Charging a rice-sized chip implanted in the body
Ada Poon, a professor of electrical engineering at Stanford University, and her team published a paper in the Proceedings of the National Academy of Sciences today, saying that their team has develope...
azhiking Power technology
A brief introduction to the CAN program of Fujitsu DIY board
[align=left][color=#000000] [size=6] A brief introduction to the CAN program of Fujitsu DIY board[/size][size=4][color=blue]Download[/color][/size][/color][color=blue][size=4][font=Times New Roman]mb9...
damiaa DIY/Open Source Hardware

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 2389  2080  546  284  2153  49  42  11  6  44 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号