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5962-01-237-2515

Description
IC,PROM,2KX4,TTL,DIP,18PIN,CERAMIC
Categorystorage    storage   
File Size147KB,3 Pages
ManufacturerIntersil ( Renesas )
Websitehttp://www.intersil.com/cda/home/
Download Datasheet Parametric View All

5962-01-237-2515 Overview

IC,PROM,2KX4,TTL,DIP,18PIN,CERAMIC

5962-01-237-2515 Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
Objectid1167340402
package instructionDIP, DIP18,.3
Reach Compliance Codenot_compliant
ECCN codeEAR99
YTEOL0
Maximum access time90 ns
JESD-30 codeR-XDIP-T18
memory density8192 bit
Memory IC TypeOTP ROM
memory width4
Number of terminals18
word count2048 words
character code2000
Maximum operating temperature125 °C
Minimum operating temperature-55 °C
organize2KX4
Package body materialCERAMIC
encapsulated codeDIP
Encapsulate equivalent codeDIP18,.3
Package shapeRECTANGULAR
Package formIN-LINE
Certification statusNot Qualified
Filter levelMIL-STD-883 Class B (Modified)
Maximum slew rate0.17 mA
surface mountNO
technologyTTL
Temperature levelMILITARY
Terminal formTHROUGH-HOLE
Terminal pitch2.54 mm
Terminal locationDUAL
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