MT36JSZF51272PDIY-1G4XX datasheet, PDF

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MT36JSZF51272PDIY-1G4XX: DescriptionDDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240; Categorystorage storage; File Size901KB，21 Pages; ManufacturerMicron Technology; Websitehttp://www.mdtic.com.tw/; Environmental Compliance

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MT36JSZF51272PDIY-1G4XX Overview

DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240

MT36JSZF51272PDIY-1G4XX Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Micron Technology
Parts packaging code	DIMM
package instruction	DIMM,
Contacts	240
Reach Compliance Code	compliant
ECCN code	EAR99
access mode	FOUR BANK PAGE BURST
Other features	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240
JESD-609 code	e4
memory density	38654705664 bit
Memory IC Type	DDR DRAM MODULE
memory width	72
Number of functions	1
Number of ports	1
Number of terminals	240
word count	536870912 words
character code	512000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	512MX72
Package body material	UNSPECIFIED
encapsulated code	DIMM
Package shape	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
self refresh	YES
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	NO
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Gold (Au)
Terminal form	NO LEAD
Terminal location	DUAL
Maximum time at peak reflow temperature	30

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4GB (x72, ECC, QR) 240-Pin DDR3 SDRAM RDIMM

Features

DDR3 SDRAM RDIMM

MT36JSZF51272PD – 4GB

For component data sheets, refer to Micron’s Web site:

www.micron.com

Features

• DDR3 functionality and operations supported as

defined in the component data sheet

• 240-pin, registered dual in-line memory module

(RDIMM)

• Fast data transfer rates: PC3-10600, PC3-8500,

or PC3-6400

• 4GB (512 Meg x 72)

• V

= V

Q = 1.5V ±0.075V

• V

DDSPD

= +3V to +3.6V

• Supports ECC error detection and correction

• Nominal and dynamic on-die termination (ODT) for

data, strobe, and mask signals

• Quad rank

• On-board I

C temperature sensor with integrated

serial presence-detect (SPD) EEPROM

• Fixed burst chop (BC) of 4 and burst length (BL) of 8

via the mode register set

• Selectable BC4 or BL8 on-the-fly (OTF)

• Full module heat spreader

• Gold edge contacts

• Lead-free

• Fly-by topology

• Terminated control, command, and address bus

Figure 1:

240-Pin RDIMM (MO-269 R/C H)

PCB height: 30.0mm (1.181in)

U10

U11

U12

U13

U14

U15

U16

U17

U18

U19

U20

Options

•

Operating temperature

Marking

–

Commercial (0°C

≤

+70°C)

None

–

Industrial (–40°C

≤

+85°C)

• Package

–

240-pin DIMM (lead-free)

• Frequency/CAS latency

–

1.5ns @ CL = 9 (DDR3-1333)

-1G4

–

1.5ns @ CL = 10 (DDR3-1333)

-1G3

–

1.87ns @ CL = 7 (DDR3-1066)

-1G1

–

1.87ns @ CL = 8 (DDR3-1066)

-1G0

–

2.5ns @ CL = 5 (DDR3-800)

-80C

–

2.5ns @ CL = 6 (DDR3-800)

-80B

Notes: 1. Contact Micron for industrial temperature

module offerings.

2. Not recommended for new designs.

Table 1:

Speed

Grade

-1G4

-1G3

-1G1

-1G0

-80C

-80B

Key Timing Parameters

Data Rate (MT/s)

Industry

Nomenclature

PC3-10600

PC3-8500

PC3-6400

CL = 10 CL = 9

1333

–

1333

–

CL = 8

1066

–

CL = 7

1066

–

1066

–

CL = 6

800

CL = 5

–

800

–

RCD

(ns)

13.5

(ns)

13.5

13.125

12.5

(ns)

49.5

50.625

52.5

13.125

12.5

PDF: 09005aef8343b5fe/Source: 09005aef8343b64c

JSZF36C512x72PD.fm - Rev. A 6/08 EN

Micron Technology, Inc., reserves the right to change products or specifications without notice.

Products and specifications discussed herein are subject to change by Micron without notice.

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Description	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240	DDR DRAM Module, 512MX72, CMOS, LEAD FREE, RDIMM-240
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to	conform to
Maker	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology	Micron Technology
Parts packaging code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
package instruction	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,	DIMM,
Contacts	240	240	240	240	240	240	240	240	240	240
Reach Compliance Code	compliant	compli	compliant	compliant	compliant	compliant	compliant	compliant	compliant	compli
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
access mode	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST	FOUR BANK PAGE BURST
Other features	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH	AUTO/SELF REFRESH
JESD-30 code	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240	R-XDMA-N240
JESD-609 code	e4	e4	e4	e4	e4	e4	e4	e4	e4	e4
memory density	38654705664 bit	38654705664 bi	38654705664 bit	38654705664 bit	38654705664 bit	38654705664 bit	38654705664 bit	38654705664 bit	38654705664 bit	38654705664 bi
Memory IC Type	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE	DDR DRAM MODULE
memory width	72	72	72	72	72	72	72	72	72	72
Number of functions	1	1	1	1	1	1	1	1	1	1
Number of ports	1	1	1	1	1	1	1	1	1	1
Number of terminals	240	240	240	240	240	240	240	240	240	240
word count	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words	536870912 words
character code	512000000	512000000	512000000	512000000	512000000	512000000	512000000	512000000	512000000	512000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	70 °C	70 °C	85 °C	70 °C	70 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-	-	-40 °C	-	-	-40 °C	-40 °C	-40 °C
organize	512MX72	512MX72	512MX72	512MX72	512MX72	512MX72	512MX72	512MX72	512MX72	512MX72
Package body material	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
encapsulated code	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM	DIMM
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
self refresh	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
Maximum supply voltage (Vsup)	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V	1.575 V
Minimum supply voltage (Vsup)	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V	1.425 V
Nominal supply voltage (Vsup)	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V	1.5 V
surface mount	NO	NO	NO	NO	NO	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)	Gold (Au)
Terminal form	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD	NO LEAD
Terminal location	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
Maximum time at peak reflow temperature	30	30	30	30	30	30	30	30	30	30

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