IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC
| Parameter Name | Attribute value |
| Is it Rohs certified? | incompatible |
| Maker | NXP |
| package instruction | QCCN, LCC20,.35SQ |
| Reach Compliance Code | unknown |
| JESD-30 code | S-XQCC-N20 |
| JESD-609 code | e0 |
| Logic integrated circuit type | D FLIP-FLOP |
| Number of functions | 4 |
| Number of terminals | 20 |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| Package body material | CERAMIC |
| encapsulated code | QCCN |
| Encapsulate equivalent code | LCC20,.35SQ |
| Package shape | SQUARE |
| Package form | CHIP CARRIER |
| power supply | 2/6 V |
| Certification status | Not Qualified |
| Filter level | 38535Q/M;38534H;883B |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal pitch | 1.27 mm |
| Terminal location | QUAD |
| Trigger type | POSITIVE EDGE |
| Base Number Matches | 1 |
| 54HC175M/B2AJC | MC74HC175DR2 | MC54HC175JD | MC54HC175JDS | MC74HC175DD | MC74HC175DDS | |
|---|---|---|---|---|---|---|
| Description | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,LLCC,20PIN,CERAMIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,SOP,16PIN,PLASTIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,DIP,16PIN,CERAMIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,SOP,16PIN,PLASTIC | IC,FLIP-FLOP,QUAD,D TYPE,HC-CMOS,SOP,16PIN,PLASTIC |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Maker | NXP | NXP | NXP | NXP | NXP | NXP |
| package instruction | QCCN, LCC20,.35SQ | SOP, SOP16,.25 | DIP, DIP16,.3 | DIP, DIP16,.3 | SOP, SOP16,.25 | SOP, SOP16,.25 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 code | S-XQCC-N20 | R-PDSO-G16 | R-XDIP-T16 | R-XDIP-T16 | R-PDSO-G16 | - |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | - |
| Logic integrated circuit type | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - |
| Number of functions | 4 | 4 | 4 | 4 | 4 | - |
| Number of terminals | 20 | 16 | 16 | 16 | 16 | - |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C | 85 °C | - |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C | -40 °C | - |
| Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY | - |
| encapsulated code | QCCN | SOP | DIP | DIP | SOP | - |
| Encapsulate equivalent code | LCC20,.35SQ | SOP16,.25 | DIP16,.3 | DIP16,.3 | SOP16,.25 | - |
| Package shape | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
| Package form | CHIP CARRIER | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | - |
| power supply | 2/6 V | 2/6 V | 2/6 V | 2/6 V | 2/6 V | - |
| surface mount | YES | YES | NO | NO | YES | - |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | - |
| Temperature level | MILITARY | MILITARY | MILITARY | MILITARY | INDUSTRIAL | - |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |
| Terminal form | NO LEAD | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - |
| Terminal pitch | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | - |
| Terminal location | QUAD | DUAL | DUAL | DUAL | DUAL | - |
| Trigger type | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - |
| Base Number Matches | 1 | 1 | 1 | 1 | - | - |
京公网安备 11010802033920号
EEWORLD
