EEWORLDEEWORLDEEWORLD

Part Number

Search

337-3-076-1-T-XS0-2022

Description
Board Connector, 76 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal
CategoryThe connector    The connector   
File Size1006KB,1 Pages
ManufacturerMPE-Garry GmbH
Download Datasheet Parametric View All

337-3-076-1-T-XS0-2022 Overview

Board Connector, 76 Contact(s), 2 Row(s), Male, Straight, 0.079 inch Pitch, Surface Mount Terminal

337-3-076-1-T-XS0-2022 Parametric

Parameter NameAttribute value
Objectid308722197
Reach Compliance Codecompliant
ECCN codeEAR99
Board mount optionsPEG
body width0.157 inch
subject depth0.331 inch
body length3.002 inch
Connector typeBOARD CONNECTOR
Contact to complete cooperationSN
Contact point genderMALE
Contact materialCOPPER ALLOY
contact modeRECTANGULAR
Contact styleSQ PIN-SKT
Dielectric withstand voltage700VAC V
Filter functionNO
insulator materialPOLYETHYLENE
Plug contact pitch0.079 inch
Match contact row spacing0.079 inch
Mixed contactsNO
Installation methodSTRAIGHT
Installation typeBOARD
Number of connectorsONE
PCB row number2
Number of rows loaded2
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
PCB contact patternRECTANGULAR
PCB contact row spacing5.0038 mm
Rated current (signal)1.5 A
GuidelineUL
Terminal pitch2.0066 mm
Termination typeSURFACE MOUNT
Total number of contacts76
Pin Header SMD Sandwich 2,00 mm
Rated current
1,5 A
Rated voltage
150 V
RMS
/ V
DC
Withstand voltage
500 V
RMS
for one minute
Material contact
Copper alloy
Material insulator
High temp. thermoplast UL94V-0
Operating temperature -40°C to +105°C
Max. processing temper. 260°C for 10 seconds
All dimensions in mm.
Series
337
pitch
termination
contact
size
2,00
Product
group
3
Variation
Layout A
2,00
2,00
0,50
PIN 1
1,50
5,08
A
1,50
PCB Layout
040 / 080
max.
pincount
0,50
0,90
1
L
B
(n-1) x 2,00
n x 2,00
2,00
4,00
(n-1) x 2,00
Layout B
2,00
n x 2,00
(n-1) x 2,00
1,50
5,08
A
1,50
6,08
(n-1) x 2,00
2,00
4,00
2
L
B
PIN 1
0,50
0,90
1,50
4,00
6,30
1,50
7,00
3
available in variation
2,00
see figure left
see figure left
7,85
10,70
11,86
12,37
17,35
13,20
16,10
20,22
24,00
29,20
** Positioning peg
0 = Without peg
1 = With peg
Plating:
T = Sn
F = Au
(optional only for variation 3)
S = Selective Au
Cap:
0 = Without cap
1 = With cap
A
4,30
4,30
4,30
4,30
4,30
8,60
10,00
11,82
14,00
16,60
Plating contact (T,F,S)
Positioning peg** (0,1)
B
3,55
6,40
7,56
8,07
13,05
4,60
6,10
8,40
10,00
12,60
see figure left
0,50
2,00
L
B
(n/2-2) x 2,00
(n/2-1) x 2,00
L
1
1
1
1
1
2
2
2
2
2
3
3
3
3
3
CS210611_V2
A (1/100 mm)
Cap (0,1)
* No. of contacts:
Variation 1 = 002 - 040
Variation 2 = 002 - 040
Variation 3 = 006 - 080
e.g. 1000 = 10,00 mm
No. of contacts *
(002,... - 072)
Variation (1,2,3)
www.mpe-connector.de
Order code:
337-?-???-?-?-XS?-????
4-14 4-15 4-16 4-17 4-18
3-28
Mating series
see page
156 159 422 158 413 160
6-8
3,00
(n/2) x 2,00
(n/2-1) x 2,00
A
2,00
0,85
2,65
2,00
MPE-Garry GmbH • Schäfflerstraße 13 • 87629 Füssen • Germany • Phone: +49 (0) 83 62 / 91 56-0 • Fax: +49 (0) 83 62 / 91 56-500 • Email: vk@mpe-connector.de • www.mpe-connector.de
6,08
2,65
About NAND NOR startup problem
I am a novice learning ARM hardware, and I have a question. Samsung 2440 can be booted from NAND and NOR flash. When NAND is booted, it will automatically copy the first 4K of NAND to the internal 4K ...
ljy771219 Embedded System
[Discussion] What are the soldering tips for TI's microcontroller? It's so difficult to solder.
I broke one leg of my 147 by soldering, it's over, I don't dare to solder the other legs, I soldered it on the PCB board, using 0.5 solder wire and external heating iron, please share your experience,...
wowow Microcontroller MCU
Ask a question about BS818A-2 touch detection chip
Recently, I needed to use a touch detection chip for a competition. When I was writing the program, I encountered a problem that I could not solve for a long time. The touch detection chip I have is B...
dj狂人 Test/Measurement
System Design Issues on High-Speed AD Sampling
Dear experts, based on the needs of the subject, I plan to develop and design a high-speed AD sampling system, [color=#0000FF] which may require an external detection circuit + independent AD module +...
spring_hsq Embedded System
I want to switch to sirf cpu, please help me with related questions
Our company used to use 3-star series CPUs, and now we want to switch to sirf A4 or prima. We have some questions for you. 1. If we ask the agent for BSP, datasheet and other related information, do w...
lr116 Embedded System
780M wireless network new field transmission module
As we all know, the wireless frequency band we have been using is 2.4G 433 780M, which is a new field developed by our company. Compared with 24G 433 , it has obvious advantages as shown in the follow...
hanzhixian DIY/Open Source Hardware

EEWorld
subscription
account

EEWorld
service
account

Automotive
development
circle

Robot
development
community

Index Files: 194  1008  2429  540  1514  4  21  49  11  31 
Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Room 1530, 15th Floor, Building B, No. 18 Zhongguancun Street, Haidian District, Beijing Telephone: (010) 82350740 Postal Code: 100190
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved 京ICP证060456号 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号