1720D200M0000BB datasheet, PDF

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1720D200M0000BB: DescriptionSine Output Oscillator, 200MHz Nom, FLATPACK, 20 PIN; CategoryPassive components oscillator; File Size827KB，21 Pages; ManufacturerVectron International, Inc.; Websitehttp://www.vectron.com/

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1720D200M0000BB Overview

Sine Output Oscillator, 200MHz Nom, FLATPACK, 20 PIN

1720D200M0000BB Parametric

Parameter Name	Attribute value
Objectid	145137802895
package instruction	SOP20,.9
Reach Compliance Code	compliant
Frequency Adjustment - Mechanical	NO
frequency stability	50%
Installation features	SURFACE MOUNT
Number of terminals	20
Nominal operating frequency	200 MHz
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Oscillator type	SINE
Output impedance	50 Ω
Output level	1.125 V
Encapsulate equivalent code	SOP20,.9
physical size	16.51mm x 16.51mm x 3.825mm
Filter level	MIL-PRF-55310 Class B
Maximum slew rate	20 mA
Maximum supply voltage	5.25 V
Minimum supply voltage	4.75 V
Nominal supply voltage	5 V
surface mount	YES

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REV

DESCRIPTION

NIR-75933

DATE

10/3/19

PREP

APPD

DF/SM

Oscillator Specification, Hybrid Clock

For

MOUNT HOLLY SPRINGS, PA 17065

THE RECORD OF APPROVAL FOR THIS

DOCUMENT IS MAINTAINED ELECTRONICALLY

WITHIN THE ERP SYSTEM

Hi-Rel Standard, Sinewave Output

CODE IDENT NO

SIZE

DWG. NO.

REV

00136

DOC207975

UNSPECIFIED TOLERANCES: N/A

SHEET 1 0F 21

MICROCHIP CONFIDENTIAL

1.1

SCOPE

General. This specification defines the design, assembly and functional evaluation of high

reliability, hybrid clock oscillators produced by Vectron. Devices delivered to this specification

represent the standardized Parts, Materials and Processes (PMP) Program developed,

implemented and certified for advanced applications and extended environments.

Applications Overview. The designs represented by these products were primarily developed

for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options

imbedded within DOC207975 bridge the gap between Space and COTS hardware by providing

custom hardware with measures of mechanical, assembly and reliability assurance needed for

Military or Ruggedized COTS environments.

APPLICABLE DOCUMENTS

Specifications and Standards. The following specifications and standards form a part of this

document to the extent specified herein. The issue currently in effect on the date of quotation

will be the product baseline, unless otherwise specified. In the event of conflict between the

texts of any references cited herein, the text of this document shall take precedence.

Military

MIL-PRF-55310

MIL-PRF-38534

Standards

MIL-STD-202

MIL-STD-883

QSP-91502

Other

DOC207984

QSP-90100

DOC011627

DOC203982

1.2

2.1

Oscillators, Crystal Controlled, General Specification For

Hybrid Microcircuits, General Specification For

Test Method Standard, Electronic and Electrical Component Parts

Test Methods and Procedures for Microelectronics

Procedure for Electrostatic Discharge Precautions

Test Specification, Hybrid Clock, Hi-Rel Standard, Sine Output

Quality Systems Manual, Vectron

Identification Common Documents, Materials and Processes, Hi-Rel XO

DPA Specification

3.1

GENERAL REQUIREMENTS

Classification. All devices delivered to this specification are of hybrid technology conforming

to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent

specification, options are imbedded within it to also produce Class B, Engineering Model and

Ruggedized COTS devices. Devices carry a Class 2 ESDS classification per MIL-PRF-38534.

Item Identification. Unique model number series are utilized to identify device package

configurations as listed in Table 1.

3.2

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

MICROCHIP CONFIDENTIAL

DOC207975

3.3

Absolute Maximum Ratings.

a. Supply Voltage Range (V

b. Storage Temperature Range (T

STG

c. Junction Temperature (T

d. Lead Temperature (soldering, 10 seconds):

0Vdc to Vcc +2.0Vdc

-65°C to +125°C

+200°C

+300°C

3.4

3.4.1

Design, Parts, Materials and Processes, Assembly, Inspection and Test.

Design. The ruggedized designs implemented for these devices are proven in military and

space applications under extreme environments. Designs utilize 4-point crystal mounting in

combination with Established Reliability (MIL-ER) components where possible. When

specified, radiation hardening up to 100krad (Si) (RHA level R) is met by utilizing swept

quartz and active device types that have passed testing to that level.

3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting

passive chip component values to offset component tolerances, there will not be fundamental

changes to the design or assembly or parts, materials and processes after first product delivery

of that item without written approval from the procuring activity.

3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-

PRF-55310. These designs have also passed extended dynamic levels of at least:

a. Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)

b. Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms, three minute

duration in each of three mutually perpendicular directions)

c. Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)

3.4.2

Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high

reliability devices produced to this specification.

a. Gold metallization of package elements without a barrier metal.

b. Zinc chromate as a finish.

c. Cadmium, zinc, or pure tin external or internal to the device.

d. Plastic encapsulated semiconductor devices.

e. Ultrasonically cleaned electronic parts.

f. Heterojunction Bipolar Transistor (HBT) technology.

g. ‘getter’ materials

Assembly. Manufacturing utilizes standardized procedures, processes and verification methods

to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices. MIL-PRF-

38534 Group B Option 1 in-line inspection is included on radiation hardened part numbers to

further verify lot pedigree. Traceability of all components and production lots are in

accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part of

the deliverable data package. Devices are handled in accordance with Vectron document QSP-

91502 (Procedure for Electrostatic Discharge Precautions).

3.4.3

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

MICROCHIP CONFIDENTIAL

DOC207975

3.4.4

Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to

this document. Inspection conditions and standards are documented in accordance with the

Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100.

Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to

eliminate costs associated with the development/maintenance of device-specific documentation

packages while maintaining performance integrity.

Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.

Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the

same robust designs found in the other device pedigrees. They do not include the provisions of

traceability or the Class-qualified components noted in paragraphs 3.4.3 and 4.1.

DETAIL REQUIREMENTS

Components

Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the

devices. The optional use of Premium Q swept quartz can, because of its processing to remove

impurities, be specified to minimize frequency drift when operating in radiation environments.

In accordance with MIL-PRF-55310, the manufacturer has a documented crystal element

evaluation program.

Passive Components. Passive components will have the same pedigree as the die specified in

paragraph 7.1. When required, Established Reliability (ER) failure level R minimum passive

components are procured from QPL suppliers. Lot evaluations are in accordance with MIL-

PRF-38534 or Enhanced Element Evaluation as specified in Table 8. When used, inductors

may be open construction and may use up to 47-gauge wire.

Class S Active Devices. Active Devices are procured from wafer lots that have passed MIL-

PRF-38534 Lot Acceptance Tests for Class K devices. When optionally specified, further

testing in accordance with MIL-PRF-55310 and MIL-PRF-38534 is performed for Enhanced

Element Evaluation as specified in Tables 6 and 7. All active devices are acceptable for use in

environments of up to 300 krad (Si) total dose by Radiation Lot Acceptance Testing of the

individual components. In addition, bipolar semiconductors are considered insensitive to

Single Event Effects.

3.4.5

3.4.6

3.4.7

4.1

4.1.1

4.1.2

4.1.3

4.1.3.1 Class B Active Devices. When specified, active devices assembled into DOC207975 Design

Pedigree letters “B” and “C” devices (¶ 5.2a) are procured from wafer lots that have passed

MIL-PRF-55310 element evaluations for Class B devices.

4.1.4

Packages. Packages are procured that meet the construction, lead materials and finishes as

specified in MIL-PRF-55310. Package lots are up screened in accordance with the

requirements of MIL-PRF-38534 as applicable. Vectron will not perform Salt Spray testing as

UNSPECIFIED TOLERANCES

SIZE

CODE IDENT NO.

DWG NO.

REV.

SHEET

00136

N/A

MICROCHIP CONFIDENTIAL

DOC207975

part of MIL-PRF-55310 Group C/Qualification or MIL-PRF-38534 Package Element

Evaluation.

4.1.5

Traceability and Homogeneity. All design pedigrees except option D have active device lots

that are homogenous and traceable to the manufacturer’s individual wafer; all other elements

and materials are traceable to their manufacturer and incoming inspection lots. Design

pedigrees E, R, V and X have homogenous material. In addition, swept quartz crystals are

traceable to the quartz bar and the processing details of the autoclave lot, as applicable.

Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and

passive devices with Enhanced Element Evaluation as listed in Table 6 and 7 shall be

implemented for the highest reliability preference.

Mechanical.

Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a

corresponding package style. Mechanical Outline information of each package style is found in

the referenced Figure.

Thermal Characteristics. The worst-case thermal characteristics of each package style and

active device are found in Table 4.

Electrical.

Input Power. Devices are designed for standard +3.3V, +5.0V or +12V dc operation, ±5%.

Current is measured at maximum rated operating Voltage.

Temperature Range. Operating range is -55°C to +125°C.

Frequency Tolerance. Initial accuracy at +23°C is ±15 ppm maximum. Frequency-Temperature

Stability is ±50 ppm maximum from +23°C reference. Frequency-Voltage Tolerance is ±4 ppm

maximum.

Frequency Aging. Aging limits, and when tested in accordance with MIL-PRF-55310 Group B

inspection, shall not exceed ±1.5 ppm the first 30 days, ±5 ppm Year 1 and ±2 ppm per year

thereafter.

4.1.6

4.2

4.2.1

4.2.2

4.3

4.3.1

4.3.2

4.3.3

4.3.4

4.3.4.1 Frequency Aging Duration Option. By customer request, the Aging test may be terminated

after 15 days if the measured aging rate is less than half of the specified aging rate. This is a

common method of expediting 30-Day Aging without incurring risk to the hardware and used

quite successfully for numerous customers. It is based on the ‘least squares fit’ determinations

of MIL-PRF-55310 paragraph 4.8.35. The ‘half the time/half the spec’ limit is generally

conservative as roughly 2/3 of a unit’s Aging deviation occurs within that period of time.

Vectron’s automated aging systems take about 6 data points per day, so a lot of data is

available to do very accurate projections, much more data than what is required by MIL-PRF-

55310. The delivered data would include the Aging plots projected to 30 days. If the units

SIZE

CODE IDENT NO.

UNSPECIFIED TOLERANCES

DWG NO.

REV.

SHEET

00136

N/A

MICROCHIP CONFIDENTIAL

DOC207975

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