REV
A
DESCRIPTION
NIR-75933
DATE
10/3/19
PREP
LT
APPD
DF/SM
Oscillator Specification, Hybrid Clock
For
MOUNT HOLLY SPRINGS, PA 17065
THE RECORD OF APPROVAL FOR THIS
DOCUMENT IS MAINTAINED ELECTRONICALLY
WITHIN THE ERP SYSTEM
Hi-Rel Standard, Sinewave Output
CODE IDENT NO
SIZE
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DOC207975
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UNSPECIFIED TOLERANCES: N/A
SHEET 1 0F 21
MICROCHIP CONFIDENTIAL
1.
1.1
SCOPE
General. This specification defines the design, assembly and functional evaluation of high
reliability, hybrid clock oscillators produced by Vectron. Devices delivered to this specification
represent the standardized Parts, Materials and Processes (PMP) Program developed,
implemented and certified for advanced applications and extended environments.
Applications Overview. The designs represented by these products were primarily developed
for the MIL-Aerospace community. The lesser Design Pedigrees and Screening Options
imbedded within DOC207975 bridge the gap between Space and COTS hardware by providing
custom hardware with measures of mechanical, assembly and reliability assurance needed for
Military or Ruggedized COTS environments.
APPLICABLE DOCUMENTS
Specifications and Standards. The following specifications and standards form a part of this
document to the extent specified herein. The issue currently in effect on the date of quotation
will be the product baseline, unless otherwise specified. In the event of conflict between the
texts of any references cited herein, the text of this document shall take precedence.
Military
MIL-PRF-55310
MIL-PRF-38534
Standards
MIL-STD-202
MIL-STD-883
QSP-91502
Other
DOC207984
QSP-90100
DOC011627
DOC203982
1.2
2.
2.1
Oscillators, Crystal Controlled, General Specification For
Hybrid Microcircuits, General Specification For
Test Method Standard, Electronic and Electrical Component Parts
Test Methods and Procedures for Microelectronics
Procedure for Electrostatic Discharge Precautions
Test Specification, Hybrid Clock, Hi-Rel Standard, Sine Output
Quality Systems Manual, Vectron
Identification Common Documents, Materials and Processes, Hi-Rel XO
DPA Specification
3.
3.1
GENERAL REQUIREMENTS
Classification. All devices delivered to this specification are of hybrid technology conforming
to Type 1, Class 2 of MIL-PRF-55310. Primarily developed as a Class S equivalent
specification, options are imbedded within it to also produce Class B, Engineering Model and
Ruggedized COTS devices. Devices carry a Class 2 ESDS classification per MIL-PRF-38534.
Item Identification. Unique model number series are utilized to identify device package
configurations as listed in Table 1.
3.2
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3.3
Absolute Maximum Ratings.
a. Supply Voltage Range (V
CC
):
b. Storage Temperature Range (T
STG
):
c. Junction Temperature (T
J
):
d. Lead Temperature (soldering, 10 seconds):
0Vdc to Vcc +2.0Vdc
-65°C to +125°C
+200°C
+300°C
3.4
3.4.1
Design, Parts, Materials and Processes, Assembly, Inspection and Test.
Design. The ruggedized designs implemented for these devices are proven in military and
space applications under extreme environments. Designs utilize 4-point crystal mounting in
combination with Established Reliability (MIL-ER) components where possible. When
specified, radiation hardening up to 100krad (Si) (RHA level R) is met by utilizing swept
quartz and active device types that have passed testing to that level.
3.4.1.1 Design and Configuration Stability. Barring changes to improve performance by reselecting
passive chip component values to offset component tolerances, there will not be fundamental
changes to the design or assembly or parts, materials and processes after first product delivery
of that item without written approval from the procuring activity.
3.4.1.2 Environmental Integrity. Designs have passed the environmental qualification levels of MIL-
PRF-55310. These designs have also passed extended dynamic levels of at least:
a. Sine Vibration: MIL-STD-202, Method 204, Condition G (30g pk.)
b. Random Vibration: MIL-STD-202, Method 214, Condition II-J (43.92g rms, three minute
duration in each of three mutually perpendicular directions)
c. Mechanical Shock: MIL-STD-202, Method 213, Condition F (1500g, 0.5ms)
3.4.2
Prohibited Parts, Materials and Processes. The items listed are prohibited for use in high
reliability devices produced to this specification.
a. Gold metallization of package elements without a barrier metal.
b. Zinc chromate as a finish.
c. Cadmium, zinc, or pure tin external or internal to the device.
d. Plastic encapsulated semiconductor devices.
e. Ultrasonically cleaned electronic parts.
f. Heterojunction Bipolar Transistor (HBT) technology.
g. ‘getter’ materials
Assembly. Manufacturing utilizes standardized procedures, processes and verification methods
to produce MIL-PRF-55310 Class S / MIL-PRF-38534 Class K equivalent devices. MIL-PRF-
38534 Group B Option 1 in-line inspection is included on radiation hardened part numbers to
further verify lot pedigree. Traceability of all components and production lots are in
accordance with MIL-PRF-38534, as a minimum. Tabulated records are provided as a part of
the deliverable data package. Devices are handled in accordance with Vectron document QSP-
91502 (Procedure for Electrostatic Discharge Precautions).
3.4.3
SIZE
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3.4.4
Inspection. The inspection requirements of MIL-PRF-55310 apply to all devices delivered to
this document. Inspection conditions and standards are documented in accordance with the
Quality Assurance, ISO-9001 and AS9100 derived, System of QSP-90100.
Test. The Screening test matrix of Table 5 is tailored for selectable-combination testing to
eliminate costs associated with the development/maintenance of device-specific documentation
packages while maintaining performance integrity.
Marking. Device marking shall be in accordance with the requirements of MIL-PRF-55310.
Ruggedized COTS Design Implementation. Design Pedigree “D” devices (see ¶ 5.2) use the
same robust designs found in the other device pedigrees. They do not include the provisions of
traceability or the Class-qualified components noted in paragraphs 3.4.3 and 4.1.
DETAIL REQUIREMENTS
Components
Crystals. Cultured quartz crystal resonators are used to provide the selected frequency for the
devices. The optional use of Premium Q swept quartz can, because of its processing to remove
impurities, be specified to minimize frequency drift when operating in radiation environments.
In accordance with MIL-PRF-55310, the manufacturer has a documented crystal element
evaluation program.
Passive Components. Passive components will have the same pedigree as the die specified in
paragraph 7.1. When required, Established Reliability (ER) failure level R minimum passive
components are procured from QPL suppliers. Lot evaluations are in accordance with MIL-
PRF-38534 or Enhanced Element Evaluation as specified in Table 8. When used, inductors
may be open construction and may use up to 47-gauge wire.
Class S Active Devices. Active Devices are procured from wafer lots that have passed MIL-
PRF-38534 Lot Acceptance Tests for Class K devices. When optionally specified, further
testing in accordance with MIL-PRF-55310 and MIL-PRF-38534 is performed for Enhanced
Element Evaluation as specified in Tables 6 and 7. All active devices are acceptable for use in
environments of up to 300 krad (Si) total dose by Radiation Lot Acceptance Testing of the
individual components. In addition, bipolar semiconductors are considered insensitive to
Single Event Effects.
3.4.5
3.4.6
3.4.7
4.
4.1
4.1.1
4.1.2
4.1.3
4.1.3.1 Class B Active Devices. When specified, active devices assembled into DOC207975 Design
Pedigree letters “B” and “C” devices (¶ 5.2a) are procured from wafer lots that have passed
MIL-PRF-55310 element evaluations for Class B devices.
4.1.4
Packages. Packages are procured that meet the construction, lead materials and finishes as
specified in MIL-PRF-55310. Package lots are up screened in accordance with the
requirements of MIL-PRF-38534 as applicable. Vectron will not perform Salt Spray testing as
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part of MIL-PRF-55310 Group C/Qualification or MIL-PRF-38534 Package Element
Evaluation.
4.1.5
Traceability and Homogeneity. All design pedigrees except option D have active device lots
that are homogenous and traceable to the manufacturer’s individual wafer; all other elements
and materials are traceable to their manufacturer and incoming inspection lots. Design
pedigrees E, R, V and X have homogenous material. In addition, swept quartz crystals are
traceable to the quartz bar and the processing details of the autoclave lot, as applicable.
Enhanced Element Evaluation. When Design Pedigree Option “E” is specified, active and
passive devices with Enhanced Element Evaluation as listed in Table 6 and 7 shall be
implemented for the highest reliability preference.
Mechanical.
Package Outline. Table 1 links each Hi-Rel Standard Model Number of this specification to a
corresponding package style. Mechanical Outline information of each package style is found in
the referenced Figure.
Thermal Characteristics. The worst-case thermal characteristics of each package style and
active device are found in Table 4.
Electrical.
Input Power. Devices are designed for standard +3.3V, +5.0V or +12V dc operation, ±5%.
Current is measured at maximum rated operating Voltage.
Temperature Range. Operating range is -55°C to +125°C.
Frequency Tolerance. Initial accuracy at +23°C is ±15 ppm maximum. Frequency-Temperature
Stability is ±50 ppm maximum from +23°C reference. Frequency-Voltage Tolerance is ±4 ppm
maximum.
Frequency Aging. Aging limits, and when tested in accordance with MIL-PRF-55310 Group B
inspection, shall not exceed ±1.5 ppm the first 30 days, ±5 ppm Year 1 and ±2 ppm per year
thereafter.
4.1.6
4.2
4.2.1
4.2.2
4.3
4.3.1
4.3.2
4.3.3
4.3.4
4.3.4.1 Frequency Aging Duration Option. By customer request, the Aging test may be terminated
after 15 days if the measured aging rate is less than half of the specified aging rate. This is a
common method of expediting 30-Day Aging without incurring risk to the hardware and used
quite successfully for numerous customers. It is based on the ‘least squares fit’ determinations
of MIL-PRF-55310 paragraph 4.8.35. The ‘half the time/half the spec’ limit is generally
conservative as roughly 2/3 of a unit’s Aging deviation occurs within that period of time.
Vectron’s automated aging systems take about 6 data points per day, so a lot of data is
available to do very accurate projections, much more data than what is required by MIL-PRF-
55310. The delivered data would include the Aging plots projected to 30 days. If the units
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