5591S 210 MM X 300 MM 1.0 MM datasheet, PDF

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5591S 210 MM X 300 MM 1.0 MM: Descriptiontherm pad 5591s 210X300mm 1.0mm; CategoryThermal management products; File Size102KB，3 Pages; Manufacturer3M; Websitehttp://3M.com/esd; Environmental Compliance

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5591S 210 MM X 300 MM 1.0 MM Overview

therm pad 5591s 210X300mm 1.0mm

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Technical Data | October 2016

3M™ Thermally Conductive Silicone Interface Pad 5591

3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5591 is designed to provide a preferential heat transfer path

between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5591 consists

of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles,

which helps provides enhanced thermal conductivity and excellent electrical insulation performance.

Product Description

Key Features

•

Very good softness and conformability even to non-flat surfaces

Good thermal conductivity

Good electrical insulation properties

Compression relaxation properties help reduce pressure to electric components

Slight tack allows pre-assembly

Good wettability for improved and lower thermal resistance

Product Construction/Material Description

Note:

3M™ Thermally Conductive Silicone Interface Pad 5591

Property

Color

Base resin

Thickness

Primary Filler Type

Product Liner

The following technical information and data should be considered representative or typical only and should not be used for

specification purposes.

Value

White

Silicone

0.5 – 3.0mm*

Ceramic

PET Film Liners

* Standard thickness range. Custom thickness options available up to 10mm. Contact your local 3M representative for more

information.

3M™ Thermally Conductive Silicone Interface Pad 5591

PET Liner

Filled Silicone Elastomer

PET Liner

Applications

•

Integrated chip (IC) packaging heat conduction

Heat sink interface

Chip on film (COF) heat conduction

LED board thermal interface material (TIM)

HDTV integrated chip (IC)

General gap filling in electronic device

3M™ Thermally Conductive Silicone Interface Pad 5591

Application Techniques

Note:

Be sure to read and follow the manufacturers’ precautions and directions when using solvents.

Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance.

A clean surface can improve the thermal performance of an application.

•

Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface

contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often

contain oily components. Allow the surface to dry for several minutes before applying the thermal pad. More

aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier

contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as

described above.

•

Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger

pressure to help reduce the potential for air entrapment under the thermal pad during its application.

•

Remove the release liner before application.

•

Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces

with the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts

are not flat. Flexible substrates can be assembled to rigid or flexible parts with much less concern about air

entrapment because one of the flexible substrate can conform to the other substrates during application.

Typical Physical Properties and Performance Characteristics

Note:

The following technical information and data should be considered representative or typical only and should not be used for

specification purposes.

Final product specifications and testing methods will be outlined in the products Certificate of Analysis

(COA) that is provided once the product is approved by 3M for general commercialization and development work is completed.

3M™ Thermally Conductive Silicone Interface Pad 5591

Property

Thermal Conductivity (W/m-K)

Density (g/cm

, @ 25°C)

Operating Temperature Range

Hardness Shore 00

Dielectric Breakdown

Volume Resistivity

Method

ASTM D5470

ASTM D6111

3M test method

Modified ASTM D2240

Modified ASTM D149 (3M test method)

ASTM D257

Value

1.0 W/m-K

2.0

-50°C to 125°C

10 ~ 15

8 KV/mm

2 x 10

Ohms

Methods listed as ASTM are tested in accordance with the ASTM method noted

Thermal K without permanent film is 5 W/m-K (based on testing of 3M TCSIP 5591). Effective thermal K and thermal resistance will be somewhat

reduced with the addition of the polymeric film of the 3M TCSIP 5591S constructions.

Storage and Shelf Life

The shelf life of

3M™ Thermally Conductive Silicone Interface Pads 5591

is 12 months from the date of manufacture

when stored in the original packaging materials and stored at 21°C (70°F) and 50% relative humidity.

Certificate of Analysis (COA)

The 3M Certificate of Analysis (COA) for this product is established when the product is commercially

available from 3M. The commercially available product will have a COA specification established. The COA

contains the 3M specifications and test methods for the products performance limits that the product will be

supplied against. The 3M product is supplied to 3M COA test specifications and the COA test methods.

Contact your local 3M representative for this product’s COA.

This technical data sheet may contain preliminary data and may not match the COA specification limits

and/or test methods that may be used for COA purposes.

Final product specifications and testing methods will be outlined in the products Certificate of Analysis

(COA) that is shipped with the commercialized product.

3M™ Thermally Conductive Silicone Interface Pad 5591

Safety Data Sheet:

Consult Safety Data Sheet before use.

Regulatory:

For regulatory information about this product, contact your 3M representative.

Technical Information:

The technical information, recommendations and other statements contained in this document are based

upon tests or experience that 3M believes are reliable, but the accuracy or completeness of such information is not guaranteed.

Product Use:

Many factors beyond 3M’s control and uniquely within user’s knowledge and control can affect the use and

performance of a 3M product in a particular application Given the variety of factors that can affect the use and performance of a 3M

product, user is solely responsible for evaluating the 3M product and determining whether it is fit for a particular purpose and

suitable for user’s method of application.

Warranty, Limited Remedy, and Disclaimer:

Unless an additional warranty is specifically stated on the applicable 3M product

packaging or product literature, 3M warrants that each 3M product meets the applicable 3M product specification at the time 3M

ships the product. 3M MAKES NO OTHER WARRANTIES OR CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT

LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR

ANY IMPLIED WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. If the

3M Product does not conform to this warranty, then the sole and exclusive remedy is, at 3M’s option, replacement of the 3M

product or refund of the purchase price.

Limitation of Liability:

Except where prohibited by law, 3M will not be liable for any loss or damage arising from the 3M product,

whether direct, indirect, special, incidental or consequential, regardless of the legal theory asserted, including warranty, contract,

negligence or strict liability.

Electronics Materials Solutions Division

3M Center, Building 224-3N-11

St. Paul, MN 55144-1000

1-800-251-8634 phone

651-778-4244 fax

www.3M.com/electronics

3M is a trademark of 3M Company.

Please recycle.

60-5002-0960-0

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