Technical Data | October 2016
3M™ Thermally Conductive Silicone Interface Pad 5591
3M™ Thermally Conductive Silicone Interface Pad (TCSIP) 5591 is designed to provide a preferential heat transfer path
between heat generating components and heat sinks, heat spreaders or other cooling devices. 3M TCSIP 5591 consists
of a highly conformable and slightly tacky silicone elastomer sheet filled with thermally conductive ceramic particles,
which helps provides enhanced thermal conductivity and excellent electrical insulation performance.
Product Description
Key Features
•
•
•
•
•
•
Very good softness and conformability even to non-flat surfaces
Good thermal conductivity
Good electrical insulation properties
Compression relaxation properties help reduce pressure to electric components
Slight tack allows pre-assembly
Good wettability for improved and lower thermal resistance
Product Construction/Material Description
Note:
3M™ Thermally Conductive Silicone Interface Pad 5591
Property
Color
Base resin
Thickness
Primary Filler Type
Product Liner
The following technical information and data should be considered representative or typical only and should not be used for
specification purposes.
Value
White
Silicone
0.5 – 3.0mm*
Ceramic
PET Film Liners
* Standard thickness range. Custom thickness options available up to 10mm. Contact your local 3M representative for more
information.
3M™ Thermally Conductive Silicone Interface Pad 5591
PET Liner
Filled Silicone Elastomer
PET Liner
Applications
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•
•
•
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Integrated chip (IC) packaging heat conduction
Heat sink interface
Chip on film (COF) heat conduction
LED board thermal interface material (TIM)
HDTV integrated chip (IC)
General gap filling in electronic device
3M™ Thermally Conductive Silicone Interface Pad 5591
Application Techniques
Note:
Be sure to read and follow the manufacturers’ precautions and directions when using solvents.
Substrate surfaces should be clean and dry prior to the thermal pad application to ensure best thermal performance.
A clean surface can improve the thermal performance of an application.
•
Isopropyl alcohol (isopropanol) applied with a lint-free wipe or swab should be adequate for removing surface
contamination such as dust or fingerprints. Do not use “denatured alcohol” or glass cleaners, which often
contain oily components. Allow the surface to dry for several minutes before applying the thermal pad. More
aggressive solvents (such as acetone, methyl ethyl ketone (MEK) or toluene) may be required to remove heavier
contamination (grease, machine oils, solder flux, etc.) but should be followed by a final isopropanol wipe as
described above.
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Apply the thermal pad to one substrate at a modest angle with the use of a squeegee, rubber roller or finger
pressure to help reduce the potential for air entrapment under the thermal pad during its application.
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Remove the release liner before application.
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Assemble the part by applying compression to the substrates to ensure a good wetting of the substrate surfaces
with the thermal pads. Rigid substrates are more difficult to assemble without air entrapment as most rigid parts
are not flat. Flexible substrates can be assembled to rigid or flexible parts with much less concern about air
entrapment because one of the flexible substrate can conform to the other substrates during application.
Typical Physical Properties and Performance Characteristics
Note:
The following technical information and data should be considered representative or typical only and should not be used for
specification purposes.
Final product specifications and testing methods will be outlined in the products Certificate of Analysis
(COA) that is provided once the product is approved by 3M for general commercialization and development work is completed.
3M™ Thermally Conductive Silicone Interface Pad 5591
Property
Thermal Conductivity (W/m-K)
b
Density (g/cm
3
, @ 25°C)
Operating Temperature Range
Hardness Shore 00
Dielectric Breakdown
Volume Resistivity
a
b
Method
a
ASTM D5470
ASTM D6111
3M test method
Modified ASTM D2240
Modified ASTM D149 (3M test method)
ASTM D257
Value
1.0 W/m-K
2.0
-50°C to 125°C
10 ~ 15
8 KV/mm
2 x 10
12
Ohms
Methods listed as ASTM are tested in accordance with the ASTM method noted
Thermal K without permanent film is 5 W/m-K (based on testing of 3M TCSIP 5591). Effective thermal K and thermal resistance will be somewhat
reduced with the addition of the polymeric film of the 3M TCSIP 5591S constructions.
Storage and Shelf Life
The shelf life of
3M™ Thermally Conductive Silicone Interface Pads 5591
is 12 months from the date of manufacture
when stored in the original packaging materials and stored at 21°C (70°F) and 50% relative humidity.
Certificate of Analysis (COA)
The 3M Certificate of Analysis (COA) for this product is established when the product is commercially
available from 3M. The commercially available product will have a COA specification established. The COA
contains the 3M specifications and test methods for the products performance limits that the product will be
supplied against. The 3M product is supplied to 3M COA test specifications and the COA test methods.
Contact your local 3M representative for this product’s COA.
This technical data sheet may contain preliminary data and may not match the COA specification limits
and/or test methods that may be used for COA purposes.
Final product specifications and testing methods will be outlined in the products Certificate of Analysis
(COA) that is shipped with the commercialized product.
3M™ Thermally Conductive Silicone Interface Pad 5591
Safety Data Sheet:
Consult Safety Data Sheet before use.
Regulatory:
For regulatory information about this product, contact your 3M representative.
Technical Information:
The technical information, recommendations and other statements contained in this document are based
upon tests or experience that 3M believes are reliable, but the accuracy or completeness of such information is not guaranteed.
Product Use:
Many factors beyond 3M’s control and uniquely within user’s knowledge and control can affect the use and
performance of a 3M product in a particular application Given the variety of factors that can affect the use and performance of a 3M
product, user is solely responsible for evaluating the 3M product and determining whether it is fit for a particular purpose and
suitable for user’s method of application.
Warranty, Limited Remedy, and Disclaimer:
Unless an additional warranty is specifically stated on the applicable 3M product
packaging or product literature, 3M warrants that each 3M product meets the applicable 3M product specification at the time 3M
ships the product. 3M MAKES NO OTHER WARRANTIES OR CONDITIONS, EXPRESS OR IMPLIED, INCLUDING, BUT NOT
LIMITED TO, ANY IMPLIED WARRANTY OR CONDITION OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR
ANY IMPLIED WARRANTY OR CONDITION ARISING OUT OF A COURSE OF DEALING, CUSTOM OR USAGE OF TRADE. If the
3M Product does not conform to this warranty, then the sole and exclusive remedy is, at 3M’s option, replacement of the 3M
product or refund of the purchase price.
Limitation of Liability:
Except where prohibited by law, 3M will not be liable for any loss or damage arising from the 3M product,
whether direct, indirect, special, incidental or consequential, regardless of the legal theory asserted, including warranty, contract,
negligence or strict liability.
Electronics Materials Solutions Division
3M Center, Building 224-3N-11
St. Paul, MN 55144-1000
1-800-251-8634 phone
651-778-4244 fax
www.3M.com/electronics
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